Abstract: A flexible printed circuit with raised contacts is presented. In accordance with this invention, a flexible circuit is disposed on a substrate. The substrate includes a pattern comprised of a plurality of raised features. Similarly, the flexible circuit has a corresponding pattern comprised of a plurality of contact pads. The contact pads are disposed on the raised features to form the raised contacts. The raised contacts perfect registration between the contact pads and the contact surfaces of a mating electrical component (e.g., a surface mount integrated circuit) when a pressure connection system is employed.