Patents by Inventor Gary A. Patrizi

Gary A. Patrizi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads
    Patent number: 8597985
    Abstract: In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predetermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.
    Type: Grant
    Filed: February 1, 2012
    Date of Patent: December 3, 2013
    Assignee: Sandia Corporation
    Inventors: Rajen Chanchani, Christopher Nordquist, Roy H. Olsson, Tracy C. Peterson, Randy J. Shul, Catalina Ahlers, Thomas A. Plut, Gary A. Patrizi