Patents by Inventor Gary A. Schuster

Gary A. Schuster has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper-nickel-silicon two phase quench substrate
    Patent number: 7291231
    Abstract: A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a discontinuous network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.
    Type: Grant
    Filed: August 21, 2003
    Date of Patent: November 6, 2007
    Assignee: Metglas, Inc.
    Inventors: Shinya Myojin, Richard L. Bye, Nicholes J. DeCristofaro, David W. Millure, Gary A. Schuster
  • Copper-nickel-silicon two phase quench substrate
    Publication number: 20040043246
    Abstract: A copper-nickel-silicon quench substrate rapidly solidifies molten alloy into microcrystalline or amorphous strip. The substrate is composed of a thermally conducting alloy. It has a two-phase microstructure with copper rich regions surrounded by a discontinuous network of nickel silicide phases. The microstructure is substantially homogeneous. Casting of strip is accomplished with minimal surface degradation as a function of casting time. The quantity of material cast during each run is improved without the toxicity encountered with copper-beryllium substrates.
    Type: Application
    Filed: August 21, 2003
    Publication date: March 4, 2004
    Inventors: Shinya Myojin, Richard L. Bye, Nicholes J. DeCristofaro, David W. Millure, Gary A. Schuster