Patents by Inventor Gary Alan Johansson

Gary Alan Johansson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flowable compositions and use in filling vias and plated through-holes
    Patent number: 6794040
    Abstract: A printed circuit board or card having plated through-holes is provided wherein plated through-holes are filled with a photocured polymerized composition. Also, a method for fabricating these printed circuit boards or cards is provided. Also provided are compositions and methods of providing carrier films coated with the compositions for use in filling vias or plated through-holes.
    Type: Grant
    Filed: August 5, 2002
    Date of Patent: September 21, 2004
    Assignee: International Business Machines Corporation
    Inventors: Gary Alan Johansson, Konstantinos I. Papathomas
  • Die attachment with reduced adhesive bleed-out
    Patent number: 6734569
    Abstract: An organic chip carrier having metallic circuitry and wire bond pads thereon is bonded to an integrated circuit die by a photocurable adhesive and is electrically connected therewith by wire bonding to the wire bond pads.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: May 11, 2004
    Assignee: International Business Machines Corporation
    Inventors: Bernd Karl Appelt, Gary Alan Johansson, Konstantinos I. Papathomas
  • Die attachment with reduced adhesive bleed-out
    Publication number: 20030119226
    Abstract: An organic chip carrier having metallic circuitry and wire bond pads thereon is bonded to an integrated circuit die by a photocurable adhesive and is electrically connected therewith by wire bonding to the wire bond pads.
    Type: Application
    Filed: December 12, 2002
    Publication date: June 26, 2003
    Applicant: International Business Machines Corporation
    Inventors: Bernd Karl Appelt, Gary Alan Johansson, Konstantinos I. Papathomas
  • Flowable compositions and use in filling vias and plated through-holes
    Publication number: 20030064212
    Abstract: A printed circuit board or card having plated through-holes is provided wherein plated through-holes are filled with a photocured polymerized composition. Also, a method for fabricating these printed circuit boards or cards is provided. Also provided are compositions and methods of providing carrier films coated with the compositions for use in filling vias or plated through-holes.
    Type: Application
    Filed: August 5, 2002
    Publication date: April 3, 2003
    Inventors: Gary Alan Johansson, Konstantinos I. Papathomas
  • Process for filling apertures in a circuit board or chip carrier
    Patent number: 6534245
    Abstract: Apertures in a circuit board or chip carrier are filled with a cured photosensitive dielectric material by substantially filling the apertures in the circuit board or chip carrier and applying a layer of a thickness to the circuit board or chip carrier with a positive photosensitive dielectric material, exposing the photosensitive dielectric material to actinic radiation in such a way as to leave material located in apertures unexposed to the radiation; baking the structure so as to harden the unexposed photosensitive dielectric material and developing the exposed dielectric material in order to remove it leaving behind cured photosensitive dielectric material in the apertures.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: March 18, 2003
    Assignee: International Business Machines Corporation
    Inventors: Bernd Karl Appelt, Gary Alan Johansson, Konstantinos I. Papathomas
  • Flowable compositions and use in filling vias and plated through-holes
    Patent number: 6427325
    Abstract: A printed circuit board or card having plated through-holes is provided wherein plated through-holes are filled with a photocured polymerized composition. Also, a method for fabricating these printed circuit boards or cards is provided. Also provided are compositions and methods of providing carrier films coated with the compositions for use in filling vias or plated through-holes.
    Type: Grant
    Filed: April 6, 2000
    Date of Patent: August 6, 2002
    Assignee: International Business Machines Corporation
    Inventors: Gary Alan Johansson, Konstantinos I. Papathomas
  • Process for filling apertures in a circuit board or chip carrier
    Publication number: 20010008747
    Abstract: Apertures in a circuit board or chip carrier are filled with a cured photosensitive dielectric material by substantially filling the apertures in the circuit board or chip carrier and applying a layer of a thickness to the circuit board or chip carrier with a positive photosensitive dielectric material, exposing the photosensitive dielectric material to actinic radiation in such a way as to leave material located in apertures unexposed to the radiation; baking the structure so as to harden the unexposed photosensitive dielectric material and developing the exposed dielectric material in order to remove it leaving behind cured photosensitive dielectric material in the apertures.
    Type: Application
    Filed: February 21, 2001
    Publication date: July 19, 2001
    Applicant: International Business Machines Corporation
    Inventors: Bernd Karl Appelt, Gary Alan Johansson, Konstantinos I. Papathomas
  • Process for filling apertures in a circuit board or chip carrier
    Patent number: 6225031
    Abstract: Apertures in a circuit board or chip carrier are filled with a cured photosensitive dielectric material by substantially filling the apertures in the circuit board or chip carrier and applying a layer of a thickness to the circuit board or chip carrier with a positive photosensitive dielectric material, exposing the photosensitive dielectric material to actinic radiation in such a way as to leave material located in apertures unexposed to the radiation; baking the structure so as to harden the unexposed photosensitive dielectric material and developing the exposed dielectric material in order to remove it leaving behind cured photosensitive dielectric material in the apertures.
    Type: Grant
    Filed: November 9, 1998
    Date of Patent: May 1, 2001
    Assignee: International Business Machines Corporation
    Inventors: Bernd Karl Appelt, Gary Alan Johansson, Konstantinos I. Papathomas
  • Flowable compositions and use in filling vias and plated through-holes
    Patent number: 6090474
    Abstract: A printed circuit board or card having plated through-holes is provided wherein plated through-holes are filled with a photocured polymerized composition. Also, a method for fabricating these printed circuit boards or cards is provided. Also provided are compositions and methods of providing carrier films coated with the compositions for use in filling vias or plated through-holes.
    Type: Grant
    Filed: September 1, 1998
    Date of Patent: July 18, 2000
    Assignee: International Business Machines Corporation
    Inventors: Gary Alan Johansson, Konstantinos I. Papathomas