Patents by Inventor Gary Aruda

Gary Aruda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composition and method for electroless plating of non-conductive substrates
    Publication number: 20040234695
    Abstract: Compositions and methods for coating and plating a non-conductive substrate, the substrate having a surface, comprising coating the surface with a binding solution composition, the binding solution composition comprising between approximately 30% by weight and approximately 70% by weight of a binding solution, between approximately 2% by weight and approximately 10% by weight of carbon black powder, between approximately 25% by weight and approximately 50% by weight of aluminum powder, cleaning the coated surface, and immersing the cleaned, coated surface into a plating bath, the plating bath comprising between approximately 5% by volume and approximately 20% by volume hydrofluoric acid, between approximately 4% by volume and approximately 6% by volume copper sulfate, and water.
    Type: Application
    Filed: June 22, 2004
    Publication date: November 25, 2004
    Inventors: Norman P. Trahan, Brian Keough, Gary Aruda, Tobias M. Lederberg
  • Composition and method for electroless plating of non-conductive substrates
    Patent number: 6776826
    Abstract: Compositions and methods for coating and plating a non-conductive substrate, the substrate having a surface, comprising coating the surface with a binding solution composition, the binding solution composition comprising between approximately 30% by weight and approximately 70% by weight of a binding solution, between approximately 2% by weight and approximately 10% by weight of carbon black powder, between approximately 25% by weight and approximately 50% by weight of aluminum powder, cleaning the coated surface, and immersing the cleaned, coated surface into a plating bath, the plating bath comprising between approximately 5% by volume and approximately 20% by volume hydrofluoric acid, between approximately 4% by volume and approximately 6% by volume copper sulfate, and water.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: August 17, 2004
    Assignee: GBN Technologies, Inc.
    Inventors: Norman P. Trahan, Brian Keough, Gary Aruda, by Tobias M. Lederberg