Abstract: A monitor system and method for characterizing semiconductor processes including ion implantation processes is provided. The system includes a test wafer which has a plurality of sensors formed on its surface. The test wafer may be loaded into the process chamber of a process system and exposed, for example, to an implant. During implantation, electrical signals may be transmitted from the sensor to circuitry external of the chamber to evaluate a variety of ion beam and/or wafer properties. The property data may be displayed in real-time with the implant process so that processing parameters may be adjusted accordingly. The monitor system may be used, in particular, to determine properties related to beam and wafer surface charging which can provide an assessment of the efficiency of beam charge neutralization processes.

Abstract: A nozzle assembly for use with fluid jet cutting systems is disclosed which yields a lower profile, lower mass nozzle assembly, and which permits "finger-tight" assembly of the nozzle.Briefly, the assembly includes a nozzle housing, a generally tubular closure member (20) having a fluid-accommodating passageway, a collar (36) for positioning a jet-forming orifice (42) with respect to the passageway, and a sealing ring (38) retained to the tubular member by the collar to provide a high pressure seal between the tubular member and the nozzle housing.