Patents by Inventor Gary Babb

Gary Babb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7905030
    Abstract: Straight tracks are formed in a first direction on a base. The top surface of a platform is formed so as to be flat to mount a wafer having an Ori-Fla, and the platform is moved in the first direction by being engaged with the straight tracks via engagement means. A block having a flat face against which the Ori-Fla of the wafer abuts and which is parallel with the first direction is installed with a first clearance L being provided with the straight track in a second direction perpendicular to the first direction. Wafer fixing means for fixing the wafer in a state in which the wafer is mounted on the platform is provided in the platform, and a measurement device having a probe opposed to the straight track and capable of being displaced in the second direction is installed on the base with a second clearance M being provided with the block in the first direction. When a clearance between the tip end of the probe and the straight track is taken as N, the relationship of 0 ?m<L?N?100 ?m exists.
    Type: Grant
    Filed: July 12, 2001
    Date of Patent: March 15, 2011
    Assignees: Sumco Corporation, Sumco Phoenix Corporation
    Inventors: Cindy Kohanek, Gary Babb
  • Publication number: 20020189118
    Abstract: Straight tracks are formed in a first direction on a base. The top surface of a platform is formed so as to be flat to mount a wafer having an Ori-Fla, and the platform is moved in the first direction by being engaged with the straight tracks via engagement means. A block having a flat face against which the Ori-Fla of the wafer abuts and which is parallel with the first direction is installed with a first clearance L being provided with the straight track in a second direction perpendicular to the first direction. Wafer fixing means for fixing the wafer in a state in which the wafer is mounted on the platform is provided in the platform, and a measurement device having a probe opposed to the straight track and capable of being displaced in the second direction is installed on the base with a second clearance M being provided with the block in the first direction.
    Type: Application
    Filed: July 12, 2001
    Publication date: December 19, 2002
    Applicant: Mitsubishi Materials Silicon Corporation
    Inventors: Cindy Kohanek, Gary Babb