Patents by Inventor Gary Bultman
Gary Bultman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9818633Abstract: An EFEM useful for transferring wafers to and from wafer processing modules comprises an enclosure having a controlled environment therein bounded by a front wall, a back wall, first and second side walls, a top wall, and a bottom wall. The first side wall and the second side wall include two or more wafer load ports wherein each wafer load port is adapted to receive a FOUP. The front wall includes wafer ports configured to attach to respective load locks operable to allow a wafer to be transferred to a front wall cluster processing tool. The back wall includes a wafer port adapted to be in operational relationship with a back wall cluster processing tool. A robot in the EFEM enclosure is operable to transfer wafers through the wafer load ports, the first front wall wafer port, the second front wall wafer port, and the back wall wafer port.Type: GrantFiled: October 17, 2014Date of Patent: November 14, 2017Assignee: LAM RESEARCH CORPORATIONInventors: Thorsten Lill, Vahid Vahedi, Candi Kristoffersen, Andrew D. Bailey, III, Meihua Shen, Rangesh Raghavan, Gary Bultman
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Publication number: 20160111309Abstract: An EFEM useful for transferring wafers to and from wafer processing modules comprises an enclosure having a controlled environment therein bounded by a front wall, a back wall, first and second side walls, a top wall, and a bottom wall. The first side wall and the second side wall include two or more wafer load ports wherein each wafer load port is adapted to receive a FOUP. The front wall includes wafer ports configured to attach to respective load locks operable to allow a wafer to be transferred to a front wall cluster processing tool. The back wall includes a wafer port adapted to be in operational relationship with a back wall cluster processing tool. A robot in the EFEM enclosure is operable to transfer wafers through the wafer load ports, the first front wall wafer port, the second front wall wafer port, and the back wall wafer port.Type: ApplicationFiled: October 17, 2014Publication date: April 21, 2016Inventors: Thorsten Lill, Vahid Vahedi, Candi Kristoffersen, Andrew D. Bailey, III, Meihua Shen, Rangesh Raghavan, Gary Bultman
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Publication number: 20130314710Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness.Type: ApplicationFiled: August 5, 2013Publication date: November 28, 2013Applicant: KLA-TENCOR TECHNOLOGIES CORPORATIONInventors: Ady Levy, Kyle A. Brown, Rodney Smedt, Gary Bultman, Mehrdad Nikoonahad, Dan Wack, John Fielden, Ibrahim Abdul-Halim
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Patent number: 8502979Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness.Type: GrantFiled: May 9, 2012Date of Patent: August 6, 2013Assignee: KLA-Tencor Technologies Corp.Inventors: Ady Levy, Kyle A. Brown, Rodney Smedt, Gary Bultman, Mehrdad Nikoonahad, Dan Wack, John Fielden, Ibrahim Abdul-Halim
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Publication number: 20130039460Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness.Type: ApplicationFiled: May 9, 2012Publication date: February 14, 2013Applicant: KLA-TENCOR TECHNOLOGIES CORPORATIONInventors: Ady Levy, Kyle A. Brown, Rodney Smedt, Gary Bultman, Mehrdad Nikoonahad, Dan Wack, John Fielden, Ibrahim Abdul-Halim
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Patent number: 8179530Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness.Type: GrantFiled: July 5, 2010Date of Patent: May 15, 2012Assignee: KLA-Tencor Technologies Corp.Inventors: Ady Levy, Kyle A. Brown, Rodney Smedt, Gary Bultman, Mehrdad Nikoonahad, Dan Wack, John Fielden, Ibrahim Abdul-Halim
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Publication number: 20100271621Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness.Type: ApplicationFiled: July 5, 2010Publication date: October 28, 2010Applicant: KLA-TENCOR TECHNOLOGIES CORPORATIONInventors: Ady Levy, Kyle A. Brown, Rodney Smedt, Gary Bultman, Mehrdad Nikoonahad, Dan Wack, John Fielden, Ibrahim Abdul-Halim
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Patent number: 7751046Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension and overlay misregistration. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.Type: GrantFiled: March 27, 2003Date of Patent: July 6, 2010Assignee: KLA-Tencor Technologies Corp.Inventors: Ady Levy, Kyle A. Brown, Rodney Smedt, Gary Bultman, Mehrdad Nikoonahad, Dan Wack, John Fielden, Ibrahim Abdulhalim
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Patent number: 7460981Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a presence of macro and micro defects. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.Type: GrantFiled: October 26, 2004Date of Patent: December 2, 2008Assignee: KLA-Tencor Technologies Corp.Inventors: Gary Bultman, Ady Levy, Kyle A. Brown, Mehrdad Nikoonahad, Dan Wack, John Fielden
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Patent number: 7349090Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a property of a specimen prior to, during, or subsequent to lithography. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.Type: GrantFiled: September 20, 2001Date of Patent: March 25, 2008Assignee: KLA-Tencor Technologies Corp.Inventors: Dan Wack, Ady Levy, Kyle A. Brown, Gary Bultman, Mehrdad Nikoonahad, John Fielden
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Patent number: 7196782Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a thin film characteristic and an electrical property of a specimen. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.Type: GrantFiled: September 20, 2001Date of Patent: March 27, 2007Assignee: KLA-Tencor Technologies Corp.Inventors: John Fielden, Ady Levy, Kyle A. Brown, Gary Bultman, Mehrdad Nikoonahad, Dan Wack
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Patent number: 7139083Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a composition and a thickness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.Type: GrantFiled: September 20, 2001Date of Patent: November 21, 2006Assignee: KLA-Tencor Technologies Corp.Inventors: John Fielden, Ady Levy, Kyle A. Brown, Gary Bultman, Mehrdad Nikoonahad, Dan Wack
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Patent number: 7130029Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, an adhesion characteristic and a thickness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.Type: GrantFiled: September 20, 2001Date of Patent: October 31, 2006Assignee: KLA-Tencor Technologies Corp.Inventors: Dan Wack, Ady Levy, Kyle A. Brown, Gary Bultman, Mehrdad Nikoonahad, John Fielden
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Patent number: 7106425Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a presence of defects on the specimen and a thin film characteristic of the specimen. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.Type: GrantFiled: September 20, 2001Date of Patent: September 12, 2006Assignee: KLA-Tencor Technologies Corp.Inventors: Gary Bultman, Ady Levy, Kyle A. Brown, Mehrdad Nikoonahad, Dan Wack, John Fielden
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Publication number: 20060072807Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a presence of macro and micro defects. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.Type: ApplicationFiled: October 26, 2004Publication date: April 6, 2006Inventors: Gary Bultman, Ady Levy, Kyle Brown, Mehrdad Nikoonahad, Dan Wack, John Fielden
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Patent number: 7006235Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, overlay and flatness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.Type: GrantFiled: September 20, 2001Date of Patent: February 28, 2006Assignee: KLA-Tencor Technologies Corp.Inventors: Ady Levy, Kyle A. Brown, Mehrdad Nikoonahad, Gary Bultman, Dan Wack, John Fielden
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Patent number: 6950196Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a thickness of a structure on a specimen and at least one additional property of the specimen. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.Type: GrantFiled: September 20, 2001Date of Patent: September 27, 2005Assignee: KLA-Tencor Technologies Corp.Inventors: John Fielden, Ady Levy, Kyle A. Brown, Gary Bultman, Mehrdad Nikoonahad, Dan Wack
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Patent number: 6946394Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, a characteristic of a layer formed on a specimen by a deposition process. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.Type: GrantFiled: September 20, 2001Date of Patent: September 20, 2005Assignee: KLA-Tencor TechnologiesInventors: John Fielden, Ady Levy, Kyle A. Brown, Gary Bultman, Mehrdad Nikoonahad, Dan Wack
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Patent number: 6919957Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, critical dimension, a presence of defects, and a thin film characteristic. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.Type: GrantFiled: September 20, 2001Date of Patent: July 19, 2005Assignee: KLA-Tencor Technologies Corp.Inventors: Mehrdad Nikoonahad, Ady Levy, Kyle A. Brown, Gary Bultman, Dan Wack, John Fielden
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Patent number: 6917419Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including, but not limited to, flatness, a presence of defects, and a thin film characteristic. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.Type: GrantFiled: September 20, 2001Date of Patent: July 12, 2005Assignee: KLA-Tencor Technologies Corp.Inventors: John Fielden, Ady Levy, Kyle A. Brown, Gary Bultman, Mehrdad Nikoonahad, Dan Wack