Patents by Inventor Gary C. Adler

Gary C. Adler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Matched low dielectric constant, dimensionally stable adhesive sheet
    Patent number: 5652055
    Abstract: The present invention is an improved adhesive sheet (also known as a "bond ply," "bond film," or "prepreg") material suitable for bonding together electric circuit boards and other electrical components. The adhesive sheet of the present invention comprises a combination of a porous expanded polytetrafluoroethylene (PTFE), a ceramic filler, and a thermoset resin imbibed within the porous PTFE structure. By employing a fill of less than about 60% by weight of resin, the adhesive sheet has exceptionally good performance characteristics while being vastly easier to process.
    Type: Grant
    Filed: April 7, 1995
    Date of Patent: July 29, 1997
    Assignee: W. L. Gore & Associates, Inc.
    Inventors: David R. King, Gary C. Adler, Joseph E. Korleski, Michelle M. H. Waters