Patents by Inventor Gary C. Briney

Gary C. Briney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-functional circuitry substrates and compositions and methods relating thereto
    Publication number: 20080213605
    Abstract: The invention is directed to substrates for electronic circuitry. The substrates of the invention have a first polyimide layer having a functional filler and a second polyimide layer having a functional filler. The first layer is non-identical to the second layer, and a surface of the first layer is in contact with and is directly bonded to a surface of the second layer. Filler from each layer extends into the interface between the two layers, and a plurality of covalent bonds are present between the first and second functional layers that chemically bond the two layers together to provide a reliable, predictable multifunctional substrate for electronic circuitry with improved performance relative to polyimide layers bonded together by an adhesive.
    Type: Application
    Filed: December 6, 2007
    Publication date: September 4, 2008
    Inventors: Gary C. Briney, Brian C. Auman, Christopher J. Milasincic
  • Multi-functional circuitry substrates and compositions and methods relating thereto
    Publication number: 20080182115
    Abstract: The invention is directed to substrates for electronic circuitry. The substrates of the invention have a first polyimide layer having a functional filler and a second polyimide layer having a functional filler. The first layer is non-identical to the second layer, and a surface of the first layer is in contact with and is directly bonded to a surface of the second layer. Filler from each layer extends into the interface between the two layers, and a plurality of covalent bonds are present between the first and second functional layers that chemically bond the two layers together to provide a reliable, predictable multifunctional substrate for electronic circuitry with improved performance relative to polyimide layers bonded together by an adhesive.
    Type: Application
    Filed: December 6, 2007
    Publication date: July 31, 2008
    Inventors: Gary C. Briney, Brian C. Auman, Christopher J. Milasincic
  • Development process for aqueous developable photopolymerizable elements
    Patent number: 4517281
    Abstract: An aqueous developable photopolymerizable element having improved rate of development consisting essentially of (a) an ethylenically unsaturated monomeric compound, (b) an organic acidic polymeric binder, (c) a photoinitiator or photoinitiator system and (d) at least 2% by weight based on weight of solids of an organic compound or salt of an organic compound as defined. The elements are useful as photoresists, printing plates and for preparation of proofs and litho masks.
    Type: Grant
    Filed: February 6, 1984
    Date of Patent: May 14, 1985
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Gary C. Briney, Stephen J. Fuerniss
  • Aqueous developable photopolymerizable elements
    Patent number: 4485167
    Abstract: An aqueous developable photopolymerizable element having improved rate of development consisting essentially of (a) an ethylenically unsaturated monomeric compound, (b) an organic acidic polymeric binder, (c) a photoinitiator or photoinitiator system and (d) at least 2% by weight based on weight of solids of an organic compound or salt of an organic compound as defined. The elements are useful as photoresists, printing plates and for preparation of proofs and litho masks.
    Type: Grant
    Filed: June 28, 1982
    Date of Patent: November 27, 1984
    Assignee: E. I. Du Pont de Nemours and Company
    Inventors: Gary C. Briney, Stephen J. Fuerniss