Abstract: First and second semiconductor die are mounted to first and second die pads of a lead frame disposed in a lead frame sheet. With a plurality of wire bonds, each post of a plurality of posts of the lead frame is connected to the first and second semiconductor die. Each post extends inward from opposite sides of the lead frame between the first and second die pads and is connected with a respective one of a plurality of leads of the lead frame. The first and second semiconductor die, the plurality of posts of the lead frame, and the plurality of wire bonds are encapsulated in a package. The lead frame sheet is sheared to define each lead of the plurality of leads. The plurality of posts includes first and second sets of posts extending inward from first and second opposite sides of the lead frame.

Abstract: First and second semiconductor die are mounted to first and second die pads of a lead frame disposed in a lead frame sheet. With a plurality of wire bonds, each post of a plurality of posts of the lead frame is connected to the first and second semiconductor die. Each post extends inward from opposite sides of the lead frame between the first and second die pads and is connected with a respective one of a plurality of leads of the lead frame. The first and second semiconductor die, the plurality of posts of the lead frame, and the plurality of wire bonds are encapsulated in a package. The lead frame sheet is sheared to define each lead of the plurality of leads. The plurality of posts includes first and second sets of posts extending inward from first and second opposite sides of the lead frame.

Abstract: An electronic apparatus includes a packaging enclosure, first and second die pads disposed within the packaging enclosure, first and second semiconductor die disposed on the first and second die pads, respectively, a plurality of packaging leads, each packaging lead projecting outward from the packaging enclosure, a plurality of packaging posts disposed within the packaging enclosure and extending inward from opposite sides of the packaging enclosure between the first and second die pads, each packaging post being connected with a respective one of the plurality of packaging leads, and a plurality of wire bonds disposed within the packaging enclosure. Each packaging post of the plurality of packaging posts is connected via a first wire bond of the plurality of wire bonds to the first semiconductor die and via a second wire bond of the plurality of wire bonds to the second semiconductor die.

Abstract: An electronic apparatus includes a packaging enclosure, first and second die pads disposed within the packaging enclosure, first and second semiconductor die disposed on the first and second die pads, respectively, a plurality of packaging leads, each packaging lead projecting outward from the packaging enclosure, a plurality of packaging posts disposed within the packaging enclosure and extending inward from opposite sides of the packaging enclosure between the first and second die pads, each packaging post being connected with a respective one of the plurality of packaging leads, and a plurality of wire bonds disposed within the packaging enclosure. Each packaging post of the plurality of packaging posts is connected via a first wire bond of the plurality of wire bonds to the first semiconductor die and via a second wire bond of the plurality of wire bonds to the second semiconductor die.

Abstract: A solar water heater is provided. The heater features heat control so that a maximum temperature is automatically controlled. The heater is insulated to maintain a water temperature of water stored therein for long periods of time. The heater includes an insulated lens which transmits most solar radiation incident on its top surface through the lens. An air trap is located below the lens. A heat control valve opens the air trap to surrounding air when a maximum temperature for air within the air trap is exceeded. A heat absorption plate is located below the air trap. The plate is in contact with a heat transfer liquid within a liquid space below the plate. A heat exchanger is positioned within the space and routes water in heat transfer contact with the liquid within the space, while keeping the water isolated from the liquid within the space.

Abstract: A method for packaging an acoustic wave device (10) without contaminating an active area (12) disposed on a face (14) thereof, including steps of: providing a substrate with a top (30) having conductive pads (18), bonding stud bumps (20) to a periphery (22) of the face (14) of the acoustic wave device, disposing a dam (26) onto the top (30) of the substrate and inside of the location of the conductive pads (18), aligning and connecting the stud bumps (20) to the conductive pads (18) on the top of the substrate to form electrically conductive interconnections between the acoustic wave device (10) and the substrate (16), flowing an underfill material (28) at the periphery (22) of the acoustic wave device and around the interconnections such that the underfill material (28) stops at a boundary (32) defined by the dam (26), and curing the underfill material (28) to mechanically reinforce and protectively encapsulate the interconnections.

Abstract: A lead frame package for housing an integrated circuit. A lead frame (11) having a plurality of leads (13) extending from at least three sides of the package. Lead frame (11) is formed having a first region (18), a transition region (19), and a second region (21). A distance between a heat sink (12) and the lead frame (11) may vary. The offset is chosen to compensate for a predetermined distance between the heat sink (12) and the lead frame (11) such that the lead frame (11) aligns to lead frame handling equipment. A single lead frame manufacturing setup can then be used. A slot (22) is formed in the lead frame (11) extending through the second region (21) and the transition region (19) into first area (18) providing a path for injecting an encapsulation material into a mold.

Abstract: A modular space dividing panel comprising a pair of panlike frames. Each frame has a side wall with inwardly directed flanges at the edges thereof which form a bottom wall, a pair of end edge walls, and a top wall. The frames are positioned and assembled together in facing relationship such that at least portions of the bottom walls, the end edge walls, and the top walls overlap in contacting relationship. The top walls include portions that define therebetween a substantially continuous channel that extends along an upper edge of the panel. The channel is of a size to receive communication and/or electrical wiring therein. A top cap extends along the upper edge of the panel and overlying the channel and is releasably secured to the top walls of the frames.

Abstract: A pad on which a user lies to apply pressure to selected points on the body consists of two fabric panels and a number of balls having fabric engaging tabs at diametrically opposed points. The balls are placed on one of the panels at the points of desired pressure application and then covered by the second panel. The two panels may be connected together and carry grid markings to assist in positioning of the balls.

Abstract: The invention comprises magnus tubes mounted adjacent to or imbedded in the orthogonal edges of a vehicle such as a semi-trailer, these tubes preferably being interengaged, for concomitant rotation and having a motive force such as a motor to simultaneously drive the tubes to expedite laminar flow of air around the edges of the wall in question as the vehicle moves, it being preferred that the motive force be reversible to invest the magnus tube with an additional braking force.