Abstract: Provided herein are compounds of Formula (I): and forms thereof, including compositions thereof and uses therewith for treating spinal muscular atrophy.

Abstract: A silicone-(meth) acrylate copolymer (copolymer) and methods for its preparation are provided. The copolymer may be prepared by emulsion polymerization or via other means. An emulsion formulation containing the copolymer is suitable for treating a textile.

Abstract: An Integrated Circuit (IC) package has a ferrite-dielectric shield between planar transformer coils and a semiconductor chip. The shield blocks Electro-Magnetic Interference (EMI) generated by currents in transformer coils from reaching the semiconductor chip. Multiple layers of planar transformer coils serve as primary or secondary coils and can be connected together in series or parallel using center posts and coil extensions from outer coil windings to lead-frame risers that also have external package connectors such as pins or bonding balls. The center winding of an upper transformer coil connects to the semiconductor chip on a die attach pad through a center post that fits through an opening in the shield that is over the air core center of the transformer coil. Bonding wires connect pads on the semiconductor chip to lead-frame pads on lead-frame risers that end at external package connectors.

Abstract: An Integrated Circuit (IC) package has a ferrite-dielectric shield between a planar inductor coil and a semiconductor chip. The shield blocks Electro-Magnetic Interference (EMI) generated by currents in the inductor coil from reaching the semiconductor chip. The shield has a ferrite layer surrounded by upper and lower dielectric laminate layers to prevent electrical shorts. The center end of the inductor coil connects to the semiconductor chip through a center post that fits through an opening in the shield that is over the air core center of the inductor coil. The center post can connect to a die attach pad that the semiconductor chip is mounted to. Bonding wires connect pads on the semiconductor chip to lead-frame pads on lead-frame risers that end at external package connectors. The outer end of the inductor coil connects to lead-frame outer risers also having external package connectors such as pins or bonding balls.

Abstract: A web cam device includes a camera housing, a camera disposed in the camera housing, a data cable coupled to the camera that extends from the camera housing, and a base including an aperture to receive the data cable such that the base is slideable along the data cable, where the aperture provides a sliding friction to the data cable, and where the camera is operable to be mounted on a monitor when the camera is positioned on a front of the monitor, the data cable is configured to pass through the aperture of the base, and the base is secured against the back of the monitor and held by the sliding friction of the aperture on the data cable. The camera housing can include a protrusion extending from the camera housing and is flush against the front of the monitor when the camera is mounted on the display device.

Abstract: A web cam device includes a camera housing, a camera disposed in the camera housing, a data cable coupled to the camera that extends from the camera housing, and a base including an aperture to receive the data cable such that the base is slideable along the data cable, where the aperture provides a sliding friction to the data cable, and where the camera is operable to be mounted on a monitor when the camera is positioned on a front of the monitor, the data cable is configured to pass through the aperture of the base, and the base is secured against the back of the monitor and held by the sliding friction of the aperture on the data cable. The camera housing can include a protrusion extending from the camera housing and is flush against the front of the monitor when the camera is mounted on the display device.