Abstract: A solar thermal collector includes a receptacle and a fluid conduit. The receptacle is evacuated to a subatmospheric pressure. The receptacle includes a window and a reflector facing the window. The window and the reflector are exposed to the subatmospheric pressure in the receptacle. The fluid conduit extends through the receptacle between the window and the reflector. The reflector concentrates solar radiation passing through the window onto the fluid conduit.

Abstract: Solar panels and assembled arrays thereof include a collection of relatively compact, high-capacity power units. Optical components of each power unit include a front window or surface glazing, a primary mirror, secondary mirror and receiver assembly. Primary and secondary mirrors are defined by respective perimeters, at least a portion of which may be substantially coplanar and in contact with the front window. Some primary mirrors are configured with a perimeter of alternating full and truncated sections, and are curved to a base portion forming a pilot hole therein. Receiver assembly mechanical components include an alignment tube for mating with the primary mirror's pilot hole and for housing a photovoltaic solar cell. A base plate provided adjacent to the alignment tube serves to radiate heat emitted by the solar cell, and in some embodiments an additional heat sink provides further passive cooling.

Abstract: The present invention is a contoured backpan for a solar concentrator array. The backpan has depressions integrally formed in its bottom surface for seating solar concentrator modules. The depressions, in combination connecting toughs, provide a structure which is able to support an array of solar concentrators. Optional stiffening members may be attached to fee backpan to provide additional structural rigidity, as well as to support a front panel for the array.

Abstract: A mount for a semiconductor device has a first surface with at least one contact region and a second surface. The mount has a substrate to receive the second surface of the semiconductor device and a planar element. The planar element has an aperture sized to surround the semiconductor. A first surface of the planar element is mounted to the substrate and is located to surround the semiconductor device such that the semiconductor device is aligned by the aperture. The mount further has means for mounting the semiconductor device to the substrate in an aligned position. Some embodiments include a method of making and/or using such a mount.

Abstract: The present invention is a contoured backpan for a solar concentrator array. The backpan has depressions integrally formed in its bottom surface for seating solar concentrator modules. The depressions, in combination connecting toughs, provide a structure which is able to support an array of solar concentrators. Optional stiffening members may be attached to fee backpan to provide additional structural rigidity, as well as to support a front panel for the array.

Abstract: A mount for a semiconductor device has a first surface with at least one contact region and a second surface. The mount has a substrate to receive the second surface of the semiconductor device and a planar element. The planar element has an aperture sized to surround the semiconductor. A first surface of the planar element is mounted to the substrate and is located to surround the semiconductor device such that the semiconductor device is aligned by the aperture. The mount further has means for mounting the semiconductor device to the substrate in an aligned position. Some embodiments include a method of making and/or using such a mount.

Abstract: A mount for a semiconductor device has a first surface with at least one contact region and a second surface. The mount has a substrate to receive the second surface of the semiconductor device and a planar element. The planar element has an aperture sized to surround the semiconductor. A first surface of the planar element is mounted to the substrate and is located to surround the semiconductor device such that the semiconductor device is aligned by the aperture. The mount further has means for mounting the semiconductor device to the substrate in an aligned position. Some embodiments include a method of making and/or using such a mount.

Abstract: In one embodiment, an apparatus includes a housing. The housing includes one or more units where each unit includes one or more optical elements. The optical elements are configured to concentrate electromagnetic radiation, such as light, from a larger area to a smaller focused area. The optical elements may be sealed in the housing. A removable device is included that is configured to be inserted into a unit. The removable device includes a photovoltaic cell that is configured to receive at least a portion of the concentrated electromagnetic radiation. The removable device is configured to be removable from the housing from a second side of the housing without breaking the seal on the first side of the housing. Accordingly, when the removable device needs to be removed, it can be removed without breaking the seal on the first side of the housing.

Abstract: A mount for a semiconductor device has a first surface with at least one contact region and a second surface. The mount has a substrate to receive the second surface of the semiconductor device and a planar element. The planar element has an aperture sized to surround the semiconductor. A first surface of the planar element is mounted to the substrate and is located to surround the semiconductor device such that the semiconductor device is aligned by the aperture. The mount further has means for mounting the semiconductor device to the substrate in an aligned position. Some embodiments include a method of making and/or using such a mount.

Abstract: A fixture for holding a brake drum or other similarly shaped workpiece for machining. The fixture includes a body having a body cavity and a clamping assembly disposed therein. The clamping assembly includes a positioning plate having a plurality of positioning posts secured thereto. The positioning posts are received within fastener apertures formed in the brake drum mounting face for locating the drum within the fixture so that the drum axis is coaxially aligned with the fixture axis for proper machining. The clamping assembly further includes a clamping plate and clamping flange for clamping the mounting face of the brake drum during machining to simulate the compressive forces applied to the drum as it is mounted to a vehicle during operation. The fixture further includes first and second pluralities of chucking assemblies for gripping the body of the brake drum along respective first and second spaced apart planes thereby reducing distortions caused by the cutting tool during machining.

Abstract: A composite rotor for caliper disc brakes and the like includes an outer friction portion having two ring sections, with a plurality of supports extending therebetween to fixedly interconnect the ring sections in a mutually parallel, spaced apart relationship defining a cavity therebetween. The ring sections have opposite friction surfaces which interface with associated friction members. The rotor also includes an inner hub portion having a central mounting section which mounts the same on a drive member, and a peripheral section cast into the cavity of the outer friction portion to integrally interconnect the inner hub and outer friction portions of the rotor with primarily mechanical bonds formed at an unfused interface.