Abstract: Methods for blending first and second fibers to provide fiber blends that include blended fiber flocs composed of a substantially homogeneous blend of first and second fibers.

Abstract: Methods for esterifying hydroxyl groups in cellulose, hemicellulose, and lignin in wood are described, wherein the wood is chosen from loblolly, slash, shortleaf, longleaf or radiata pines. Methods can include solvent drying techniques and heating provided by electromagnetic radiation, such as microwave, and radiofrequency. Products made from the methods are described that have greater decay resistance and dimensional stability as compared with non-esterified wood products.

Abstract: This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment.

Abstract: Methods for esterifying hydroxyl groups in cellulose, hemicellulose, and lignin in wood are described, wherein the wood is chosen from loblolly, slash, shortleaf, longleaf or radiata pines. Methods can include solvent drying techniques and heating provided by electromagnetic radiation, such as microwave, and radiofrequency. Products made from the methods are described that have greater decay resistance and dimensional stability as compared with non-esterified wood products.

Abstract: An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the heat spreader. Optoelectronic devices may be adapted to the heat spreader in such a manner that the devices are accessible through the window in the mounting structure.

Abstract: This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment.

Abstract: An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The apparatus comprises: (1) a mounting structure; (2) an array of optoelectronic devices adapted to the mounting structure, the optoelectronic devices having at least a first end; (3) an array of optical elements, the array of optical elements having at least a first end; (4) the first end of the array of optical elements proximate to the first end of the array of optoelectronic devices in such a manner that one or more optical elements is optically aligned to one or more optoelectronic devices; and (5) a heat spreader passing along a surface of a head region of the mounting structure. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region.

Abstract: A suspension of bacterial cellulose having a reticulated structure has been conditioned to remain in suspension when the suspension is under shear so that it may be coated on a substrate. The suspension of bacterial cellulose is homogenized and thereafter filtered to provide a bacterial cellulose component having a size no greater than 125 microns. This allows a process for applying bacterial cellulose as a coating on a substrate on a substantially continuous basis, either by roll coating or spraying. It also provides a coated product in which the bacterial cellulose is substantially uniform, taking into account the normal discontinuities of roll coating and spray coating.

Abstract: A variable gas leak rate valve which utilizes a poled piezoelectric element to control opening and closing of the valve. The gas flow may be around a cylindrical rod with a tubular piezoelectric member encircling the rod for seating thereagainst to block passage of gas and for reopening thereof upon application of suitable electrical fields.