Patents by Inventor Gary D. Phillips

Gary D. Phillips has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11925631
    Abstract: The present disclosure relates generally to certain 6-azabenzimidazole compounds, pharmaceutical compositions comprising said compounds, and methods of making and using said compounds and pharmaceutical compositions. The compounds and compositions disclosed herein may be used for the treatment or prevention of diseases, disorders, or infections modifiable by hematopoietic progenitor kinase 1 (HPK1) inhibitors, such as HBV, HIV, cancer, and/or a hyper-proliferative disease.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: March 12, 2024
    Assignee: Gilead Sciences, Inc.
    Inventors: Gayatri Balan, Mark J. Bartlett, Jayaraman Chandrasekhar, Julian A. Codelli, John H. Conway, Jennifer L. Cosman, Rao V. Kalla, Musong Kim, Seung H. Lee, Jennifer R. Lo, Jennifer A. Loyer-Drew, Scott A. Mitchell, Thao D. Perry, Gary B. Phillips, Patrick J. Salvo, Joshua J. Van Veldhuizen, Suet C. Yeung, Jeff Zablocki
  • Patent number: 5623686
    Abstract: An architecture for a serial multi-chip package digital controller including a controller oriented processor die and a separate non-volatile memory die. The architecture provides for a low pin count on the package, minimal electrical connections on and between the dice, and a minimal number of registers by making use of significant multiplexing to allow many of the registers and signal lines to serve multiple functions responsive to the mode of operation and other control signals.An input data register on the non-volatile memory die and a related multiplexer allows data from different sources to be loaded into the input data register depending on the mode of operation. Also, the output of the input data register is coupled to plural locations so that the destination of the data can also be switched responsive to the mode of operation.
    Type: Grant
    Filed: May 19, 1995
    Date of Patent: April 22, 1997
    Assignee: National Semiconductor Corporation
    Inventors: Christopher M. Hall, Gary D. Phillips, William E. Miller, David W. Weinrich, Robert M. Salter, III, Richard E. Crippen
  • Patent number: 5613144
    Abstract: An architecture for a serial multi-chip package digital controller including a controller oriented processor die and a separate non-volatile memory die. The architecture provides for a low pin count on the package, minimal electrical connections on and between the dice, and a minimal number of registers by making use of significant multiplexing to allow many of the registers and signal lines to serve multiple functions responsive to the mode of operation and other control signals.
    Type: Grant
    Filed: May 19, 1995
    Date of Patent: March 18, 1997
    Assignee: National Semiconductor Corporation
    Inventors: Christopher M. Hall, Gary D. Phillips, David W. Weinrich
  • Patent number: 5606710
    Abstract: An architecture for a serial multi-chip package digital controller including a controller oriented processor die and a separate non-volatile memory die. The architecture provides for a low pin count on the package, minimal electrical connections on and between the dice, and a minimal number of registers by making use of significant multiplexing to allow many of the registers and signal lines to serve multiple functions responsive to the mode of operation and other control signals. A plurality of feed-throughs are provided on the non-volatile memory die to provide communication paths from the processor die to package pads which are in the shadow of the non-volatile memory die relative to the processor die and thus prevent direct connection from the processor die to the package pad. In normal run mode, these pads are exclusively used as feed-through, providing a direct connection between a specific pad on the processor die and a specific pad on the package.
    Type: Grant
    Filed: December 20, 1994
    Date of Patent: February 25, 1997
    Assignee: National Semiconductor Corporation
    Inventors: Christopher M. Hall, Gary D. Phillips, William E. Miller, David W. Weinrich, Robert M. Salter, III, Richard E. Crippen
  • Patent number: 5598573
    Abstract: An architecture for a serial multi-chip package digital controller including a controller oriented processor die and a separate non-volatile memory die. The architecture provides for a low pin count on the package, minimal electrical connections on and between the dice, and a minimal number of registers by making use of significant multiplexing to allow many of the registers and signal lines to serve multiple functions responsive to the mode of operation and other control signals. A reset intercept circuit is provided on the non-volatile memory die for intercepting the signal which is provided to the reset input of the non-volatile memory die from external of the multi chip package. The reset intercept circuit provides a modified version thereof to the processor die. Particularly, the reset intercept circuit performs the function of sending a modified version of the reset signal to the processor die responsive to the present mode of operation of the multi chip package at the time the reset signal is received.
    Type: Grant
    Filed: May 19, 1995
    Date of Patent: January 28, 1997
    Assignee: National Semiconductor Corporation
    Inventors: Christopher M. Hall, Gary D. Phillips, David W. Weinrich, Robert M. Salter, III
  • Patent number: 5581779
    Abstract: An architecture for a serial multi-chip package digital controller including a controller oriented processor die and a separate non-volatile memory die. The architecture provides for a low pin count on the package, minimal electrical connections on and between the dice, and a minimal number of registers by making use of significant multiplexing to allow many of the registers and signal lines to serve multiple functions responsive to the mode of operation and other control signals.The processor includes an in-system programming mode including first and second memory interface control registers on the processor die and the memory die, respectively, for receiving control bits from the processor core for controlling multiplexers on the dies. The various bit output lines of the first memory interface control register are coupled to the control inputs of the multiplexers.
    Type: Grant
    Filed: May 19, 1995
    Date of Patent: December 3, 1996
    Assignee: National Semiconductor Corporation
    Inventors: Christopher M. Hall, Gary D. Phillips, William E. Miller, David W. Weinrich, Robert M. Salter, III, Richard E. Crippen
  • Patent number: 5566344
    Abstract: An architecture for a serial multi-chip package digital controller including a controller oriented processor die and a separate non-volatile memory die. The architecture provides for a low pin count on the package, minimal electrical connections on and between the dice, and a minimal number of registers by making use of significant multiplexing to allow many of the registers and signal lines to serve multiple functions responsive to the mode of operation and other control signals.The processor can be programmed internally or externally. In the in-system programming mode, the processor program counter is used to fetch running instructions out of an on-board ROM instruction memory on the processor die. The processor core outputs an address into which data is to be programmed on its output data bus. The processor core then receives from an external device the data which is to be programmed into the selected address and outputs it serially onto the data bus and therefrom to the memory die.
    Type: Grant
    Filed: May 19, 1995
    Date of Patent: October 15, 1996
    Assignee: National Semiconductor Corporation
    Inventors: Christopher M. Hall, Gary D. Phillips, William E. Miller, David W. Weinrich, Richard E. Crippen, Robert M. Salter, III
  • Patent number: 5319588
    Abstract: An arithmetic unit for multiplying and accumulating signed binary data and indicating an occurrence of a signed arithmetic overflow includes a multiplier-accumulator and an overflow flag register. The multiplier-accumulator receives and selectively multiples and accumulates signed binary data, and provides output data representing the multiplied and accumulated data and a sign bit representing its polarity, i.e. positive or negative. The flag register provides two "sticky" flag bits for indicating whether a signed arithmetic overflow (positive or negative) of the multiplied and accumulated data has occurred. The flag bits are "sticky" in that once a flag has been set, it cannot be reset by another arithmetic overflow condition. Instead, it must be specifically reset. The sign bit is used to selectively set one of the two sticky flag bits to a true state to indicate the direction (positive or negative) of the first arithmetic overflow.
    Type: Grant
    Filed: December 9, 1992
    Date of Patent: June 7, 1994
    Assignee: National Semiconductor Corporation
    Inventors: Ralph W. Haines, Gary D. Phillips, D. Kevin Covey, Thomas W. S. Thomson
  • Patent number: 5311458
    Abstract: An integrated circuit (IC) processor architecture is disclosed that implements hardware, signal processing (DSP) functions with less digital improved speed and a more efficient layout. The resources of the central processing unit (CPU) are used in conjunction with an integrated multiply/accumulate unit to perform DSP operations. Internal registers of the CPU are used to store pointers which reference a circular sample buffer. The CPU thus manages the selection and transfer of coefficients from the sample buffer to the multiply/accumulate unit, thereby allowing a minimum amount of lower speed hardware to be used for the multiply/accumulate unit and permitting DSP operations to be performed in parallel with CPU operations.
    Type: Grant
    Filed: November 10, 1992
    Date of Patent: May 10, 1994
    Assignee: National Semiconductor Corporation
    Inventors: Ralph W. Haines, Gary D. Phillips, D. Kevin Covey, Thomas W. S. Thomson
  • Patent number: 5218564
    Abstract: An integrated circuit processor architecture that implements digital signal processing (DSP) functions with less hardware, improved speed and a more efficient layout. The central processing unit (CPU) resources are used in conjunction with an integrated multiply/accumulate unit to perform DSP operations. Use of the CPU's internal register for the circular buffer of the DSP multiply/accumulate function allows a minimum amount of lower speed hardware to be used for the multiply/accumulate unit and permits DSP operations to be performed in parallel. The multiply/accumulate unit takes advantage of the inherent accumulating properties of conventional multiplier designs to perform multiplication of two signed binary numbers using the modified Booth's algorithm but in both reduced cycle time and hardware requirements. This is accomplished by using the adder within the multiplier to sum the product terms.
    Type: Grant
    Filed: June 7, 1991
    Date of Patent: June 8, 1993
    Assignee: National Semiconductor Corporation
    Inventors: Ralph W. Haines, Gary D. Phillips, D. Kevin Covey, Thomas W. S. Thomson