Abstract: A lens comprises a bottom surface, a reflecting surface, a first refracting surface obliquely angled with respect to a central axis of the lens, and a second refracting surface extending as a smooth curve from the bottom surface to the first refracting surface. Light entering the lens through the bottom surface and directly incident on the reflecting surface is reflected from the reflecting surface to the first refracting surface and refracted by the first refracting surface to exit the lens in a direction substantially perpendicular to the central axis of the lens. Light entering the lens through the bottom surface and directly incident on the second refracting surface is refracted by the second refracting surface to exit the lens in a direction substantially perpendicular to the central axis of the lens. The lens may be advantageously employed with LEDs, for example, to provide side-emitting light-emitting devices. A lens cap attachable to a lens is also provided.

Abstract: An optical module has port housing comprised of a material that does not substantially shield EMI, such as an optical plastic. The port housings have a receiving ferrule disposed in an aperture of an electrically conductive shell. The ferrule is movably coupled to the shell to permit it to respond to loads imposed by an optical fiber connector and includes an electrically conductive cap to shield a portion of the port housing proximate the ferrule.

Abstract: A lens mounted to a light emitting diode package internally redirects light within the lens so that a majority of light is emitted from the lens approximately perpendicular to a package axis of the light emitting diode package. In one embodiment, the light emitted by the light emitting diode package is refracted by a sawtooth portion of the lens and reflected by a total internal reflection portion of the lens.

Abstract: A lens mounted to a light emitting diode package internally redirects light within the lens so that a majority of light is emitted from the lens approximately perpendicular to a package axis of the light emitting diode package. In one embodiment, the light emitted by the light emitting diode package is refracted by a sawtooth portion of the lens and reflected by a total internal reflection portion of the lens.

Abstract: A lens mounted to a light emitting diode package internally redirects light within the lens so that a majority of light is emitted from the lens approximately perpendicular to a package axis of the light emitting diode package. In one embodiment, the light emitted by the light emitting diode package is refracted by a sawtooth portion of the lens and reflected by a total internal reflection portion of the lens.

Abstract: A lens mounted to a light emitting diode package internally redirects light within the lens so that a majority of light is emitted from the lens approximately perpendicular to a package axis of the light emitting diode package. In one embodiment, the light emitted by the light emitting diode package is refracted by a sawtooth portion of the lens and reflected by a total internal reflection portion of the lens.

Abstract: An LED package includes a heat-sinking slug that is inserted into an insert-molded leadframe. The slug may include an optional reflector cup. Within this cup, the LED and a thermally conducting sub-mount may be attached. Wire bonds extend from the LEDs to metal leads. The metal leads are electrically and thermally isolated from the slug. An optical lens may be added by mounting a pre-molded thermoplastic lens and a soft encapsulant or by casting epoxy to cover the LED or by a cast epoxy lens over a soft encapsulant.

Abstract: A LED module for providing a source of illumination comprises a plurality of LED lamps each having an anode lead and a cathode lead for providing electrical and mechanical connection. The anode lead of each LED lamp is connected to an anode bus bar and the cathode lead of each LED lamp is connected to a cathode bus bar by solderless connection. The bus bars and the leads of each LED lamp may be integral with each other. Alternatively, the bus bars and leads may be non-integral with each other, connected by an interlocking interaction or interference fit between approximately complementary portions of each lead and bus bar. The LED module may accommodate serial electrical interconnection with other LED modules, it may be shaped according to the particular contour or design of an accommodating light assembly, and it may comprise LED lamps placed at arbitrary positions to achieve a predetermined degree of illumination.

Abstract: This technique for assembling a print head for an LED printer has LED dice first assembled into precisely known locations on mounting tiles. A portion of the front face of each tile is left exposed beyond anything mounted on the tile. The tiles are then assembled with these exposed areas on a planar reference on an assembly fixture. Reference surfaces built into the fixture align the edges of the tiles, and hence the LED dice. Finally a mother plate is adhesively bonded onto the backs of the tiles. The adhesive accommodates thickness variations in the mounting tiles, and lack of flatness in the back surfaces of the tiles and the front face of the mother plate. Reference tiles coplanar with the reference plane formed by the front faces of the mounting tiles provide a z axis reference.

Abstract: This technique for assembling a print head for an LED printer has LED dice first assembled into precisely known locations on mounting tiles. A portion of the front face of each tile is left exposed beyond anything mounted on the tile. The tiles are then assembled with these exposed areas on a planar reference on an assembly fixture. Reference surfaces built into the fixture align the edges of the tiles, and hence the LED dice. Finally a mother plate is adhesively bonded onto the backs of the tiles. The adhesive accommodates thickness variations in the mounting tiles, and lack of flatness in the back surfaces of the tiles and the front face of the mother plate. Reference tiles copolanar with the reference plane formed by the front faces of the mounting tiles provide a z axis reference.