Patents by Inventor Gary Dahrooge

Gary Dahrooge has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plasma process for removing polymer and residues from substrates
    Patent number: 6834656
    Abstract: A process for removing polymers formed during etching and etch residues from a semiconductor substrate by exposing the substrate to plasmas of neutral chemistry. The plasma generates atomic hydrogen species and atomic oxygen species in about equal amounts that react with and remove the polymers and etch residues from the substrate. The process is especially suitable for use with semiconductor substrates comprising low k dielectric materials and/or copper interconnects.
    Type: Grant
    Filed: May 23, 2001
    Date of Patent: December 28, 2004
    Assignee: Axcelis Technology, Inc.
    Inventors: Han Qingyuan, Carlo Waldfried, Orlando Escorcia, Gary Dahrooge, Ivan Berry
  • Plasma process for removing polymer and residues from substrates
    Publication number: 20020185151
    Abstract: A process for removing polymers formed during etching and etch residues from a semiconductor substrate by exposing the substrate to plasmas of neutral chemistry. The plasma generates atomic hydrogen species and atomic oxygen species in about equal amounts that react with and remove the polymers and etch residues from the substrate. The process is especially suitable for use with semiconductor substrates comprising low k dielectric materials and/or copper interconnects.
    Type: Application
    Filed: May 23, 2001
    Publication date: December 12, 2002
    Inventors: Han Qingyuan, Carlo Waldfried, Orlando Escorcia, Gary Dahrooge, Ivan Berry
  • Removing sacrificial material through temporary channels as a method of making an overpressure-protected differential pressure sensor
    Patent number: 5438875
    Abstract: An overpressure-protected, differential pressure sensor 37 is formed by depositing diaphragm material 24 over a cavity 23 formed and filled with sacrificial material 22 into a front surface of a substrate. The sacrificial material 22 is then removed to create a free diaphragm. The floor of the cavity 23 defines a first pressure stop to limit the deflection of the diaphragm in response to pressure applied to the top of the diaphragm. A port 33 is created to allow pressure to be applied to the bottom side of the diaphragm 24. An optional second pressure stop, which limits the deflection of the diaphragm in response to pressure applied to the bottom side of the diaphragm, is formed by bonding a cap 35 to standoffs 34 placed around the top of the diaphragm. The standoffs are spaced to allow pressure to be applied to the top of the diaphragm.
    Type: Grant
    Filed: April 21, 1994
    Date of Patent: August 8, 1995
    Assignee: The Foxboro Company
    Inventors: Clifford D. Fung, Kevin H.-L. Chau, P. Rowe Harris, John G. Panagou, Gary A. Dahrooge
  • Overpressure-protected, differential pressure sensor
    Patent number: 5357808
    Abstract: An overpressure-protected, differential pressure sensor (37) is formed by depositing diaphragm material (24) over a cavity (23) formed and filled with sacrificial material (22) into a front surface of a substrate. The sacrificial material (22) is then removed to create a free diaphragm. The floor of the cavity (23) defines a first pressure stop to limit the deflection of the diaphragm in response to pressure applied to the top of the diaphragm. A port (33) is created to allow pressure to be applied to the bottom side of the diaphragm (24). An optional second pressure stop, which limits the deflection of the diaphragm in response to pressure applied to the bottom side of the diaphragm, is formed by bonding a cap (35) to stand-offs (34) placed around the top of the diaphragm. The stand-offs are spaced to allow pressure to be applied to the top of the diaphragm.
    Type: Grant
    Filed: March 26, 1993
    Date of Patent: October 25, 1994
    Assignee: The Foxboro Company
    Inventors: Clifford D. Fung, Kevin H.-L. Chau, P. Rowe Harris, John G. Panagou, Gary A. Dahrooge
  • Overpressure-protected, differential pressure sensor and method of making the same
    Patent number: 5220838
    Abstract: An overpressure-protected, differential pressure sensor (37) is formed by depositing diaphragm material (24) over a cavity (23) formed and filled with sacrificial material (22) into a front surface of a substrate. The sacrificial material (22) is then removed to create a free diaphragm. The floor of the cavity (23) defines a first pressure stop to limit the deflection of the diaphragm in response to pressure applied to the top of the diaphragm. A port (33) is created to allow pressure to be applied to the bottom side of the diaphragm (24). An optional second pressure stop, which limits the deflection of the diaphragm in response to pressure applied to the bottom side of the diaphragm, is formed by bonding a cap (35) to standoffs (34) placed around the top of the diaphragm. The standoffs are spaced to allow pressure to be applied to the top of the diaphragm.
    Type: Grant
    Filed: March 28, 1991
    Date of Patent: June 22, 1993
    Assignee: The Foxboro Company
    Inventors: Clifford D. Fung, Kevin H.-L. Chau, P. Rowe Harris, John G. Panagou, Gary A. Dahrooge