Abstract: The invention provides a molding apparatus and process of molding formable materials which comprises at least one supply manifold for receiving a formable material and plungers or pistons for applying pressure to the formable material within the manifolds. A mold plate including at least one mold cavity is driven between fill and discharge positions, with the at least one mold cavity selectively exposed to the supply manifold when in the fill position. A clamp member is positioned adjacent the mold plate when in the fill position, and pressure is applied on the clamp member to clamp the mold plate against the supply manifold. The clamp member and associated structure apply pressure to the clamp member compensating for deflection of these structural members which maintains the mold plate in firm clamping relation relative to the supply manifold.