Abstract: A sensor (1) and a method of manufacturing the sensor (1), the sensor (1) including a number of metallic strips (5,6,7) mounted on a non-conducting substrate (4) and a module (3) for forming electrical connections to the strips (5,6,7) whereby to enable communication between the strips (5,6,7) and monitoring equipment for the sensor (4), the module including a number of wire connections (16), the method including the steps of encapsulating the wire connections within a flexible chemical and heat resistant sealing compound, and subsequently, encapsulating the flexible sealing compound within a second sealing compound (34) by an injection molding process.

Abstract: A sensor (1) and a method of manufacturing the sensor (1), the sensor (1) including a number of metallic strips (5,6,7) mounted on a non-conducting substrate (4) and a module (3) for forming electrical connections to the strips (5,6,7) whereby to enable communication between the strips (5,6,7) and monitoring equipment for the sensor (4), the module including a number of wire connections (16), the method including the steps of encapsulating the wire connections within a flexible chemical and heat resistant sealing compound, and subsequently, encapsulating the flexible sealing compound within a second sealing compound (34) by an injection moulding process.

Abstract: A radar or other microwave antenna comprises at least one antenna element, a feed structure for the element extending to the antenna element substantially normally thereto through a dielectric substrate, and characterized in that the dielectric substrate is anisotropic whereby to reduce unwanted common-mode currents in the feed structure. The anisotropy may be provided by elongate conductive elements distributed through the dielectric substrate and aligned with their longitudinal axes parallel to the feed structure.

Abstract: A planar Vivaldi antenna array, and method of forming such an array, the array comprising: a plurality of slots at an end of the antenna array, the slots extending through the whole thickness of the planar structure of the antenna array; and a plurality of grooves extending from the slots; wherein: the grooves do not extend through the whole thickness of the planar structure of the antenna array; and the cross-sectional shape of the grooves is complementary to the cross-sectional shape of the slots.

Abstract: An antenna assembly is disclosed which includes a layered structure having a planar array of antenna elements; and a feed arrangement perpendicular to the antenna elements; the layered structure further having layers over the planar array of antenna elements with holes provided therethrough to allow the feed arrangement to be connected to contacts for the antenna elements. The layered structure may include vias provided such that heat may be applied remotely to the contacts.

Abstract: A planar Vivaldi antenna array, and method of forming such an array, the array comprising: a plurality of slots at an end of the antenna array, the slots extending through the whole thickness of the planar structure of the antenna array; and a plurality of grooves extending from the slots; wherein: the grooves do not extend through the whole thickness of the planar structure of the antenna array; and the cross-sectional shape of the grooves is complementary to the cross-sectional shape of the slots.

Abstract: A radar or other microwave antenna comprises at least one antenna element, a feed structure for the element extending to the antenna element substantially normally thereto through a dielectric substrate, and characterised in that the dielectric substrate is anisotropic whereby to reduce unwanted common-mode currents in the feed structure. The anisotropy may be provided by elongate conductive elements distributed through the dielectric substrate and aligned with their longitudinal axes parallel to the feed structure.

Abstract: A dipole array assembly, is disclosed which includes a plurality of poles arranged in a two-dimensional array to provide a plurality of dipoles, each pole being shaped such that adjacent edges of neighbouring poles that are from respective neighbouring dipoles are relatively long and relatively close to each other compared to the dimensions of the poles, thereby increasing coupling between different dipoles. A feed arrangement is provided in a plane that is at an angle to the plane of the dipoles wherein one or more baluns are integrated in the feed arrangement. Dual polarised operation can be performed independently between the two polarisations.

Abstract: An antenna assembly is disclosed which includes a layered structure having a planar array of antenna elements; and a feed arrangement perpendicular to the antenna elements; the layered structure further having layers over the planar array of antenna elements with holes provided therethrough to allow the feed arrangement to be connected to contacts for the antenna elements. The layered structure may include vias provided such that heat may be applied remotely to the contacts.

Abstract: A feed module is provided for an array antenna. The feed module comprises a multi-layer printed circuit board (PCB) feed structure for coupling signals between connections to transmitters or receivers and connection points for connecting to antenna elements of the array antenna. The multi-layer PCB feed structure comprises a body portion, incorporating coupling components, and a number of line sections for connecting to elements of the array antenna. The planar layers of the multi-layer PCB are arranged to be mounted substantially perpendicular to a planar array of antenna elements of the array antenna when the feed module is integrated therewith.

Abstract: The invention relates to circuit boards and to screening circuits and components on such boards from stray rf interference when they are mounted as arrays or stacks of such circuit boards. The circuit boards (12, 14) are individually screened by conductive screening layers (16, 18) as known in the art and the individual screening layers are coupled together by layered interconnects (34) which connect corresponding screening layers (16, 18) of the individual circuit boards (12, 14) together, instead of by vias.

Abstract: A microwave, power splitter/combiner (20) is formed as part of a multilayer laminate (27, 28, 29, 33, 34) such that two ports (22, 23) are connected by plated vias (31, 32) to conductive pads (29, 30) connected across an isolation resistor (27). Furthermore, a microwave circuit is provided in the form of a multi-layer laminate including a substrate carrying a resistive layer which has been etched to define at least one resistor, a dielectric membrane covering the resistor, a conductive layer defining at least part of an electrical circuit, and said at least one resistor is electrically connected to the conductive layer by vias extending through the dielectric membrane.

Abstract: A feed module is provided for an array antenna. The feed module comprises a multi-layer printed circuit board (PCB) feed structure for coupling signals between connections to transmitters or receivers and connection points for connecting to antenna elements of the array antenna. The multi-layer PCB feed structure comprises a body portion, incorporating coupling components, and a number of line sections for connecting to elements of the array antenna. The planar layers of the multi-layer PCB are arranged to be mounted substantially perpendicular to a planar array of antenna elements of the array antenna when the feed module is integrated therewith.

Abstract: The invention relates to circuit boards and to screening circuits and components on such boards from stray rf interference when they are mounted as arrays or stacks of such circuit boards. The circuit boards (12, 14) are individually screened by conductive screening layers (16, 18) as known in the art and the individual screening layers are coupled together by layered interconnects (34) which connect corresponding screening layers (16, 18) of the individual circuit boards (12, 14) together, instead of by vias.

Abstract: A microwave, power splitter/combiner (20) is formed as part of a multilayer laminate (27, 28, 29, 33, 34) such that two ports (22, 23) are connected by plated vias (31, 32) to conductive pads (29, 30) connected across an isolation resistor (27). Furthermore, a microwave circuit is provided in the form of a multi-layer laminate including a substrate carrying a resistive layer which has been etched to define at least one resistor, a dielectric membrane covering the resistor, a conductive layer defining at least part of an electrical circuit, and said at least one resistor is electrically connected to the conductive layer by vias extending through the dielectric membrane.