Abstract: Latching mechanisms for electronic modules. In one example embodiment, a latching mechanism for an electronic module includes a latch, a latch return spring, and a release slide. The latch is configured to rotate between a latched position and an unlatched position. The latch includes a latch arm on a first end of the latch and an engagement pin on a second end of the latch. The latch return spring is configured to bias the latch in the latched position. The release slide includes a slide ramp. The slide ramp is configured to engage the latch arm as the release slide is slid away from the engagement pin, which causes the latch to rotate from the latched position to the unlatched position.

Abstract: In one example, a rotatable top shell is provided for an example optoelectronic device. The rotatable top shell includes a body defining a curved tongue on one end. The tongue is configured to rotate about a complimenting curved mating surface of a bottom shell of the optoelectronic device to allow the body to rotate between an open position and a closed position. The rotatable top shell further includes means for securing the rotatable top shell relative to the bottom shell. The means for securing the rotatable top shell may include one or more of: a plurality of nubs defined along at least one edge of the body, a hole defined in the body for receiving a retention pin of the bottom shell, two sides for being received within a main cavity of the bottom shell, or the like.

Abstract: In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.

Abstract: Latching mechanisms for electronic modules. In one example embodiment, a latching mechanism for an electronic module includes a latch, a latch return spring, and a release slide. The latch is configured to rotate between a latched position and an unlatched position. The latch includes a latch arm on a first end of the latch and an engagement pin on a second end of the latch. The latch return spring is configured to bias the latch in the latched position. The release slide includes a slide ramp. The slide ramp is configured to engage the latch arm as the release slide is slid away from the engagement pin, which causes the latch to rotate from the latched position to the unlatched position.

Abstract: In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.

Abstract: In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.

Abstract: An optoelectronic transceiver module. The optoelectronic module is a monolithic, one-piece module shell that includes a top portion, a bottom portion, a first side portion, a second side portion, and a front portion. The top portion, bottom portion, first side portion, second side portion and the front portion define a cavity configured to enclose electro-optical circuitry. In addition, the top portion and the bottom portion are configured such that the top portion is not separable from the bottom portion. Further, the front portion defines at least one of an optical transmit port or an optical receive port.

Abstract: In one example embodiment, an electromagnetic radiation (EMR) shield includes a central portion, an opening defined in the central portion, a wing attached to and extending outward from the central portion, and a protrusion defined in the wing. The perimeter of the EMR shield is approximately the same size and shape as that of a portion of an associated optical subassembly (OSA).

Abstract: An integrated array for optoelectronic components in an optical communications system is disclosed. The integrated array incorporates a plurality of optoelectronic modules, such as optical transceivers, in a compact, integrated geometry for positioning within an optical device, such as an optical switch or router. In one embodiment, the integrated array includes a component structure comprised of a plurality of optical transceiver sub-modules, each having dual optical ports. The component structure is integrated as a single structure to minimize the spacing between each transceiver sub-module. This in turn increases the optical port density of the integrated array. The integrated array is received by a cage that is attached to a host board within the optical device. A latching mechanism is included to selectively secure the integrated array within the cage.

Abstract: In one example embodiment, an optoelectronic module comprises a body, a signal ground, and an OSA. The body is connected to chassis ground and defines a cavity within which one or more components are disposed. The optical subassembly is disposed in the body cavity, has one or more components connected to signal ground, and comprises a header assembly, a housing, and one or more containment structures. The header assembly houses one or more components that generate EMI emissions and includes an optical aperture. The housing includes a port and a barrel. The port defines a fiber receptacle and the barrel defines a cavity that at least partially receives the header assembly. The containment structure(s) at least partially contain the EMI emissions within the OSA.

Abstract: An optoelectronic transceiver module. The optoelectronic module is a monolithic, one-piece module shell that includes a top portion, a bottom portion, a first side portion, a second side portion, and a front portion. The top portion, bottom portion, first side portion, second side portion and the front portion define a cavity configured to enclose electro-optical circuitry. In addition, the top portion and the bottom portion are configured such that the top portion is not separable from the bottom portion. Further, the front portion defines at least one of an optical transmit port or an optical receive port.

Abstract: In one example embodiment, an electromagnetic radiation (EMR) shield includes a central portion, an opening defined in the central portion, a wing attached to and extending outward from the central portion, and a protrusion defined in the wing. The perimeter of the EMR shield is approximately the same size and shape as that of a portion of an associated optical subassembly (OSA).

Abstract: In one example, a rotatable top shell is provided for an example optoelectronic device. The rotatable top shell includes a body defining a curved tongue on one end. The tongue is configured to rotate about a complimenting curved mating surface of a bottom shell of the optoelectronic device to allow the body to rotate between an open position and a closed position. The rotatable top shell further includes means for securing the rotatable top shell relative to the bottom shell. The means for securing the rotatable top shell may include one or more of: a plurality of nubs defined along at least one edge of the body, a hole defined in the body for receiving a retention pin of the bottom shell, two sides for being received within a main cavity of the bottom shell, or the like.

Abstract: An array system that enables compact positioning of optoelectronic modules, such as optical transceiver modules, within an optical device is disclosed. The array system increases the optical port density of the modules within the optical device, which can comprise an optical switch, an optical router, or the like. In one embodiment, the array system includes a host board and a plurality of daughter cards that connect with the host board edge-on in a perpendicular orientation. A cage is mounted to each daughter card, and an optical transceiver module is received into each cage to electrically connect with a connector receptacle that is positioned on the daughter card. A connectorized optical fiber can be connected to the optical ports of the transceiver using a release sleeve that enables engagement and disengagement of the optical fiber without difficulty despite the increased port density.

Abstract: An optical device packaging technique involves an optical sensor that is formed on a first substrate and flip chip bonded to a second substrate. The second substrate includes a through hole or a transparent section that is aligned with the optical sensor in order to allow light to contact the optical sensor. An embodiment of an optical device structure includes an optical sensor, a first substrate, a second substrate, and a circuit board. The optical sensor is formed on or within the first substrate and the individual sensors or pixels of the optical sensor are electrically connected to contact pads that are exposed on the first substrate. The first substrate is flip chip bonded to the second substrate. The second substrate is flip chip bonded to a circuit board. Another embodiment of an optical device structure includes an optical sensor, a first substrate, and a circuit board as the second substrate.

Abstract: A miniature display system has polarized beam reflector film and display panel pivotally attached to the polarized beam reflector film. Because these components are pivotally attached, the components can be folded, thereby reducing the bulk of the display system. The display system may include other components such as light source, curved reflector, quarter wave film, or conic mirror. These components may also be pivotally attached to each other or to the polarized beam reflector film or the display panel.

Abstract: A display system has light source, display panel, conic mirror, and polarized reflector. The light from the light source is filtered by a diffuse reflective polarizer to contain light in a first linear polarization (for example, s-polarized light). That light is directed by the conic mirror toward the polarized reflector, and is reflected toward the display panel displaying images. The conic mirror and the polarized reflector is shaped such that the light telecentrically and uniformly illuminates the display panel. The light is reflected from the display panel being patterned by the image and rotated into a second linear polarization (for example, p-polarized light). The rotated light passes through the polarized reflector for viewing.