Patents by Inventor Gary E. O'Neil
Gary E. O'Neil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8785823Abstract: A method and system for efficiently extending the operating temperature range of high power components within a system/device. An embedded monitor measures local temperatures such as junction temperatures of components. When the measured temperature is less than the lowest operational temperature threshold of the component, temperature control logic initiates pre-heating to raise the component's temperature to an operational level, utilizing a heating source. The component (or device) is made operational only when the temperature is at or above the operational level. The temperature control logic maintains the operational temperature of the component using the high power dissipated by components within the operating system/device as a self heating source.Type: GrantFiled: July 11, 2007Date of Patent: July 22, 2014Assignee: International Business Machines CorporationInventors: Edward D. Doan, Anthony P. Ferranti, Gary E. O'Neil
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Patent number: 8767411Abstract: During manufacture of an electronic device, an aerogel coating is applied to a first side of an IC substrate of a first IC. A bonding procedure is initiated, during which IC interconnects are either placed on the coated side of the substrate or on the opposite side of the substrate. The first IC is connected on a carrier to a second IC with the coated side of the first IC facing the second IC to reduce heat transmission to the second IC during operation of the first IC. The aerogel coating reduces thermal stress to the circuit board and surrounding components, reduces the risk of overheating of critical circuit components, provides chemical and mechanical insulation from contamination during subsequent wafer handling operations, and provides a thermal isolator between IC regions of dissimilar power dissipation, which isolator facilitates efficient thermal extraction from localized hotspots.Type: GrantFiled: May 11, 2012Date of Patent: July 1, 2014Assignee: International Business Machines CorporationInventors: Martin P. Goetz, Gary E. O'Neil
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Patent number: 8513575Abstract: A method induces augmented levels of heat dissipation by exploiting quiescent IC leakage currents to control the temperature in high power devices. A heat control and temperature monitoring system (HCTMS) utilizes a thermal sensor to sense the junction temperature of a component, which becomes self-heated due to the quiescent leakage current inherent to the component upon the application of power to the component. By increasing the voltage level of the power source, this quiescent self-heating property is augmented, which serves to accelerate the preheating of the device, until the temperature rises above the minimum specified operating temperature of the component. The method further includes reliably initializing the system by applying full system power and triggering a defined initialization sequence/procedure.Type: GrantFiled: February 15, 2013Date of Patent: August 20, 2013Assignee: International Business Machines CorporationInventors: Gary E. O'Neil, Michael E. Stopford, James B. Tate
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Patent number: 8378271Abstract: A method and system for inducing augmented levels of heat dissipation by exploiting quiescent IC leakage currents to control the temperature in high power devices. A heat control and temperature monitoring system (HCTMS) utilizes a thermal sensor to sense the junction temperature of a component, which becomes self-heated due to the quiescent leakage current inherent to the component upon the application of power to the component. By increasing the voltage level of the power source, this quiescent self-heating property is augmented, which serves to accelerate the preheating of the device, until the temperature rises above the minimum specified operating temperature of the component. The system is then reliably initialized by applying full system power and triggering a defined initialization sequence/procedure.Type: GrantFiled: July 11, 2007Date of Patent: February 19, 2013Assignee: International Business Machines CorporationInventors: Gary E. O'Neil, Michael E. Stopford, James B. Tate
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Publication number: 20120223442Abstract: During manufacture of an electronic device, an aerogel coating is applied to a first side of an IC substrate of a first IC. A bonding procedure is initiated, during which IC interconnects are either placed on the coated side of the substrate or on the opposite side of the substrate. The first IC is connected on a carrier to a second IC with the coated side of the first IC facing the second IC to reduce heat transmission to the second IC during operation of the first IC. The aerogel coating reduces thermal stress to the circuit board and surrounding components, reduces the risk of overheating of critical circuit components, provides chemical and mechanical insulation from contamination during subsequent wafer handling operations, and provides a thermal isolator between IC regions of dissimilar power dissipation, which isolator facilitates efficient thermal extraction from localized hotspots.Type: ApplicationFiled: May 11, 2012Publication date: September 6, 2012Applicant: IBM CORPORATIONInventors: Martin P. Goetz, Gary E. O'Neil
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Patent number: 8231692Abstract: During manufacture of an electronic device, an aerogel coating is applied to a first side of an IC substrate of a first IC. A bonding procedure is initiated, during which IC interconnects are either placed on the coated side of the substrate or on the opposite side of the substrate. The first IC is connected on a carrier to a second IC with the coated side of the first IC facing the second IC to reduce heat transmission to the second IC during operation of the first IC. The aerogel coating reduces thermal stress to the circuit board and surrounding components, reduces the risk of overheating of critical circuit components, provides chemical and mechanical insulation from contamination during subsequent wafer handling operations, and provides a thermal isolator between IC regions of dissimilar power dissipation, which isolator facilitates efficient thermal extraction from localized hotspots.Type: GrantFiled: November 6, 2008Date of Patent: July 31, 2012Assignee: International Business Machines CorporationInventors: Martin P. Goetz, Gary E. O'Neil
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Patent number: 8188907Abstract: The present invention provides an aircraft collision alarm system and method. The method includes the steps of collecting aircraft position information for aircraft in a given area and digitally encoding this aircraft position information. This aircraft position information is then transmitted on an audio sub-carrier over the voice communications channel of a VOR to the aircraft. The aircraft receives and processes the digitally encoded information and alerts the pilot if a collision alarm situation is present.Type: GrantFiled: September 12, 2009Date of Patent: May 29, 2012Assignee: International Business Machines CorporationInventor: Gary E. O'Neil
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Patent number: 8086358Abstract: A method and system for utilizing the heat dissipated by quiescent IC leakage currents to control the start-up temperature of components. A temperature control sub-system utilizes a thermal sensor to sense the junction temperature of the component. When the temperature is below an operating threshold, the control sub-system applies power to the component, and the component is self-heated due to the quiescent leakage current inherent to the component. This quiescent self-heating property serves as a source of pre-heat to elevate the temperature of the component, until the temperature, as indicated by the thermal sensor, rises above the minimum specified operating temperature of the component. The system may then be reliably initialized by applying full system power, and triggering a hardware reset or defined initialization sequence/procedure. Once the component(s) is operational, self-heating continues to maintain the component's temperature above the minimum operating threshold.Type: GrantFiled: July 11, 2007Date of Patent: December 27, 2011Assignee: International Business Machines CorporationInventors: Gary E. O'Neil, Michael E. Stopford, James B. Tate
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Publication number: 20110063159Abstract: The present invention provides an aircraft collision alarm system and method. The method includes the steps of collecting aircraft position information for aircraft in a given area and digitally encoding this aircraft position information. This aircraft position information is then transmitted on an audio sub-carrier over the voice communications channel of a VOR to the aircraft. The aircraft receives and processes the digitally encoded information and alerts the pilot if a collision alarm situation is present.Type: ApplicationFiled: September 12, 2009Publication date: March 17, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventor: Gary E. O'Neil
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Publication number: 20100110651Abstract: During manufacture of an electronic device, an aerogel coating is applied to a first side of an IC substrate of a first IC. A bonding procedure is initiated, during which IC interconnects are either placed on the coated side of the substrate or on the opposite side of the substrate. The first IC is connected on a carrier to a second IC with the coated side of the first IC facing the second IC to reduce heat transmission to the second IC during operation of the first IC. The aerogel coating reduces thermal stress to the circuit board and surrounding components, reduces the risk of overheating of critical circuit components, provides chemical and mechanical insulation from contamination during subsequent wafer handling operations, and provides a thermal isolator between IC regions of dissimilar power dissipation, which isolator facilitates efficient thermal extraction from localized hotspots.Type: ApplicationFiled: November 6, 2008Publication date: May 6, 2010Applicant: International Buisness Machines CorporationInventors: Martin P. Goetz, Gary E. O'Neil
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Publication number: 20090016408Abstract: A method and system for efficiently extending the operating temperature range of high power components within a system/device. An embedded monitor measures local temperatures such as junction temperatures of components. When the measured temperature is less than the lowest operational temperature threshold of the component, temperature control logic initiates pre-heating to raise the component's temperature to an operational level, utilizing a heating source. The component (or device) is made operational only when the temperature is at or above the operational level. The temperature control logic maintains the operational temperature of the component using the high power dissipated by components within the operating system/device as a self heating source.Type: ApplicationFiled: July 11, 2007Publication date: January 15, 2009Inventors: Edward D. Doan, Anthony P. Ferranti, Gary E. O'Neil
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Publication number: 20090014433Abstract: A method and system for inducing augmented levels of heat dissipation by exploiting quiescent IC leakage currents to control the temperature in high power devices. A heat control and temperature monitoring system (HCTMS) utilizes a thermal sensor to sense the junction temperature of a component, which becomes self-heated due to the quiescent leakage current inherent to the component upon the application of power to the component. By increasing the voltage level of the power source, this quiescent self-heating property is augmented, which serves to accelerate the preheating of the device, until the temperature rises above the minimum specified operating temperature of the component. The system is then reliably initialized by applying full system power and triggering a defined initialization sequence/procedure.Type: ApplicationFiled: July 11, 2007Publication date: January 15, 2009Inventors: Gary E. O'Neil, Michael E. Stopford, James B. Tate
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Publication number: 20090018708Abstract: A method and system for utilizing the heat dissipated by quiescent IC leakage currents to control the start-up temperature of components. A temperature control sub-system utilizes a thermal sensor to sense the junction temperature of the component. When the temperature is below an operating threshold, the control sub-system applies power to the component, and the component is self-heated due to the quiescent leakage current inherent to the component. This quiescent self-heating property serves as a source of pre-heat to elevate the temperature of the component, until the temperature, as indicated by the thermal sensor, rises above the minimum specified operating temperature of the component. The system may then be reliably initialized by applying full system power, and triggering a hardware reset or defined initialization sequence/procedure. Once the component(s) is operational, self-heating continues to maintain the component's temperature above the minimum operating threshold.Type: ApplicationFiled: July 11, 2007Publication date: January 15, 2009Inventors: GARY E. O'NEIL, Michael E. Stopford, James B. Tate
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Patent number: 6424290Abstract: The tracking of moving vehicles over long distances without emitting illumination signals is accomplished with a narrowband passive differential tracking system. Instead of Providing especially designed radar transmitters in a bistatic radar system, illuminators of opportunity (which may include UHF and VHF television station) are selected by their geographic locations so that they are in proximity to a moving target. The Doppler-shifted target reflected signals from the illuminators of opportunity are converted into digital data and combined with the independently derived initial target location and used to update the target's position and velocity by correlating the Doppler-shift with geographic coordinates. The correlation can be accomplished with a tracking algorithm which was designed for use in data processing of the signal processing system of the narrowband passive position tracking system.Type: GrantFiled: December 13, 1989Date of Patent: July 23, 2002Assignee: The United States of America as represented by the Secretary of the Air ForceInventors: Gary E. O'Neil, Richard A. Lodwig
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Patent number: 5515366Abstract: Direct communication between a primary portable unit initiating the communication and a secondary portable unit is established utilizing two handshaking operations. The first handshaking operation is performed in the base station channel to establish initial contact between the primary and secondary portable units. After initial contact is made, the second handshaking operation is performed to establish communication in an unoccupied channel. The base station channel and the unoccupied channel may be a TDMA/TDD channel or a TDMA/FDD channel.Type: GrantFiled: November 17, 1994Date of Patent: May 7, 1996Assignee: International Business Machines CorporationInventors: Trieu C. Chieu, Anand Narasimhan, Gary E. O'Neil, Li-Cheng R. Zai