Patents by Inventor Gary Ellsworth BIDDLE

Gary Ellsworth BIDDLE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11374360
    Abstract: An electrical contact for an electrical connector includes a body having a mounting end and a mating end, a contact beam, and an anchoring region. The contact beam includes first and second edges that are laterally spaced from one another, and first and second broadsides that extend between the first and second edges. The anchoring region includes first, second, and intermediate portions. The first portion extends from the contact beam towards the mounting end, and has a first side that is spaced laterally outwards from the first edge. The second portion extends from the mounting end towards the first portion, and has a first side that is spaced laterally outwards from the first edge. The intermediate portion extends between the first portion and the second portion, and has a first side that is recessed laterally inwards from the first sides of the first and second portions.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: June 28, 2022
    Assignee: SAMTEC, INC.
    Inventors: Chadrick Paul Faith, Gary Ellsworth Biddle, Randall Eugene Musser, Jonathan Earl Buck
  • Publication number: 20210305752
    Abstract: An electrical contact for an electrical connector includes a body having a mounting end and a mating end, a contact beam, and an anchoring region. The contact beam includes first and second edges that are laterally spaced from one another, and first and second broadsides that extend between the first and second edges. The anchoring region includes first, second, and intermediate portions. The first portion extends from the contact beam towards the mounting end, and has a first side that is spaced laterally outwards from the first edge. The second portion extends from the mounting end towards the first portion, and has a first side that is spaced laterally outwards from the first edge. The intermediate portion extends between the first portion and the second portion, and has a first side that is recessed laterally inwards from the first sides of the first and second portions.
    Type: Application
    Filed: August 23, 2017
    Publication date: September 30, 2021
    Inventors: Chadrick Paul FAITH, Gary Ellsworth BIDDLE, Randall Eugene MUSSER, Jonathan Earl BUCK
  • Patent number: 9215795
    Abstract: An electrical system including (1) a printed circuit board including first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, a first signal trace located on the top surface of the printed circuit board and connecting the first signal pad and the first signal via, and a second signal trace located on the top surface of the printed circuit board and connecting the second signal pad and the second signal via; and (2) a connector including first and second signal contacts arranged to transmit the first differential signal. The first differential signal transmitted through the printed circuit board and the connector has a common central axis.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: December 15, 2015
    Assignee: SAMTEC, INC.
    Inventors: Gary Ellsworth Biddle, James Nadolny
  • Patent number: 9198280
    Abstract: A printed circuit board includes first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, a first signal trace located on the top surface of the printed circuit board and connecting the first signal pad and the first signal via, and a second signal trace located on the top surface of the printed circuit board and connecting the second signal pad and the second signal via. The first and second signal vias are located on opposite sides of a line connecting the first and second signal pads.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: November 24, 2015
    Assignee: Samtec, Inc.
    Inventors: Gary Ellsworth Biddle, James Nadolny
  • Patent number: 9137887
    Abstract: A printed circuit board including first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, and a first ground plane located on a layer below the top surface of the printed circuit board and including an antipad that encompasses the first and second signal pads and the first and second signal vias when viewed in plan.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: September 15, 2015
    Assignee: Samtec, Inc.
    Inventors: Gary Ellsworth Biddle, James Nadolny
  • Publication number: 20150229016
    Abstract: A substrate including a first transmission line arranged to transmit electrical signals and including first and second traces and a first dielectric layer. The first and second traces are separated from each other by the first dielectric layer. A printed circuit board includes a first transmission line arranged to transmit electrical signals and including first, second, and third traces; and a first dielectric layer. The first and second traces are separated from the third trace by the first dielectric layer.
    Type: Application
    Filed: April 27, 2015
    Publication date: August 13, 2015
    Inventor: Gary Ellsworth BIDDLE
  • Patent number: 8911240
    Abstract: A connector includes a housing including a conductive material, a base connected to the housing and including a base center hole and a base groove extending from the base center hole to an edge of the base, a center pin including a first portion and a second portion extending perpendicular or substantially perpendicular to the first portion, and a dielectric. The dielectric includes a first portion extending through the base center hole and including a dielectric center hole through which the first portion of the center pin extends and a second portion extending perpendicular or substantially perpendicular to the first portion of the dielectric along the base groove and including a dielectric groove along which the second portion of the center pin extends.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: December 16, 2014
    Assignee: Samtec, Inc.
    Inventors: Gary Ellsworth Biddle, Christopher Warren Shelly
  • Publication number: 20140273550
    Abstract: A connector includes a housing including a conductive material, a base connected to the housing and including a base center hole and a base groove extending from the base center hole to an edge of the base, a center pin including a first portion and a second portion extending perpendicular or substantially perpendicular to the first portion, and a dielectric. The dielectric includes a first portion extending through the base center hole and including a dielectric center hole through which the first portion of the center pin extends and a second portion extending perpendicular or substantially perpendicular to the first portion of the dielectric along the base groove and including a dielectric groove along which the second portion of the center pin extends.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: SAMTEC, INC.
    Inventors: Gary Ellsworth BIDDLE, Christopher Warren SHELLY
  • Publication number: 20140034363
    Abstract: A substrate including a first transmission line arranged to transmit electrical signals and including first and second traces and a first dielectric layer. The first and second traces are separated from each other by the first dielectric layer. A printed circuit board includes a first transmission line arranged to transmit electrical signals and including first, second, and third traces; and a first dielectric layer. The first and second traces are separated from the third trace by the first dielectric layer.
    Type: Application
    Filed: August 1, 2013
    Publication date: February 6, 2014
    Applicant: SAMTEC, INC.
    Inventor: Gary Ellsworth BIDDLE
  • Publication number: 20140034376
    Abstract: A substrate including a first transmission line arranged to transmit electrical signals and including first and second traces and a first dielectric layer. The first and second traces are separated from each other by the first dielectric layer. A printed circuit board includes a first transmission line arranged to transmit electrical signals and including first, second, and third traces; and a first dielectric layer. The first and second traces are separated from the third trace by the first dielectric layer.
    Type: Application
    Filed: August 1, 2013
    Publication date: February 6, 2014
    Applicant: SAMTEC, INC.
    Inventor: Gary Ellsworth BIDDLE
  • Publication number: 20130056253
    Abstract: A printed circuit board includes first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, a first signal trace located on the top surface of the printed circuit board and connecting the first signal pad and the first signal via, and a second signal trace located on the top surface of the printed circuit board and connecting the second signal pad and the second signal via. The first and second signal vias are located on opposite sides of a line connecting the first and second signal pads.
    Type: Application
    Filed: September 7, 2012
    Publication date: March 7, 2013
    Applicant: Samtec, Inc.
    Inventors: Gary Ellsworth BIDDLE, James NADOLNY
  • Publication number: 20130056254
    Abstract: An electrical system including (1) a printed circuit board including first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, a first signal trace located on the top surface of the printed circuit board and connecting the first signal pad and the first signal via, and a second signal trace located on the top surface of the printed circuit board and connecting the second signal pad and the second signal via; and (2) a connector including first and second signal contacts arranged to transmit the first differential signal. The first differential signal transmitted through the printed circuit board and the connector has a common central axis.
    Type: Application
    Filed: September 7, 2012
    Publication date: March 7, 2013
    Applicant: SAMTEC, INC.
    Inventors: Gary Ellsworth BIDDLE, James NADOLNY
  • Publication number: 20130056255
    Abstract: A printed circuit board including first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, and a first ground plane located on a layer below the top surface of the printed circuit board and including an antipad that encompasses the first and second signal pads and the first and second signal vias when viewed in plan.
    Type: Application
    Filed: September 7, 2012
    Publication date: March 7, 2013
    Applicant: SAMTEC, INC.
    Inventors: Gary Ellsworth BIDDLE, James NADOLNY
  • Patent number: D851044
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: June 11, 2019
    Assignee: Samtec, Inc.
    Inventors: Chadrick Paul Faith, Gary Ellsworth Biddle, Randall Eugene Musser, Jonathan Earl Buck
  • Patent number: D965530
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: October 4, 2022
    Assignee: Samtec, Inc.
    Inventors: Chadrick Paul Faith, Gary Ellsworth Biddle, Randall Eugene Musser, Jonathan Earl Buck
  • Patent number: D967770
    Type: Grant
    Filed: May 1, 2019
    Date of Patent: October 25, 2022
    Assignee: SAMTEC, INC.
    Inventors: Chadrick Paul Faith, Gary Ellsworth Biddle, Randall Eugene Musser, Jonathan Earl Buck