Patents by Inventor Gary Ellsworth BIDDLE
Gary Ellsworth BIDDLE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11374360Abstract: An electrical contact for an electrical connector includes a body having a mounting end and a mating end, a contact beam, and an anchoring region. The contact beam includes first and second edges that are laterally spaced from one another, and first and second broadsides that extend between the first and second edges. The anchoring region includes first, second, and intermediate portions. The first portion extends from the contact beam towards the mounting end, and has a first side that is spaced laterally outwards from the first edge. The second portion extends from the mounting end towards the first portion, and has a first side that is spaced laterally outwards from the first edge. The intermediate portion extends between the first portion and the second portion, and has a first side that is recessed laterally inwards from the first sides of the first and second portions.Type: GrantFiled: August 23, 2017Date of Patent: June 28, 2022Assignee: SAMTEC, INC.Inventors: Chadrick Paul Faith, Gary Ellsworth Biddle, Randall Eugene Musser, Jonathan Earl Buck
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Publication number: 20210305752Abstract: An electrical contact for an electrical connector includes a body having a mounting end and a mating end, a contact beam, and an anchoring region. The contact beam includes first and second edges that are laterally spaced from one another, and first and second broadsides that extend between the first and second edges. The anchoring region includes first, second, and intermediate portions. The first portion extends from the contact beam towards the mounting end, and has a first side that is spaced laterally outwards from the first edge. The second portion extends from the mounting end towards the first portion, and has a first side that is spaced laterally outwards from the first edge. The intermediate portion extends between the first portion and the second portion, and has a first side that is recessed laterally inwards from the first sides of the first and second portions.Type: ApplicationFiled: August 23, 2017Publication date: September 30, 2021Inventors: Chadrick Paul FAITH, Gary Ellsworth BIDDLE, Randall Eugene MUSSER, Jonathan Earl BUCK
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Patent number: 9215795Abstract: An electrical system including (1) a printed circuit board including first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, a first signal trace located on the top surface of the printed circuit board and connecting the first signal pad and the first signal via, and a second signal trace located on the top surface of the printed circuit board and connecting the second signal pad and the second signal via; and (2) a connector including first and second signal contacts arranged to transmit the first differential signal. The first differential signal transmitted through the printed circuit board and the connector has a common central axis.Type: GrantFiled: September 7, 2012Date of Patent: December 15, 2015Assignee: SAMTEC, INC.Inventors: Gary Ellsworth Biddle, James Nadolny
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Patent number: 9198280Abstract: A printed circuit board includes first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, a first signal trace located on the top surface of the printed circuit board and connecting the first signal pad and the first signal via, and a second signal trace located on the top surface of the printed circuit board and connecting the second signal pad and the second signal via. The first and second signal vias are located on opposite sides of a line connecting the first and second signal pads.Type: GrantFiled: September 7, 2012Date of Patent: November 24, 2015Assignee: Samtec, Inc.Inventors: Gary Ellsworth Biddle, James Nadolny
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Patent number: 9137887Abstract: A printed circuit board including first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, and a first ground plane located on a layer below the top surface of the printed circuit board and including an antipad that encompasses the first and second signal pads and the first and second signal vias when viewed in plan.Type: GrantFiled: September 7, 2012Date of Patent: September 15, 2015Assignee: Samtec, Inc.Inventors: Gary Ellsworth Biddle, James Nadolny
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Publication number: 20150229016Abstract: A substrate including a first transmission line arranged to transmit electrical signals and including first and second traces and a first dielectric layer. The first and second traces are separated from each other by the first dielectric layer. A printed circuit board includes a first transmission line arranged to transmit electrical signals and including first, second, and third traces; and a first dielectric layer. The first and second traces are separated from the third trace by the first dielectric layer.Type: ApplicationFiled: April 27, 2015Publication date: August 13, 2015Inventor: Gary Ellsworth BIDDLE
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Patent number: 8911240Abstract: A connector includes a housing including a conductive material, a base connected to the housing and including a base center hole and a base groove extending from the base center hole to an edge of the base, a center pin including a first portion and a second portion extending perpendicular or substantially perpendicular to the first portion, and a dielectric. The dielectric includes a first portion extending through the base center hole and including a dielectric center hole through which the first portion of the center pin extends and a second portion extending perpendicular or substantially perpendicular to the first portion of the dielectric along the base groove and including a dielectric groove along which the second portion of the center pin extends.Type: GrantFiled: March 15, 2013Date of Patent: December 16, 2014Assignee: Samtec, Inc.Inventors: Gary Ellsworth Biddle, Christopher Warren Shelly
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Publication number: 20140273550Abstract: A connector includes a housing including a conductive material, a base connected to the housing and including a base center hole and a base groove extending from the base center hole to an edge of the base, a center pin including a first portion and a second portion extending perpendicular or substantially perpendicular to the first portion, and a dielectric. The dielectric includes a first portion extending through the base center hole and including a dielectric center hole through which the first portion of the center pin extends and a second portion extending perpendicular or substantially perpendicular to the first portion of the dielectric along the base groove and including a dielectric groove along which the second portion of the center pin extends.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Applicant: SAMTEC, INC.Inventors: Gary Ellsworth BIDDLE, Christopher Warren SHELLY
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Publication number: 20140034363Abstract: A substrate including a first transmission line arranged to transmit electrical signals and including first and second traces and a first dielectric layer. The first and second traces are separated from each other by the first dielectric layer. A printed circuit board includes a first transmission line arranged to transmit electrical signals and including first, second, and third traces; and a first dielectric layer. The first and second traces are separated from the third trace by the first dielectric layer.Type: ApplicationFiled: August 1, 2013Publication date: February 6, 2014Applicant: SAMTEC, INC.Inventor: Gary Ellsworth BIDDLE
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Publication number: 20140034376Abstract: A substrate including a first transmission line arranged to transmit electrical signals and including first and second traces and a first dielectric layer. The first and second traces are separated from each other by the first dielectric layer. A printed circuit board includes a first transmission line arranged to transmit electrical signals and including first, second, and third traces; and a first dielectric layer. The first and second traces are separated from the third trace by the first dielectric layer.Type: ApplicationFiled: August 1, 2013Publication date: February 6, 2014Applicant: SAMTEC, INC.Inventor: Gary Ellsworth BIDDLE
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Publication number: 20130056253Abstract: A printed circuit board includes first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, a first signal trace located on the top surface of the printed circuit board and connecting the first signal pad and the first signal via, and a second signal trace located on the top surface of the printed circuit board and connecting the second signal pad and the second signal via. The first and second signal vias are located on opposite sides of a line connecting the first and second signal pads.Type: ApplicationFiled: September 7, 2012Publication date: March 7, 2013Applicant: Samtec, Inc.Inventors: Gary Ellsworth BIDDLE, James NADOLNY
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Publication number: 20130056254Abstract: An electrical system including (1) a printed circuit board including first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, a first signal trace located on the top surface of the printed circuit board and connecting the first signal pad and the first signal via, and a second signal trace located on the top surface of the printed circuit board and connecting the second signal pad and the second signal via; and (2) a connector including first and second signal contacts arranged to transmit the first differential signal. The first differential signal transmitted through the printed circuit board and the connector has a common central axis.Type: ApplicationFiled: September 7, 2012Publication date: March 7, 2013Applicant: SAMTEC, INC.Inventors: Gary Ellsworth BIDDLE, James NADOLNY
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Publication number: 20130056255Abstract: A printed circuit board including first and second signal pads located on a top surface of the printed circuit board and arranged to transmit a first differential signal, first and second signal vias extending through the printed circuit board and arranged to transmit the first differential signal, and a first ground plane located on a layer below the top surface of the printed circuit board and including an antipad that encompasses the first and second signal pads and the first and second signal vias when viewed in plan.Type: ApplicationFiled: September 7, 2012Publication date: March 7, 2013Applicant: SAMTEC, INC.Inventors: Gary Ellsworth BIDDLE, James NADOLNY
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Patent number: D851044Type: GrantFiled: September 30, 2016Date of Patent: June 11, 2019Assignee: Samtec, Inc.Inventors: Chadrick Paul Faith, Gary Ellsworth Biddle, Randall Eugene Musser, Jonathan Earl Buck
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Patent number: D965530Type: GrantFiled: May 1, 2019Date of Patent: October 4, 2022Assignee: Samtec, Inc.Inventors: Chadrick Paul Faith, Gary Ellsworth Biddle, Randall Eugene Musser, Jonathan Earl Buck
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Patent number: D967770Type: GrantFiled: May 1, 2019Date of Patent: October 25, 2022Assignee: SAMTEC, INC.Inventors: Chadrick Paul Faith, Gary Ellsworth Biddle, Randall Eugene Musser, Jonathan Earl Buck