Patents by Inventor Gary Escher

Gary Escher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for adjoining adjacent coatings on a processing element
    Patent number: 7560376
    Abstract: Two or more coatings applied to processing elements of a plasma processing system are treated with protective barriers or coatings. A method is described for adjoining two or more coatings on the processing element. Having applied a first protective barrier, a portion of the first protective barrier is treated. A second protective barrier is then applied over at least a portion of a region to which the first protective barrier was applied.
    Type: Grant
    Filed: March 17, 2004
    Date of Patent: July 14, 2009
    Assignee: Tokyo Electron Limited
    Inventors: Gary Escher, Mark A. Allen, Yasuhisa Kudo
  • Barrier layer for a processing element and a method of forming the same
    Patent number: 7291566
    Abstract: In order to mitigate erosion of exposed processing elements in a processing system by the process and any subsequent contamination of the substrate in the processing system, processing elements exposed to the process are coated with a protective barrier. The protective barrier comprises a protective layer that is resistant to erosion by the plasma, and a bonding layer that improves the adhesion of the protective layer to the processing element to mitigate possible process contamination by failure of the protective layer.
    Type: Grant
    Filed: March 18, 2004
    Date of Patent: November 6, 2007
    Assignee: Tokyo Electron Limited
    Inventors: Gary Escher, Mark A. Allen
  • Method for adjoining adjacent coatings on a processing element
    Publication number: 20070142956
    Abstract: Two or more coatings applied to processing elements of a plasma processing system are treated with protective barriers or coatings. A method is described for adjoining two or more coatings on the processing element. Having applied a first protective barrier, a portion of the first protective barrier is treated. A second protective barrier is then applied over at least a portion of a region to which the first protective barrier was applied.
    Type: Application
    Filed: March 17, 2004
    Publication date: June 21, 2007
    Inventors: Gary Escher, Mark Allen, Yasuhisa Kudo
  • Barrier layer for a processing element and a method of forming the same
    Publication number: 20060183344
    Abstract: In order to mitigate erosion of exposed processing elements in a processing system by the process and any subsequent contamination of the substrate in the processing system, processing elements exposed to the process are coated with a protective barrier. The protective barrier comprises a protective layer that is resistant to erosion by the plasma, and a bonding layer that improves the adhesion of the protective layer to the processing element to mitigate possible process contamination by failure of the protective layer.
    Type: Application
    Filed: March 18, 2004
    Publication date: August 17, 2006
    Applicant: Tokyo Electron Limited
    Inventors: Gary Escher, Mark Allen