Abstract: An improved vehicle crash sensing apparatus quickly and reliably characterizes frontal impacts with only minimal data processing requirements. Two or more longitudinally separated piezoelectric strips strategically located in a frontal portion of the vehicle produce impact signals that are analyzed to characterize the type of impact and the structural crush rate. In a simple implementation involving only two piezoelectric strips, a first strip extends laterally along a forward portion of the front bumper, and a second strip extends laterally along a forward portion of the hood panel, above and rearward of the first strip. In cases where an impact signal is developed by only one of the two strips, a high (under-ride) or low (over-ride) impact is indicated. If impact signals are developed by both strips, the intervening time is measured as an indication of the structural crush rate.

Abstract: An improved vehicle crash sensing apparatus quickly and reliably characterizes frontal impacts with only minimal data processing requirements. Two or more longitudinally separated piezoelectric strips strategically located in a frontal portion of the vehicle produce impact signals that are analyzed to characterize the type of impact and the structural crush rate. In a simple implementation involving only two piezoelectric strips, a first strip extends laterally along a forward portion of the front bumper, and a second strip extends laterally along a forward portion of the hood panel, above and rearward of the first strip. In cases where an impact signal is developed by only one of the two strips, a high (under-ride) or low (over-ride) impact is indicated. If impact signals are developed by both strips, the intervening time is measured as an indication of the structural crush rate.

Abstract: A method and assembly for mounting an IC semiconductor device to a substrate using flip chip technology. The assembly generally entails a flip chip having a first surface, an oppositely-disposed second surface, an integrated circuit that includes a vertical device on the first surface, and an electrical contact for the vertical device on the second surface. The flip chip is bonded with first solder connections to a first conductor pattern on a substrate, so that the first solder connections electrically and mechanically connect the flip chip to the substrate. The assembly further includes an electrical contact member that is positioned so that the flip chip is between the contact member and the substrate. The contact member is electrically and mechanically connected to a second conductor pattern on the substrate with second solder connections. A third solder connection electrically and mechanically connects the contact member to the electrical contact on the second surface of the flip chip.