Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.

Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.

Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.

Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.

Abstract: A microencapsulatable solvent adhesive composition for coupling plastic conduits, such as pipes, connectors and related fittings comprises a water-insoluble polymer and a mixture of volatile organic solvents for the polymer, each of the solvents having 6 to 40 carbon atoms. This solvent adhesive composition is suitable for microencapsulation by aqueous-based microencapsulation processes. A plurality of microcapsules encapsulating the solvent adhesive composition are bound to a polymeric surface of a conduit, such as a pipe connector or fitting, by a binder composition, to form a surface coated with a layer of rupturable microcapsules. When the microcapsules are ruptured upon joining of the coated conduit to a second conduit, the volume of the released solvent adhesive composition is sufficient to cement the surfaces together.

Abstract: An imaging system in which images are formed by image-wise exposing a layer containing a chromogenic material and a photosensitive composition in which at least the photosensitive composition is encapsulated in a lyer of pressure rupturable capsules. Exposure and capsule rupture renders the chromogenic material image-wise accessible to the developer for a patterned image forming reaction.

Abstract: A color image forming process wherein images are formed by reaction of cyan, magenta and yellow color precursors with a developer material, the reaction is image-wise controlled by image-wise exposure of a photosensitive composition encapsulated in pressure rupturable capsules, image-wise exposure of the photosensitive composition and rupture of the capsules releases the color precursor for patterned reaction with the developer material.

Abstract: Imaging materials employing photosensitive microcapsules having improved film speed are disclosed wherein the microcapsules contain a photoinitiator system including an absorber, a coinitiator and an autoxidizer; the absorber is a compound such as an aromatic ketone, the coinitiator and the autoxidizer are different but may be compounds such as N,N-dialkylanilines; the coinitiator and autoxidizer are selected such that free radical generation and oxygen consumption occur with optimum efficiency thereby providing an imaging material having high film speed.

Abstract: A process for forming images which comprises forming a continuous layer of photosensitive microparticles, said microparticles being formed from a material which becomes tacky upon exposure to actinic radiation, image-wise exposing said layer to actinic radiation such that said particles become tacky in the exposed areas, assembling said layer with a receive sheet, and transferring said microparticles to said receiver sheet in the exposed areas.

Abstract: An imaging system in which images are formed by image-wise exposing a layer containing a chromogenic material and a photosensitive composition in which at least the photosensitive composition is encapsulated in a layer of pressure rupturable capsules. Exposure and capsule rupture renders the chromogenic material image-wise accessible to the developer for a patterned image forming reaction.

Abstract: Imaging systems employing photosensitive microcapsules having improved film speed are disclosed wherein the microcapsules contain a photosensitive composition in which the photoinitiator system includes a photobleachable sensitizer such as a 3-substituted coumarin compound; the invention is particularly useful in providing self-contained imaging systems which are sensitive at 390-500 nm but which can be photobleached to reduce background yellow; an imaging process including a photobleaching step following exposure and development is also disclosed.

Abstract: An imaging system in which images are formed by image-wise exposing a layer containing a chromogenic material and a photosensitive composition in which at least the photosensitive composition is encapsulated in a layer of pressure rupturable capsules. Exposure and capsule rupture renders the chromogenic material image-wise accessible to the developer for a patterned image forming reaction.

Abstract: A transfer imaging system is disclosed wherein images are formed by image-wise exposing a layer comprising a chromogenic material and pressure rupturable capsules containing, as an internal phase, a photosensitive composition. In a preferred embodiment, the chromogenic material is encapsulated with the photosensitive composition. Upon exposure and capsule rupture the chromogenic material is image-wise transferrable to a developer or copy sheet where the chromogenic material reacts with a developer to form an image. Preferred systems are sensitive to U.V. or blue light in the wavelength range of 380 to 480 nm.