Abstract: A substrate having a photonic device mounted thereon with a working portion that is operably connected to at least one electrical lead. A molded optical portion having a surface for light signal to enter and to exit is formed that encapsulates the substrate, the photonic device, and a portion of the first and second electrical lead. An optical connector is formed to plug into the molded optical portion to connect a fiber bundle thereto and the optical portion is electrically connected to an interconnect module.

Abstract: An article and method for making an integrated light emitting optical fiber (101) is provided. The optical fiber (101) having an optical surface (106) and an external surface (105) is provided. A first conductive layer (109) is disposed on the optical fiber (101). A light emitting layer (115) is disposed on a portion of the optical surface (106) of the optical fiber (101) and a second conductive layer (121) is disposed on the light emitting layer (115).

Abstract: A multi-piece body (102) having a first hollow body (103) with a surface (105) and a second hollow body (108) with a surface (110) is provided. The first hollow body (103) and the second hollow body (108) is hingeably affixed such that the surface (105) of the first hollow body (103) and the surface (110) of the second hollow body (108) are capable of being closed on each other. A computer including a processor (560) for manipulating data, memory for data storage, an input for entering data, and an output for removing data is located in the multi-piece body (102). A plurality of optical displays (116) are operably coupled to the electronics 130, thereby enabling data to be optically displayed with the plurality of page displays (116).

Abstract: A substrate having a photonic device mounted thereon with a working portion that is operably connected to at least one electrical lead. A molded optical portion having a surface for light signal to enter and to exit is formed that encapsulates the substrate, the photonic device, and a portion of the first and second electrical lead. An optical connector is formed to plug into the molded optical portion to connect a fiber bundle thereto and the optical portion is electrically connected to an interconnect module.

Abstract: An article and method for manufacturing an optical reading head (400,500) including an optically transparent substrate (100) with a first surface (103) and a second surface (116), wherein the first surface (103) and the second surface (116) are .joined at an angle. Depositing a plurality of layers having an upper portion (114), a middle portion 111, 112, 113), and a lower portion (101) that are optically active on the first and second surfaces (103, 116) of the optically transparent substrate (100). Forming light emitting devices (406, 407) in the plurality of layers on the second surface (116), thereby generating light emitting devices (406, 407) on the angle in the plurality of layers on the second surface (116). Positioning a detection device (402) in a normal plane to the first surface (103).

Abstract: An article and method for manufacturing an optical reading head (400,500) including an optically transparent substrate (100) with a first surface (103) and a second surface (116), wherein the first surface (103) and the second surface (116) are joined at an angle. Depositing a plurality of layers having an upper portion (114), a middle portion (111, 112, 113), and a lower portion (101) that are optically active on the first and second surfaces (103, 116) of the optically transparent substrate (100). Forming light emitting devices (406, 407) in the plurality of layers on the second surface (116), thereby generating light emitting devices (406, 407) on the angle in the plurality of layers of the second surface (116). Positioning a detection device (402) in a normal plane to the first surface (103).

Abstract: A method for the selective deposition of metals in semiconductor device manufacturing wherein a wafer surface is subjected to a hydrogen species that reduces oxidation on conducting materials while also removing impurities from non-conducting materials. Metals are then selectively deposited upon the conducting materials and not upon the non-conducting materials. It should be understood that the hydrogen treatment step and the selective metal deposition step may be performed simultaneously or by using two separate processing steps.

Abstract: A process is described for producing semiconductor devices using a single master mask which determines the lateral dimensions of certain critical device and/or device contact regions in combination with a surrounding isolation wall. Various dielectric layers and isotropic and anisotropic etching steps are utilized in combination with a series of block-out masks to permit etching of a trench in the location of the peripheral isolation wall image in the master mask which is subsequently filled with a dielectric-semiconductor combination. For the case of a vertical bipolar transistor, a base region is implanted using an oversize selector mask. Successive block-out masks are then used to select the particular openings in the master mask which will form the base contact, the emitter and emitter contact and the collector contact. No precision alignments are required between the master mask and the selector or block-out masks.