Abstract: A micro-electromechanical systems (MEMS) transducer (100, 700) is adapted to use lateral axis vibration to generate non-planar oscillations in a pair of teeter-totter sense mass structures (120/140, 720/730) in response to rotational movement of the transducer about the rotation axis (170, 770) with sense electrodes connected to add pickups (e.g., 102/107, 802/807) diagonally from the pair of sense mass structures to cancel out signals associated with rotation vibration.

Abstract: A disclosed example method to detect eligibility for wireless charging at a power transmitting unit involves receiving a measured charging pattern from a power receiving unit that is in communication with the power transmitting unit. When the measured charging pattern does not match a reference charging pattern used to modulate an electrical current at a transmitter resonator of the power transmitting unit, the power receiving unit is not eligible for wireless charging by the power transmitting unit. When the measured charging pattern does match the reference charging pattern, the power receiving unit is eligible for wireless charging by the power transmitting unit.

Abstract: A MEMS sensor (20, 86) includes a support structure (26) suspended above a surface (28) of a substrate (24) and connected to the substrate (24) via spring elements (30, 32, 34). A proof mass (36) is suspended above the substrate (24) and is connected to the support structure (26) via torsional elements (38). Electrodes (42, 44), spaced apart from the proof mass (36), are connected to the support structure (26) and are suspended above the substrate (24). Suspension of the electrodes (42, 44) and proof mass (36) above the surface (28) of the substrate (24) via the support structure (26) substantially physically isolates the elements from deformation of the underlying substrate (24). Additionally, connection via the spring elements (30, 32, 34) result in the MEMS sensor (22, 86) being less susceptible to movement of the support structure (26) due to this deformation.

Abstract: A spring system (74) links a pair of drive masses (30, 32) of a MEMS device (72). The spring system (74) includes stiff beams (76, 78, 80, 82) oriented to form a parallelogram arrangement (84). The beams are oriented diagonal to a drive direction (56) of the masses (30, 32). Diagonally opposing corners (86, 88) of the parallelogram arrangement (84) are coupled to the drive masses (30, 32). A spring (90) is coupled to a corner (94) and a spring (92) is coupled to a diagonally opposing corner (96) of the parallelogram arrangement. The springs (90, 92) are interconnected with a sense frame (34) surrounding the drive masses. The beams and side springs are stiff to substantially prevent in-phase motion (66) of the drive masses. However, rotationally compliant flexures (102, 104, 106, 108), allow the arrangement (84) to collapse and expand to enable anti-phase motion (60) of the drive masses.

Abstract: An inertial sensor (20) includes a drive mass (30) configured to undergo oscillatory motion and a sense mass (32) linked to the drive mass (30). On-axis torsion springs (58) are coupled to the sense mass (32), the on-axis torsion springs (58) being co-located with an axis of rotation (22). The inertial sensor (20) further includes an off-axis spring system (60). The off-axis spring system (60) includes off-axis springs (68, 70, 72, 74), each having a connection interface (76) coupled to the sense mass (32) at a location on the sense mass (32) that is displaced away from the axis of rotation (22). Together, the on-axis torsion springs (58) and the off-axis spring system (60) enable the sense mass (32) to oscillate out of plane about the axis of rotation (22) at a sense frequency that substantially matches a drive frequency of the drive mass (30).

Abstract: A MEMS device (20) includes a proof mass (32) coupled to and surrounding an immovable structure (30). The immovable structure (30) includes fixed fingers (36, 38) extending outwardly from a body (34) of the structure (30). The proof mass (32) includes movable fingers (60), each of which is disposed between a pair (62) of the fixed fingers (36, 38). A central area (42) of the body (34) is coupled to an underlying substrate (24), with the remainder of the immovable structure (30) and the proof mass (32) being suspended above the substrate (24) to largely isolate the MEMS device (20) from package stress, Additionally, the MEMS device (20) includes isolation trenches (80) and interconnects (46, 50, 64) so that the fixed fingers (36), the fixed fingers (38), and the movable fingers (60) are electrically isolated from one another to yield a differential device configuration.

Abstract: A MEMS sensor (20, 86) includes a support structure (26) suspended above a surface (28) of a substrate (24) and connected to the substrate (24) via spring elements (30, 32, 34). A proof mass (36) is suspended above the substrate (24) and is connected to the support structure (26) via torsional elements (38). Electrodes (42, 44), spaced apart from the proof mass (36), are connected to the support structure (26) and are suspended above the substrate (24). Suspension of the electrodes (42, 44) and proof mass (36) above the surface (28) of the substrate (24) via the support structure (26) substantially physically isolates the elements from deformation of the underlying substrate (24). Additionally, connection via the spring elements (30, 32, 34) result in the MEMS sensor (22, 86) being less susceptible to movement of the support structure (26) due to this deformation.

Abstract: A microelectromechanical systems (MEMS) sensor (40) includes a substrate (46) and a suspension anchor (54) formed on a planar surface (48) of the substrate (46). A first folded torsion spring (58) and a second folded torsion spring (60) interconnect the movable element (56) with the suspension anchor (54) to suspend the movable element (56) above the substrate (46). The folded torsion springs (58, 60) are each formed from multiple segments (76) that are linked together by bar elements (78) in a serpentine fashion. The folded torsion springs (58, 60) have an equivalent shape and are oriented relative to one another in rotational symmetry about a centroid (84) of the suspension anchor (54).

Abstract: A micro-electromechanical systems (MEMS) transducer (100, 700) is adapted to use lateral axis vibration to generate non-planar oscillations in a pair of teeter-totter sense mass structures (120/140, 720/730) in response to rotational movement of the transducer about the rotation axis (170, 770) with sense electrodes connected to add pickups (e.g., 102/107, 802/807) diagonally from the pair of sense mass structures to cancel out signals associated with rotation vibration.

Abstract: An inertial sensor (20) includes a drive mass (30) configured to undergo oscillatory motion and a sense mass (32) linked to the drive mass (30). On-axis torsion springs (58) are coupled to the sense mass (32), the on-axis torsion springs (58) being co-located with an axis of rotation (22). The inertial sensor (20) further includes an off-axis spring system (60). The off-axis spring system (60) includes off-axis springs (68, 70, 72, 74), each having a connection interface (76) coupled to the sense mass (32) at a location on the sense mass (32) that is displaced away from the axis of rotation (22). Together, the on-axis torsion springs (58) and the off-axis spring system (60) enable the sense mass (32) to oscillate out of plane about the axis of rotation (22) at a sense frequency that substantially matches a drive frequency of the drive mass (30).

Abstract: A MEMS device (20) includes a proof mass (32) coupled to and surrounding an immovable structure (30). The immovable structure (30) includes fixed fingers (36, 38) extending outwardly from a body (34) of the structure (30). The proof mass (32) includes movable fingers (60), each of which is disposed between a pair (62) of the fixed fingers (36, 38). A central area (42) of the body (34) is coupled to an underlying substrate (24), with the remainder of the immovable structure (30) and the proof mass (32) being suspended above the substrate (24) to largely isolate the MEMS device (20) from package stress, Additionally, the MEMS device (20) includes isolation trenches (80) and interconnects (46, 50, 64) so that the fixed fingers (36), the fixed fingers (38), and the movable fingers (60) are electrically isolated from one another to yield a differential device configuration.

Abstract: A microelectromechanical systems (MEMS) sensor (40) includes a substrate (46) and a suspension anchor (54) formed on a planar surface (48) of the substrate (46). A first folded torsion spring (58) and a second folded torsion spring (60) interconnect the movable element (56) with the suspension anchor (54) to suspend the movable element (56) above the substrate (46). The folded torsion springs (58, 60) are each formed from multiple segments (76) that are linked together by bar elements (78) in a serpentine fashion. The folded torsion springs (58, 60) have an equivalent shape and are oriented relative to one another in rotational symmetry about a centroid (84) of the suspension anchor (54).

Abstract: A microelectromechanical systems (MEMS) sensor (52) includes a substrate (62) a movable element (58) spaced apart from the substrate (62), suspension anchors (66, 68, 70, 72) formed on the substrate (62), and compliant members (74) interconnecting the movable element (58) with the suspension anchors. The MEMS sensor (52) further includes fixed fingers (76) and fixed finger anchors (78) attaching the fixed fingers (76) to the substrate (62). The movable element (58) includes openings (64). At least one of the suspension anchors resides in at least one of the multiple openings (64) and pairs (94) of the fixed fingers (76) reside in other multiple openings (64). The MEMS sensor (52) is symmetrically formed, and a location of the fixed finger anchors (78) defines an anchor region (103) within which the suspension anchors (66, 68, 70, 72) are positioned.

Abstract: A MEMS device (20) includes a substrate (22), a proof mass (28), and a frame structure (30) laterally spaced apart from the proof mass (28). Compliant members (36) are coupled to the proof mass (28) and the frame structure (30) to retain the proof mass (28) suspended above the surface (26) of the substrate (22) without directly coupling the proof mass (28) to the substrate (22). Anchors (32) suspend the frame structure (30) above the surface (26) of the substrate (22) without directly coupling the structure (30) to the substrate (22), and retain the structure (30) immovable relative to the substrate (22) in a sense direction (42). The compliant members (36) enable movement of the proof mass (28) in the sense direction (42). Movable fingers (38) extending from the proof mass (28) are disposed between fixed fingers (46) extending from the frame structure (30) to form a differential capacitive structure.

Abstract: A transducer package 20 includes a substrate 32 having a first axis of symmetry 36 and a second axis of symmetry 38 arranged orthogonal to the first axis of symmetry 36. At least a first sensor 50 and a second sensor 52 each of which are symmetrically arranged on the substrate 32 relative to one of the first and second axes of symmetry 36 and 38.The first and second sensors 50 and 52 are adapted to detect movement parallel to the other of the first and second axes of symmetry 36 and 38. The first sensor 50 is adapted to detect movement over a first sensing range and the second sensor 52 is adapted to detect movement over a second sensing range, the second sensing range differing from the first sensing range.

Abstract: A microelectromechanical systems (MEMS) sensor (52) includes a substrate (62) a movable element (58) spaced apart from the substrate (62), suspension anchors (66, 68, 70, 72) formed on the substrate (62), and compliant members (74) interconnecting the movable element (58) with the suspension anchors. The MEMS sensor (52) further includes fixed fingers (76) and fixed finger anchors (78) attaching the fixed fingers (76) to the substrate (62). The movable element (58) includes openings (64). At least one of the suspension anchors resides in at least one of the multiple openings (64) and pairs (94) of the fixed fingers (76) reside in other multiple openings (64). The MEMS sensor (52) is symmetrically formed, and a location of the fixed finger anchors (78) defines an anchor region (103) within which the suspension anchors (66, 68, 70, 72) are positioned.

Abstract: A gyro sensor configured to sense an angular rate about a rotational axis includes a drive mass configured to undergo oscillatory linear motion within a plane, and a sense mass configured to undergo an oscillatory motion out of the plane as a function of the angular rate. A link spring component connects the sense mass to the drive mass such that the sense mass is substantially decoupled from the drive mass with respect to the oscillatory linear motion of the drive mass, but is coupled to the drive mass with respect to the oscillatory motion out of the plane of the sense mass.

Abstract: A transducer package 20 includes a substrate 32 having a first axis of symmetry 36 and a second axis of symmetry 38 arranged orthogonal to the first axis of symmetry 36. At least a first sensor 50 and a second sensor 52 each of which are symmetrically arranged on the substrate 32 relative to one of the first and second axes of symmetry 36 and 38. The first and second sensors 50 and 52 are adapted to detect movement parallel to the other of the first and second axes of symmetry 36 and 38. The first sensor 50 is adapted to detect movement over a first sensing range and the second sensor 52 is adapted to detect movement over a second sensing range, the second sensing range differing from the first sensing range.

Abstract: A gyro sensor configured to sense an angular rate about a rotational axis includes a drive mass configured to undergo oscillatory linear motion within a plane, and a sense mass configured to undergo an oscillatory motion out of the plane as a function of the angular rate. A link spring component connects the sense mass to the drive mass such that the sense mass is substantially decoupled from the drive mass with respect to the oscillatory linear motion of the drive mass, but is coupled to the drive mass with respect to the oscillatory motion out of the plane of the sense mass.

Abstract: MEMS devices (100) and methods for forming the devices have now been provided. In one exemplary embodiment, the MEMS device (100) comprises a substrate (106) having a surface, an electrode (128) having a first portion coupled to the substrate surface, and a second portion movably suspended above the substrate surface, and a stress-release mechanism (204) disposed on the electrode second portion, the stress-release mechanism (204) including a first slot (208) integrally formed in the electrode. In another exemplary embodiment, the substrate (106) includes an anchor (134, 136) and the stress-release mechanism 222 is formed adjacent the anchor (134, 136).