Abstract: The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.

Abstract: A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated foundation structure in an adhesive polymer material, such as epoxy. Components, such as spring probes, can then be constructed on the plated foundation. The adhesive polymer material better assures the adhesion of the metal foundation structure to the substrate surface by counteracting forces applied to an element, such as a spring probe, attached to the plated foundation.

Abstract: A method and apparatus for reducing echo feedback in a wireless communication system (10) is accomplished when a receiving communication unit (24) senses a feedback signal, or echo, via an ancillary communication path. The receiving communication unit is a targeted recipient of an original audio signal generated by a transmitting communication unit (22), where the original audio signal (42) is conveyed to the receiving communication unit. Upon detecting the feedback signal and determining that it exceeds a feedback threshold, the receiving communication unit attenuates an audible output of the original signal to reduce echo to the transmitting communication unit. In addition, the receiving communication unit, and/or the transmitting communication unit include echo canceller to further minimize the echo within the digital communication system.

Abstract: Apparatuses and methods for cleaning test probes used in a semiconductor testing machine of the type having a plurality of test probes configured to contact the surface of a semiconductor wafer to test one or more dies formed thereon. In one embodiment, the apparatus includes a roller-support arm and a cylindrical roller supported by the roller-support arm. The roller has an outer surface comprising a sticky material. Debris on the probes will adhere to the sticky material as roller is rolled across tips of the probes. The probes are thereby cleaned.

Abstract: A method of forming an interconnection, including a spring contact element, by lithographic techniques. In one embodiment, the method includes applying a masking material over a first portion of a substrate, the masking material having an opening which will define a first portion of a spring structure, depositing a structure material (e.g., conductive material) in the opening, and overfilling the opening with the structure material, removing a portion of the structure material, and removing a first portion of the masking material. In this embodiment, at least a portion of the first portion of the spring structure is freed of masking material. In one aspect of the invention, the method includes planarizing the masking material layer and structure material to remove a portion of the structure material. In another aspect, the spring structure formed includes one of a post portion, a beam portion, and a tip structure portion.

Abstract: A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data regarding a newly designed semiconductor device is received along with data describing the tester and testing algorithms to be used to test the semiconductor device. Using the received data, one or more of the prefabricated elements is selected. Again using the received data, one or more of the selected prefabricated elements is customized. The probe card assembly is then built using the selected and customized elements.

Abstract: A method and apparatus for reducing echo feedback in a wireless communication system (10) is accomplished when a receiving communication unit (24) senses a feedback signal, or echo, via an ancillary communication path. The receiving communication unit is a targeted recipient of an original audio signal generated by a transmitting communication unit (22), where the original audio signal (42) is conveyed to the receiving communication unit. Upon detecting the feedback signal and determining that it exceeds a feedback threshold, the receiving communication unit attenuates an audible output of the original signal to reduce echo to the transmitting communication unit. In addition, the receiving communication unit, and/or the transmitting communication unit include echo canceller to further minimize the echo within the digital communication system.

Abstract: A method and apparatus for reducing echo feedback in a wireless communication system (10) is accomplished when a receiving communication unit (24) senses a feedback signal, or echo, via an ancillary communication path. The receiving communication unit is a targeted recipient of an original audio signal generated by a transmitting communication unit (22), where the original audio signal (42) is conveyed to the receiving communication unit. Upon detecting the feedback signal and determining that it exceeds a feedback threshold, the receiving communication unit attenuates an audible output of the original signal to reduce echo to the transmitting communication unit. In addition, the receiving communication unit, and/or the transmitting communication unit include echo canceller to further minimize the echo within the digital communication system.

Abstract: Group communications between subscribers (20, 22) affiliated with a terrestrial communication system (12, 14) and subscribers (46, 48) affiliated with a satellite communication system (10) is begun when a subscriber has initiated a group communication request. The request is provided, via a controller (i.e., a terrestrial system controller or satellite system controller depending on which communication system the requesting subscriber is affiliated with), to a systems interface (36). Upon receiving the request, the systems interface determines whether subscribers that are identified to participate in the group communication are located in the terrestrial system and/or the satellite system. If the group of subscribers have members in both communication systems, the systems interface establishes satellite communication links for each subscriber affiliated with the satellite communication system and establishes a terrestrial communication link for subscribers affiliated with a terrestrial communication system.

Abstract: A semiconduct chip assembly includes a chip, terminals permanently electrically connected to the chip by flexible leads and a resilient element or elements for biasing the terminals away from the chip. The chip is permanently engaged with a substrate having contact pads so that the terminals are disposed between the chip and the substrate and the terminals engage the contact pads under the influence of the force applied by the resilient element. The terminals typically are provided on a flexible sheet-like dielectric interposer and the resilient element is disposed between the interposer and the chip. The assembly of the chip and the terminals can be tested prior to engagement with the substrate. Because engagement of this assembly with the substrate does not involve soldering or other complex bonding processes, it is reliable. The assembly can be extremely compact and may occupy an area only slightly larger than the area of the chip itself.

Abstract: A semiconduct chip assembly includes a chip, terminals permanently electrically connected to the chip by flexible leads and a resilient element or elements for biasing the terminals away from the chip. The chip is permanently engaged with a substrate having contact pads so that the terminals are disposed between the chip and the substrate and the terminals engage the contact pads under the influence of the force applied by the resilient element. The terminals typically are provided on a flexible sheet-like dielectric interposer and the resilient element is disposed between the interposer and the chip. The assembly of the chip and the terminals can be tested prior to engagement with the substrate. Because engagement of this assembly with the substrate does not involve soldering or other complex bonding processes, it is reliable. The assembly can be extremely compact and may occupy an area only slightly larger than the area of the chip itself.

Abstract: Processing of dispatch calls in a multi-site communication system begins when a source communication unit initiates a request for a dispatch call. The request is routed to a controller which assigns a controlled device to support the request. In addition, the controller identifies the destination communication units, which site each of the destination units are in, and what controlled devices are needed to support the dispatch call. Having identified the controlled devices, the controller assigns all of the controlled devices needed the same temporary network address. With all the controlled devices having the same temporary network address, the controlled device assigned to support the request can transmit the messages generated by the source communication unit to other controlled devices using the temporary network address. Thus only one representation of a message produced by the source communication unit is transmitted from the assigned controlled device.

Abstract: A communication unit may operate in either a trunking communication system and a cellular communication system when the coverage areas of each system overlap. Typically, the communication unit is affiliated with the trunking communication system and operates normally therein. When a call is received or being placed via the cellular communication system, the communication unit transfers its affiliation to the cellular communication system and operates therein. The communication unit is prompted by the trunking communication system to transfer its affiliation for incoming calls and does so automatically for outgoing calls. Once the communication ends, the communication unit transfers its affiliation back to the trunking communication system within a predetermined period of time.