Abstract: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

Abstract: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

Abstract: Method and systems for clamping at least one circuit card within a case are provided. The method includes compressing axially at least one resilient element between a head of a shaft and a nut disposed on the shaft so that the at least one resilient element bulges generally perpendicularly to the axial direction and into engagement with the at least one circuit card, exerting a force on the at least one circuit card using the at least one resilient element and maintaining the force on the at least one circuit card using the at least one resilient element.

Abstract: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

Abstract: Methods for molding a surround over a liner to form a composite shell are provided. The liner is placed in a mold and molten surround material is injected into the mold so as to surround the liner. A surface of a protrusion of the liner abuts the mold so that the surface is exposed and is substantially flush with an exterior surface of the surround after the composite shell is removed from the mold. Molten surround material flows into a slot in a perimeter of the protrusion so that when the surround material solidifies, a rib of surround material extends into the slot to form a pressure seal between the liner and the surround. An adhesive is applied to the liner before placing the liner in the mold for reducing relative movement between the liner and surround as the surround material solidifies and the liner and surround cool.

Abstract: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

Abstract: A system and method for rehabilitating a serving area interface cabinet (SAIC) and deploying broadband services comprises removing an existing SAIC and replacing the existing SAIC with a new combination electronic cabinet and SAIC, wherein the replacing occurs without service interruption.

Abstract: A method for confining circuit cards to different locations within a housing is provided. The housing includes a frame having an array of slots, each containing one of the circuit cards. In one embodiment, the receptacle has a cam that is selectively engageable with the frame for clamping the circuit cards within the frame. In another embodiment, a shaft is rotatably attached to the receptacle. The shaft has a head at one end and a nut opposite the head. A resilient element is disposed on the shaft between the head and the nut. The resilient element is axially compressible between the head and nut to bulge generally perpendicularly to the axial direction into engagement with the frame for clamping the circuit cards within the frame.

Abstract: A method for confining circuit cards to different locations within a housing is provided. The housing includes a frame having an array of slots, each containing one of the circuit cards. In one embodiment, the receptacle has a cam that is selectively engageable with the frame for clamping the circuit cards within the frame. In another embodiment, a shaft is rotatably attached to the receptacle. The shaft has a head at one end and a nut opposite the head. A resilient element is disposed on the shaft between the head and the nut. The resilient element is axially compressible between the head and nut to bulge generally perpendicularly to the axial direction into engagement with the frame for clamping the circuit cards within the frame.

Abstract: Method and systems for clamping at least one circuit card within a case are provided. The method includes compressing axially at least one resilient element between a head of a shaft and a nut disposed on the shaft so that the at least one resilient element bulges generally perpendicularly to the axial direction and into engagement with the at least one circuit card, exerting a force on the at least one circuit card using the at least one resilient element and maintaining the force on the at least one circuit card using the at least one resilient element.

Abstract: A receptacle for confining circuit cards to different locations within a housing and that has a frame is provided. The frame has an array of slots, each containing one of the circuit cards. In one embodiment, the receptacle has a cam that is selectively engageable with the frame for clamping the circuit cards within the frame. In another embodiment, a shaft is rotatably attached to the receptacle. The shaft has a head at one end and a nut opposite the head. A resilient element is disposed on the shaft between the head and the nut. The resilient element is axially compressible between the head and nut to bulge generally perpendicularly to the axial direction into engagement with the frame for clamping the circuit cards within the frame.

Abstract: In one embodiment, a case for confining at least one circuit card to a location within a housing is provided. The case has at least one slot that contains the circuit card. The case also has at least one actuator adapted to clamp the circuit card within the slot.

Abstract: A housing for circuit cards is provided. The housing has a shell. A thermally conductive liner integral with the shell lines an interior of the shell. A protrusion of the liner extends through the shell and contacts the shell to form a pressure seal between the liner and the shell. A heat sink is disposed on an exterior surface of the shell and is thermally coupled to the protrusion of the liner. A case is disposed within the liner and is thermally coupled to the liner. The case is adapted to receive a plurality of circuit cards so that the plurality of circuit cards is thermally coupled to the case.

Abstract: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

Abstract: Methods for molding a surround over a liner to form a composite shell are provided. The liner is placed in a mold and molten surround material is injected into the mold so as to surround the liner. A surface of a protrusion of the liner abuts the mold so that the surface is exposed and is substantially flush with an exterior surface of the surround after the composite shell is removed from the mold. Molten surround material flows into a slot in a perimeter of the protrusion so that when the surround material solidifies, a rib of surround material extends into the slot to form a pressure seal between the liner and the surround. An adhesive is applied to the liner before placing the liner in the mold for reducing relative movement between the liner and surround as the surround material solidifies and the liner and surround cool.

Abstract: A housing for circuit cards is provided. The housing has a shell. A thermally conductive liner integral with the shell lines an interior of the shell. A protrusion of the liner extends through the shell and contacts the shell to form a pressure seal between the liner and the shell. A heat sink is disposed on an exterior surface of the shell and is thermally coupled to the protrusion of the liner. A case is disposed within the liner and is thermally coupled to the liner. The case is adapted to receive a plurality of circuit cards so that the plurality of circuit cards is thermally coupled to the case.

Abstract: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

Abstract: A cable assembly is provided. The cable assembly includes an interface plate having a raised outer surface and an inner surface. The inner surface is adapted to engage with a housing. The interface plate includes a recess having a channel that is adapted to receive a cable and an opening through the interface plate at one end of the channel to allow the cable to pass through the interface plate. The recess is adapted to receive a sealant that covers the cable once the cable is placed in the channel.

Abstract: In one embodiment, a case for confining at least one circuit card to a location within a housing is provided. The case has at least one slot that contains the circuit card. The case also has at least one actuator adapted to clamp the circuit card within the slot.

Abstract: A receptacle for confining circuit cards to different locations within a housing and that has a frame is provided. The frame has an array of slots, each containing one of the circuit cards. In one embodiment, the receptacle has a cam that is selectively engageable with the frame for clamping the circuit cards within the frame. In another embodiment, a shaft is rotatably attached to the receptacle. The shaft has a head at one end and a nut opposite the head. A resilient element is disposed on the shaft between the head and the nut. The resilient element is axially compressible between the head and nut to bulge generally perpendicularly to the axial direction into engagement with the frame for clamping the circuit cards within the frame.