Patents by Inventor Gary H. Yan

Gary H. Yan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Anti-tin whisker solder and method of manufacture thereof
    Patent number: 9308604
    Abstract: A lead-free solder composition including about 90% to about 99% by weight of a lead-free tin solder based on the total weight of the lead-free solder composition and about 1% to about 10% by weight of a polyhedral oligomeric silsesquioxane based on the total weight of the lead-free solder composition.
    Type: Grant
    Filed: August 14, 2012
    Date of Patent: April 12, 2016
    Assignee: LOCKHEED MARTIN CORPORATION
    Inventors: Gregory T. Daly, Gary H. Yan
  • Anti-tin whisker solder
    Patent number: 8562755
    Abstract: A lead-free solder composition including about 90% to about 99% by weight of a lead-free tin solder based on the total weight of the lead-free solder composition and about 1% to about 10% by weight of a polyhedral oligomeric silsesquioxane based on the total weight of the lead-free solder composition.
    Type: Grant
    Filed: February 4, 2009
    Date of Patent: October 22, 2013
    Assignee: Lockheed Martin Corporation
    Inventors: Gregory T. Daly, Gary H. Yan
  • HDI module with integral conductive electromagnetic shield
    Patent number: 6794222
    Abstract: A method for making high density interconnected modules for radio-frequency, digital processing, or other circuits subject to radiated interference includes the step of applying sets of semiconductor chips to individual regions on an insulating flexible substrate. Electrically conductive, planar walls are procured, each having first and second broad surfaces and a through aperture. The through aperture is dimensioned to fit over at least some of the chips of a module. The aperture is registered with the chips to be surrounded, and the wall is placed over the chips. Liquid encapsulant is applied to fill the resulting cavity, thereby encapsulating the chips. HDI interconnections are made, and the modules are separated. The conductive walls define the module dimensions.
    Type: Grant
    Filed: September 23, 2002
    Date of Patent: September 21, 2004
    Assignee: Lockheed Martin Corporation
    Inventors: Philip P. Kraft, Gary H. Yan, Richard J. Teti, Robert E. Kuffel