Abstract: A system and/or method for coating a substrate. The method may include placing a substrate on a chuck with a first side of the substrate facing upward and a second side of the substrate facing downward. A coating material may be dispensed onto the first side of the substrate. A first gas may flow through a peripheral chamber of a shield member, the first gas exiting the peripheral chamber through an outlet and flowing towards the first side of the substrate. The substrate may be rotated about a rotational axis to form a film of the coating material on the first side of the substrate.

Abstract: A semiconductor processing system, a method of processing semiconductors, and a robot apparatus therefor. The robot apparatus may include: a support structure; a first arm having a first axis and being movably mounted to the support structure, the first arm having a first end effector and a second end effector; a second arm having a second axis and being movably mounted to the support structure, the second arm being spaced apart from the first arm, the second arm having a first end effector and a second end effector; a first drive mechanism configured to move the first arm along the first axis; a second drive mechanism configured to move the second arm along the second axis; and a third drive mechanism configured to move the first and second arms along a third axis that is perpendicular to the first and second axes.

Abstract: A system and/or method for coating a substrate. The system may include a chuck for holding and rotating the substrate, a dispensing subsystem for dispensing a coating material onto the substrate, and a shield member. The shield member may be movable towards and away from the substrate during the coating procedure. The shield member may have an inverted funnel shape. The shield member may include a central chamber through which a solvent vapor flows and a peripheral chamber that is fluidly separated from the central chamber through which a gas flows. During a coating procedure, the shield member may be moved very close to the substrate and the solvent vapor and gas may flow onto the substrate to create a solvent rich ambient around the substrate and prevent aerosols of the coating material from redepositing onto the substrate after being flung off due to spinning of the substrate.

Abstract: A theta robot with integrated preload system in one embodiment includes a cable-operated drive mechanism including a rotatable pulley drum, motor drive operably coupled to the drum by drive cable, and follower piston cylinder operably coupled to the drum by a follower cable. The piston cylinder may be under vacuum and operably applies a tensile load and resistance on the pulley drum via the follower cable which eliminates clearance between meshed driving and driven components of the drive mechanism. When the motor drive feeds out drive cable, the pulley drum rotates in a first rotational direction, and when the motor drive retracts drive cable, the pulley drum rotates in an opposite second rotational direction. The vacuum piston cylinder operates to keep the drive cable in a taut condition when the motor drive feeds out the drive cable. The theta robot has broad applicability to numerous workpiece fabrication processes including semiconductors.

Abstract: Devices for separating gas and liquid components from a fluid are used in a wide variety of processes. These devices may be formed of a housing having a cavity, an inlet, an outlet, and a vent. A diversion structure may be located within the cavity of the housing to allow fluid to flow in a convoluted path which promotes separation of the gas and liquid components. The device may be used in semiconductor fabrication processes or any other processes which require gas-free liquids.

Abstract: A system and/or method for coating a substrate. The system may include a chuck for holding and rotating the substrate, a dispensing subsystem for dispensing a coating material onto the substrate, and a shield member. The shield member may be movable towards and away from the substrate during the coating procedure. The shield member may have an inverted funnel shape. The shield member may include a central chamber through which a solvent vapor flows and a peripheral chamber that is fluidly separated from the central chamber through which a gas flows. During a coating procedure, the shield member may be moved very close to the substrate and the solvent vapor and gas may flow onto the substrate to create a solvent rich ambient around the substrate and prevent aerosols of the coating material from redepositing onto the substrate after being flung off due to spinning of the substrate.

Abstract: A system and/or method for coating a substrate. The system may include a chuck for holding and rotating the substrate, a dispensing subsystem for dispensing a coating material onto the substrate, and a shield member. The shield member may be movable towards and away from the substrate during the coating procedure. The shield member may have an inverted funnel shape. The shield member may include a central chamber through which a solvent vapor flows and a peripheral chamber that is fluidly separated from the central chamber through which a gas flows. During a coating procedure, the shield member may be moved very close to the substrate and the solvent vapor and gas may flow onto the substrate to create a solvent rich ambient around the substrate and prevent aerosols of the coating material from redepositing onto the substrate after being flung off due to spinning of the substrate.

Abstract: A system and/or method for coating a substrate. The system may include a chuck for holding and rotating the substrate, a dispensing subsystem for dispensing a coating material onto the substrate, and a shield member. The shield member may be movable towards and away from the substrate during the coating procedure. The shield member may have an inverted funnel shape. The shield member may include a central chamber through which a solvent vapor flows and a peripheral chamber that is fluidly separated from the central chamber through which a gas flows. During a coating procedure, the shield member may be moved very close to the substrate and the solvent vapor and gas may flow onto the substrate to create a solvent rich ambient around the substrate and prevent aerosols of the coating material from redepositing onto the substrate after being flung off due to spinning of the substrate.

Abstract: A spin coating apparatus, system, and/or method that increase the uniformity of a coating material on a substrate. The spin coating system may be specifically directed for use with polygonal shaped substrates. The spin coating system may include a process chamber within which the substrate is located, spinning on a chuck, during operation. The spin coating system may include gas injection ports that inject a gas into the process chamber so that the gas contacts the substrate along corner portions of its front surface. This injection of the gas increases pressure and prevents excessive build-up of the coating material that may otherwise occur when spin coating polygonal shaped substrates.

Abstract: A method and/or system for coating a substrate with a coating material. The coating material may be a polymer such as a photoresist. The method involves dispensing a coating material onto a substrate during which a temperature differential between the coating material and the substrate is at least 5° C. This temperature differential may be achieved by cooling the substrate and/or heating the coating material prior to dispensing the coating material onto the substrate. Due to the temperature differential, as the coating material contacts the substrate the viscosity of the coating material will increase, assisting the coating material in adhering to the substrate. Then, when the substrate is spun, the coating material with the increased viscosity will remain adhered to the substrate thereby providing a more conformal coating.

Abstract: A method and/or system for coating a substrate with a coating material. The coating material may be a polymer such as a photoresist. The method involves dispensing a coating material onto a substrate during which a temperature differential between the coating material and the substrate is at least 5° C. This temperature differential may be achieved by cooling the substrate and/or heating the coating material prior to dispensing the coating material onto the substrate. Due to the temperature differential, as the coating material contacts the substrate the viscosity of the coating material will increase, assisting the coating material in adhering to the substrate. Then, when the substrate is spun, the coating material with the increased viscosity will remain adhered to the substrate thereby providing a more conformal coating.

Abstract: A spin coating apparatus, system, and/or method that increase the uniformity of a coating material on a substrate. The spin coating system may be specifically directed for use with polygonal shaped substrates. The spin coating system may include a process chamber within which the substrate is located, spinning on a chuck, during operation. The spin coating system may include gas injection ports that inject a gas into the process chamber so that the gas contacts the substrate along corner portions of its front surface. This injection of the gas increases pressure and prevents excessive build-up of the coating material that may otherwise occur when spin coating polygonal shaped substrates.

Abstract: A system and/or method for heat treatment of substrates. The system includes a housing that defines a heating chamber and a door assembly that encloses an opening of the heating chamber. The door assembly may be opened and closed. When opened, the door assembly defines a loading slot for loading substrates into and unloading substrates from the heating chamber. The door assembly is coupled to a first actuator and a control unit is coupled to the actuator to move the door assembly between a plurality of loading positions. The system may also include a loading assembly mounted to the door assembly to facilitate insertion and removal of substrates from the heating chamber.

Abstract: A reflow soldering apparatus, system, and method. The reflow soldering system may include a housing that is alterable between an open state and a closed state, the open state being used for loading and unloading of substrates and the closed state being used during operation. The system may also include a heating assembly located within the chamber and a cooling assembly that is spaced apart from the heating assembly. A support member may be included to support a substrate within the chamber. A first actuator unit may be operably coupled to either the heating and cooling assemblies jointly, or to the support member. Additionally, the system may include a control unit coupled to the first actuator unit to cause relative movement between the substrate and the heating and cooling assemblies. Thus, the substrate can move between the heating and cooling assemblies during the various stages of the reflow soldering process.

Abstract: A reflow soldering apparatus, system, and method. The reflow soldering system may include a housing that is alterable between an open state and a closed state, the open state being used for loading and unloading of substrates and the closed state being used during operation. The system may also include a heating assembly located within the chamber and a cooling assembly that is spaced apart from the heating assembly. A support member may be included to support a substrate within the chamber. A first actuator unit may be operably coupled to either the heating and cooling assemblies jointly, or to the support member. Additionally, the system may include a control unit coupled to the first actuator unit to cause relative movement between the substrate and the heating and cooling assemblies. Thus, the substrate can move between the heating and cooling assemblies during the various stages of the reflow soldering process.

Abstract: A system and/or method for heat treatment of substrates. The system includes a housing that defines a heating chamber and a door assembly that encloses an opening of the heating chamber. The door assembly may be opened and closed. When opened, the door assembly defines a loading slot for loading substrates into and unloading substrates from the heating chamber. The door assembly is coupled to a first actuator and a control unit is coupled to the actuator to move the door assembly between a plurality of loading positions. The system may also include a loading assembly mounted to the door assembly to facilitate insertion and removal of substrates from the heating chamber.

Abstract: An improved technique achieves a uniform photoresist film on a wafer by controlling the volatility of the solvent in a photoresist solution during the bake process step. Because film formation takes place in the bake rather than the spin steps of the process, the improved technique involves using less viscous and therefore less costly and easier to use resists to cast relatively thick photoresist films. Such control is achieved in an enclosed chamber into which a carrier gas is introduced; the carrier gas mixes with gaseous solvent to create a saturating atmosphere in which the rate of evaporation of solvent decreases. This enables the heating of the wafer without the reduction of solvent in the film so that the photoresist can self-level. When the film has self-leveled, the solvent is then baked off as usual.

Abstract: An improved technique for fixedly holding a reticle in a reticle chuck of the reticle simplifies the process of cleaning the back surface of the reticle by exposing the entire back surface. The technique includes approaching the reticle chuck with the reticle held at an initial orientation, aligning the reticle chuck with the initial orientation of the reticle and positioning the front surface of the reticle slightly below the top of a receiving area in the reticle chuck. The technique also includes placing a downward force on a set of spring-loaded pins, each spring-loaded pin configured to move within a corresponding hole in the chuck, the downward force providing a clearance for the reticle to enter a receiving cavity.

Abstract: An improved technique for delivering a fluid to an outlet from a storage container takes the form of a linear peristaltic pump which enables the use of two elements: a single bearing and a valve. The single bearing provides enough pressure to a flexible tube in which the fluid moves to close the tube off at a single location. The valve controls the fluid flow out of the flexible tube at the egress point in conjunction with the bearing and is attached to the flexible tube at a single location. In this manner, when the bearing is engaged with the flexible tube, the bearing divides the flexible tube into two subvolumes, one of which contains fluid to be moved toward the egress point at the far end of the flexible tube and the other creating suction for intake of fluid immediately behind the bearing. A bearing controller moves the bearing along the surface of the flexible tube when so engaged; in doing so, the bearing moves the fluid.

Abstract: A substrate such as a semiconductor wafer is move across the top of an open trough while a liquid is maintained in the trough at a level just above the walls of the trough, as by supplying the liquid to the trough so that the liquid gently overflows the trough. The downwardly-facing surface of the substrate contacts the liquid. The substrate is moved at a constant rate so that the duration of contact is the same for all portions of the surface.