Patents by Inventor Gary Hua

Gary Hua has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240111668
    Abstract: Techniques are provided for implementing an in-memory columnar data store that is configured to either grow or shrink in response to performance prediction data generated from database workload information. A system maintains allocations of volatile memory from a given memory area for a plurality of memory-consuming components in a database system. The system receives for each memory-consuming component, performance prediction data that contains performance predictions for a plurality of memory allocation sizes for the memory-consuming components. The system determines a target memory allocation for an in-memory columnar data store based on the performance predictions. The system determines an incrementally adjusted amount of memory for the in-memory columnar data store and causes the incrementally adjusted amount to be allocated to the in-memory columnar data store.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 4, 2024
    Inventors: Hariharan Lakshmanan, Teck Hua Lee, Vinita Subramanian, Gary Smith, Lijian Wan, Shasank Kisan Chavan, Venkat Raman Senapati
  • Patent number: 6950305
    Abstract: An electronic device has three dimensional surface features molded into an encapsulant forming an electronic package. The electronic package has improved heat transfer compared to conventional electronic devices. The three dimensional features are designed to be moldable.
    Type: Grant
    Filed: May 15, 2003
    Date of Patent: September 27, 2005
    Assignee: Bel Fuse, Inc.
    Inventors: Marshall Miles, Gary Hua
  • Publication number: 20040022031
    Abstract: An electronic device has three dimensional surface features molded into an encapsulant forming an electronic package. The electronic package has improved heat transfer compared to conventional electronic devices. The three dimensional features are designed to be moldable.
    Type: Application
    Filed: May 15, 2003
    Publication date: February 5, 2004
    Applicant: Bel Fuse, Inc.
    Inventors: Marshall Miles, Gary Hua