Abstract: The invention relates to systems and methods for the manufacture of flexible printed wiring (FPW) harnesses of unlimited length three dimensions. In preferred embodiments, in-line raster scanning (e.g., xerography or laser printing) is used to image continuously updated conductor patterns on an uninterrupted (i.e., seamless) web-fed base material, or substrate With in-line manufacturing, an FPW harness equivalent to a discrete RWH of unlimited dimension can be fabricated.

Abstract: A connection to a contact on an electronic component is made by means of a solder preform in the form of a columm, which comprises a solder body at least partially enclosed within a tubular support. The preform is positioned such that its longitudinal axis is approximately parallel to the plane of the contacts at the point at which it is connected thereto.

Abstract: A bi-polar electrocautery needle comprising an inner electrode, an outer electrode and recoverable insulating-locking means for insulating the electrodes from one another and locking them into relative position to one another. And the method of making the bi-polar electrocautery needle in accordance with this invention, the steps including: expanding recoverable dielectric material over an inner electrode; inserting the combination into an outer electrode, and recovering the material between the electrodes for insulating and locking the electrodes into relative position with one another.

Abstract: A bi-polar electrocautery needle comprising an inner electrode, an outer electrode and recoverable insulating-locking member for insulating the electrodes from one another and locking them into relative position to one another. And the method of making the bi-polar electrocautery needle in accordance with this invention, the steps including: expanding recoverable dielectric material over an inner electrode; inserting the combination into an outer electrode, and recovering the material between the electrodes for insulating and locking the electrodes into relative position with one another.

Abstract: A sealing cover for an hermetically sealed container comprises an environmentally resistant metal lid, an intermediate plated metallic "picture frame", and a solder deposit metallurgically bonded to that "frame". Such a cover is particularly adapted for the sealing of semiconductor packages, and is especially advantageous in that it need not employ precious metals.