Abstract: An assembly for storing semiconductor wafers includes a container, a wafer carrier and a plate. The container may be a box having a substantially rectangular bottom surface. The wafer carrier fits in the container. The wafer carrier has a plurality of slots. Each slot is capable of receiving a semiconductor wafer. The plate has a size and shape so as to snugly fit in a predetermined position in the container. The plate substantially prevents motion of the wafer carrier relative to the container. The plate may be an insert formed of a separate piece of material from the wafer carrier. The insert has a substantially rectangular shape so as to fit snugly on the bottom surface of the box. The insert has at least one mounting feature to snugly hold the wafer carrier. For example, the insert may have at least one groove shaped to receive a tab extending from a bottom of the wafer carrier. The insert may be formed of an acetyl homopolymer, polypropylene, polyethylene, or other soft plastic.

Abstract: An assembly for storing semiconductor wafers includes a container, a wafer carrier and a plate. The container may be a box having a substantially rectangular bottom surface. The wafer carrier fits in the container. The wafer carrier has a plurality of slots. Each slot is capable of receiving a semiconductor wafer. The plate has a size and shape so as to snugly fit in a predetermined position in the container. The plate substantially prevents motion of the wafer carrier relative to the container. The plate may be an insert formed of a separate piece of material from the wafer carrier. The insert has a substantially rectangular shape so as to fit snugly on the bottom surface of the box. The insert has at least one mounting feature to snugly hold the wafer carrier. For example, the insert may have at least one groove shaped to receive a tab extending from a bottom of the wafer carrier. The insert may be formed of an acetyl homopolymer, polypropylene, polyethylene, or other soft plastic.

Abstract: A wafer handling technique allows for picking up a wafer from its front side. One or more vacuum ports pull the periphery of the wafer into contact with a ledge raised from a broad surface, providing a friction force that prevents lateral movement of the wafer. A port in the broad surface of the handler flows pressurized gas onto the wafer, thereby preventing contact between the handler and the interior of the wafer. The handler may be sized to be relatively thin, and to cover less than half of the surface of the wafer, thereby allowing for readily loading wafers back-to-back in a furnace boat.