Abstract: An apparatus includes a circuit card assembly; and a nozzle for depositing material on the circuit card assembly, the nozzle and circuit card assembly capable of being angled relative to one another. In operation, the apparatus performs a process including positioning a circuit card assembly and a nozzle for the nozzle to deposit a material on the circuit card assembly; and angling the nozzle and the circuit card assembly relative to one another to facilitate the deposition.

Abstract: A method of forming solder-less printed wiring boards includes attaching a electronic components to a workpiece using an adhesive material. A mold material is added to partially cover the electronic components to form a sub-assembly including the electronic components attached to the mold material and a planar surface on the workpiece side. At least tops of the electronic components extend beyond a height of the mold material. The adhesive material is removed to separate the workpiece and sub-assembly. A first prepreg dielectric is attached to the planar surface of the mold material. First vias are formed in the first prepreg dielectric to expose bondable contacts of the electronic components. The first vias are filled with electrically conductive plugs to provide connections to the bondable contacts of the electronic components. A circuit layer is formed on a surface of the first prepreg dielectric to provide contact to the first plugs.

Abstract: A method of forming solder-less printed wiring boards includes attaching a electronic components to a workpiece using an adhesive material. A mold material is added to partially cover the electronic components to form a sub-assembly including the electronic components attached to the mold material and a planar surface on the workpiece side. At least tops of the electronic components extend beyond a height of the mold material. The adhesive material is removed to separate the workpiece and sub-assembly. A first prepreg dielectric is attached to the planar surface of the mold material. First vias are formed in the first prepreg dielectric to expose bondable contacts of the electronic components. The first vias are filled with electrically conductive plugs to provide connections to the bondable contacts of the electronic components. A circuit layer is formed on a surface of the first prepreg dielectric to provide contact to the first plugs.

Abstract: The present invention is directed to an electronic component assembly and method of manufacture which can be efficiently implemented and which reduces the amount of work required to create a plated through-hole for connecting one circuit to another circuit in an electronic component assembly. During electronic component assembly fabrication, at least a portion of an inner core of the electronic component assembly's heat sink assembly is replaced with a dielectric “zone.” Once the electronic component assembly is manufactured, connections from one circuit on one side of the electronic component assembly to another circuit on the other side of the electronic component assembly can be achieved using plated through-holes. As such, circuit boards can be connected on opposite sides of the electronic component assembly without having to perform the labor intensive connection of circuits through the use of discrete wires or printed flexes.

Abstract: The present invention is directed to an electronic component assembly and method of manufacture which can be efficiently implemented and which reduces the amount of work required to create a plated through-hole for connecting one circuit to another circuit in an electronic component assembly. During electronic component assembly fabrication, at least a portion of an inner core of the electronic component assembly's heat sink assembly is replaced with a dielectric “zone.” Once the electronic component assembly is manufactured, connections from one circuit on one side of the electronic component assembly to another circuit on the other side of the electronic component assembly can be achieved using plated through-holes. As such, circuit boards can be connected on opposite sides of the electronic component assembly without having to perform the labor intensive connection of circuits through the use of discrete wires or printed flexes.

Abstract: The present invention is directed to an electronic component assembly which cost effectively eliminates capacitive coupling while providing significant heat transfer. Exemplary embodiments ensure that the circuit ground of electrical circuits on printed wiring boards and the chassis ground remain separate so that undesired ground loops are not created and so that a Faraday shield or "cage" can be established around all circuit elements to reduce EMI effects on the circuit.