Patents by Inventor Gary J. Seminara

Gary J. Seminara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10151026
    Abstract: The disclosure describes in some examples a technique that includes the disclosure describes a technique that includes depositing a carbon powder and a resin powder on a surface of a fiber preform, where the fiber preform includes a plurality of fibers and defines interstitial spaces between the plurality of fibers, and vibrating the fiber preform to allow the carbon powder and the resin powder to infiltrate the interstitial spaces between the plurality of fibers of the fiber preform to form an infiltrated preform.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: December 11, 2018
    Assignee: Honeywell International Inc.
    Inventors: Gary J. Seminara, Richard George Rateick, Jr.
  • Publication number: 20180037988
    Abstract: The disclosure describes in some examples a technique that includes the disclosure describes a technique that includes depositing a carbon powder and a resin powder on a surface of a fiber preform, where the fiber preform includes a plurality of fibers and defines interstitial spaces between the plurality of fibers, and vibrating the fiber preform to allow the carbon powder and the resin powder to infiltrate the interstitial spaces between the plurality of fibers of the fiber preform to form an infiltrated preform.
    Type: Application
    Filed: August 5, 2016
    Publication date: February 8, 2018
    Inventors: Gary J. Seminara, Richard George Rateick, JR.
  • Patent number: 9508486
    Abstract: Embodiments of a high temperature electromagnetic coil assembly are provided, as are embodiments of a method for fabricating such a high temperature electromagnetic coil assembly. In one embodiment, the high temperature electromagnetic coil assembly includes a coiled anodized aluminum wire and an electrically-insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded. The electrically-insulative, high thermal expansion ceramic body has a coefficient of thermal expansion greater than 10 parts per million per degree Celsius and less than the coefficient of thermal expansion of the coiled anodized aluminum wire.
    Type: Grant
    Filed: September 24, 2013
    Date of Patent: November 29, 2016
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: James Piascik, Eric Passman, Reza Oboodi, Robert Franconi, Richard Fox, Gary J. Seminara, Gene Holden, Jacob Harding
  • Publication number: 20150287522
    Abstract: Embodiments of a high temperature electromagnetic coil assembly are provided, as are embodiments of a method for fabricating such a high temperature electromagnetic coil assembly. In one embodiment, the high temperature electromagnetic coil assembly includes a coiled anodized aluminum wire and an electrically-insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded. The electrically-insulative, high thermal expansion ceramic body has a coefficient of thermal expansion greater than 10 parts per million per degree Celsius and less than the coefficient of thermal expansion of the coiled anodized aluminum wire.
    Type: Application
    Filed: September 24, 2013
    Publication date: October 8, 2015
    Inventors: James Piascik, Eric Passman, Reza Oboodi, Robert Franconi, Richard Fox, Gary J. Seminara, Gene Holden, Jacob Harding
  • Patent number: 8572838
    Abstract: Embodiments of a high temperature electromagnetic coil assembly are provided, as are embodiments of a method for fabricating such a high temperature electromagnetic coil assembly. In one embodiment, the method includes the steps of applying a high thermal expansion ceramic coating over an anodized aluminum wire, coiling the coated anodized aluminum wire around a support structure, and curing the high thermal expansion ceramic coating after coiling to produce an electrically insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded.
    Type: Grant
    Filed: March 2, 2011
    Date of Patent: November 5, 2013
    Assignee: Honeywell International Inc.
    Inventors: James Piascik, Eric Passman, Reza Oboodi, Robert Franconi, Richard Fox, Gary J. Seminara, Gene Holden, Jacob Harding
  • Publication number: 20120225784
    Abstract: Embodiments of a high temperature electromagnetic coil assembly are provided, as are embodiments of a method for fabricating such a high temperature electromagnetic coil assembly. In one embodiment, the method includes the steps of applying a high thermal expansion ceramic coating over an anodized aluminum wire, coiling the coated anodized aluminum wire around a support structure, and curing the high thermal expansion ceramic coating after coiling to produce an electrically insulative, high thermal expansion ceramic body in which the coiled anodized aluminum wire is embedded.
    Type: Application
    Filed: March 2, 2011
    Publication date: September 6, 2012
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: James Piascik, Eric Passman, Reza Oboodi, Robert Franconi, Richard Fox, Gary J Seminara, Gene Holden, Jacob Harding
  • Patent number: 5461023
    Abstract: Natural gas is stored in a closed vessel under a pressure of about 1400 to 4500 kPa using a carbon molecular sieve adsorbent having at least 80% of its particle pore volume as micropores having diameters greater than 0.55 nm and less than 0.65 nm, particularly about 0.6 to 0.65 nm. The capacity of such micropores for methane is at least 110 mL methane per mL of carbon (at 300 psig or 2,169 kPa abs.). The deliverable volume of natural gas from a vessel packed with carbon molecular sieve particles is at least 70 times the volume of the vessel. The deliverable volume is optimized by heating a carbonized polymer in the presence of carbon dioxide to increase the pore volume.
    Type: Grant
    Filed: November 23, 1993
    Date of Patent: October 24, 1995
    Assignee: AlliedSignal Inc.
    Inventors: Chin-Hsiung Chang, Gary J. Seminara, Alan E. van Til
  • Patent number: 4820318
    Abstract: Volatile organic compounds such as ketones and fluorocarbons are removed from vapor streams by contacting the vapor stream with a bed of an adsorbent comprising a binderless carbon molecular sieve. The carbon molecular sieves are characterized by their method of manufacture which includes forming a polymer from oxygen-free precursors and carbonizing directly to the finished sieve material in the absence of oxygen.
    Type: Grant
    Filed: December 24, 1987
    Date of Patent: April 11, 1989
    Assignee: Allied-Signal Inc.
    Inventors: Chin-Hsiung Chang, Gary J. Seminara
  • Patent number: 4820681
    Abstract: A method is described for producing hydrophobic carbon molecular sieves. The method does not employ a binder to form or shape previously carbonized materials. Instead, a cross-linked oxygen-free polymer is first produced. Fine particles of this polymer are then pelletized or shaped as by simple extrusion. The extruded pellets are then carbonized in an oxygen-free atmosphere to yield binderless homogeneous particles of similar shape comprised of carbon sieves.
    Type: Grant
    Filed: December 24, 1987
    Date of Patent: April 11, 1989
    Assignee: Allied-Signal Inc.
    Inventors: Chin-Hsiung Chang, Gary J. Seminara