Abstract: The present disclosure is directed to a micromachined rotary actuator constructed of a central portion and an outer portion at least partially surrounding the central portion and separated from the central portion by an in-plane gap. A plurality of arms are each connected at one end to the central portion and at another end to the outer portion so as to span the in-plane gap. The arms are constructed of a plurality of horizontally stacked materials positioned to enable the arms to bend in-plane when heated. Conductors are positioned within the actuator for heating the arms. Because of the rules governing abstracts, this abstract should not be used to construe the claims.

Abstract: Methods of fabricating micromachined devices are disclosed, as are micromachined (MEMS) devices fabricated using such methods. According to one embodiment, the method includes forming a composite thin film layer stack on a substrate such that composite thin film layer stack comprises a plurality of etch-resistant layers, directionally etching a first portion of the composite thin film layer stack selectively masked by a first etch-resistant layer thereof, and directionally etching a first portion of the substrate selectively masked by the first etch-resistant layer. These steps may result in the formation of a composite thin film microstructure.

Abstract: A monolithic integrated 3-axis accelerometer chip includes a single crystal substrate, the substrate including at least one single crystal membrane layer portion. A single sensor microstructure made from the single crystal membrane senses acceleration in each of the three orthogonal directions. At least one electronic circuit can also be disposed on the chip, such as a circuit for driving, detecting, controlling and signal processing.

Abstract: Methods of fabricating micromachined devices are disclosed, as are micromachined (MEMS) devices fabricated using such methods. According to one embodiment, the method includes forming a composite thin film layer stack on a substrate such that composite thin film layer stack comprises a plurality of etch-resistant layers, directionally etching a first portion of the composite thin film layer stack selectively masked by a first etch-resistant layer thereof, and directionally etching a first portion of the substrate selectively masked by the first etch-resistant layer. These steps may result in the formation of a composite thin film microstructure.

Abstract: An infrared (IR) sensitive pixel and an IR imager including the same. According to one embodiment, the pixel includes a substrate assembly having a cavity defined by at least one sidewall and a cantilevered beam connected to the substrate assembly and disposed in the cavity. The cantilevered beam includes a first spring portion and a first capacitor plate portion, wherein the first spring portion includes at least two materials having different coefficients of thermal expansion. The pixel further includes a second capacitor plate portion, such that incident IR radiation causes the first spring portion of the cantilevered beam to move laterally relative to the sidewall, thereby creating a variable capacitance between the first capacitor plate portion of the cantilevered beam and the second capacitor plate portion.

Abstract: A system and method for an endoscopic optical coherence tomography (OCT) system based on a CMOS-MEMS mirror to facilitate lateral light scanning. The laser scanning scope, adapted to the instrument channel of a commercially-available endoscopic sheath, allows for the real-time cross-sectional imaging of living biological tissue via direct endoscopic visual guidance. A conventional rod lens imaging system may be used for the visual guidance. The MEMS mirror is preferably actuated using either or both of a thermal-mechanical or electrostatic actuation system. More than one MEMS micromirror may be used in a single system for 3D imaging.

Abstract: An infrared (IR) sensitive pixel and an IR imager including the same. According to one embodiment, the pixel includes a substrate assembly having a cavity defined by at least one sidewall and a cantilevered beam connected to the substrate assembly and disposed in the cavity. The cantilevered beam includes a first spring portion and a first capacitor plate portion, wherein the first spring portion includes at least two materials having different coefficients of thermal expansion. The pixel further includes a second capacitor plate portion, such that incident IR radiation causes the first spring portion of the cantilevered beam to move laterally relative to the sidewall, thereby creating a variable capacitance between the first capacitor plate portion of the cantilevered beam and the second capacitor plate portion.

Abstract: A method for fabricating a micromachined structure. The method includes forming a circuitry layer having an upper etch-resistant layer on an upper surface of a substrate, directionally etching a portion of the circuitry layer exposed by the upper etch-resistant layer, and directionally etching a portion the substrate exposed by the upper etch-resistant layer with a deep reactive ion etch.

Abstract: The present invention is directed to a process for fabricating a microelectromechanical device from a substrate carrying at least one layer of a non-erodible material laid out to form at least a portion of the microelectromechanical device, at least one layer of an erodible material, and at least one sacrificial layer. The process includes the step of using the layer of non-erodible material as a mask and anistropically etching any of the layer of erodible material not occluded by the layer of non-erodible material. The process also includes the step of isotropically etching the sacrificial layer under at least a beam portion of the microelectromechanical device to free the beam portion of the microelectromechanical device from the substrate.

Abstract: A microelectromechanical device is comprised of a cantilevered beam positioned above, and free to move relative to, a substrate. The beam may carry a plurality of conductors which are insulated from one another. One or more tips is positioned on the beam with each tip being in electrical contact with one of the conductors. A memory device may be constructed by providing an array of such cantilevered beams proximate to a layer of media. Devices for positioning the beam in x and y directions perpendicular to each other and parallel to the layer of media and in a z direction perpendicular to the media are provided. A control circuit generates control signals input to the positioning devices for positioning the tips according to x, y, and z coordinates.