Abstract: In accordance with the present invention, systems and methods for creating a universal bridge controller interface that provides a unified and common set of commands between a host machine and a peripheral machine or robot. The universal bridge controller may simplify the ability to integrate, synchronize, and coordinate the control and operation of various machines. This may be beneficial to companies wishing to implement cost saving automation techniques to a variety of machines built by different manufacturers. The advantage of this approach is that it may allow for a single hardwired link to be created between the machine and the bridge controller allowing for robot integration over a factory network, creating a high level of portability of robots between machine work cells.

Abstract: Systems and methods to facilitate the use of collaborative robots to tend metal fabrication equipment are provided. In one embodiment, a universal mount is provided that can be installed on a pedestal to secure a collaborative robot in a designated location. In various embodiments, the universal mount may provide the ability to move the pedestal that holds the collaborative robot away from a machine access door for redeployment or to allow machine maintenance or part inspection.

Abstract: The present invention relates in general to systems and methods for automating various aspects of defect detection, such as surface anomaly and foreign object and debris detection in workpieces fabricated from metallic or non-metallic materials.

Abstract: An apparatus and method for thermally coupling a heat sink directly to a surface mount heat generating device package in a manner which provides a more efficient thermal path between the heat sink and the device package, and which allows for a simplified assembly process. The heat sink is mounted in direct thermal communication with the heat generating device package which is surface mounted to a printed circuit board or other substrate. The inventive heat sink has a reservoir of thermal preform which allows the heat sink to be secured to a device package at the same time as the device package is being secured to the surface mount substrate, as opposed to doing so in a separate step in the assembly process after the electronic device packages have already been secured to the surface mount substrate. The inventive heat sink thereby simplifies the assembly process by eliminating steps in the manufacturing process and by allowing for the further automation of the assembly process.

Abstract: A heat sink adapted to thermally couple to a surface mounted heat generating electronic device package in a manner which provides an increased thermal path between the heat sink and the electronic device package. The heat sink is typically mounted piggyback on a heat generating electronic device package which is surface mounted to a printed circuit board or other substrate. The heat sink comprises thermal legs which extend from the heat sink body and are thermally coupled to thermal leads of the heat generating electronic device package.