Patents by Inventor Gary L. Estabrook

Gary L. Estabrook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer probe head
    Patent number: 4749942
    Abstract: A wafer probe head has a plate-form support member having a tip region and a mounting region. At least one electrically conductive probe tip is carried by the support member at the tip region. A connector is carried by the support member at a location spaced from the tip region, and the probe tip is electrically connected to the connector. The probe head also has a strain gauge for measuring physical distortion of the support member as a result of the probe tip being pressed against a device under test by virtue of relative movement between the mounting region of the support member and the device under test.
    Type: Grant
    Filed: June 2, 1987
    Date of Patent: June 7, 1988
    Assignee: Tektronix, Inc.
    Inventors: Emmanuel Sang, Gary L. Estabrook