Patents by Inventor Gary L. Tonnies

Gary L. Tonnies has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Telecommunication equipment protector
    Patent number: 5334553
    Abstract: A surge protection device to protect telecommunication equipment coupled to telephone lines is shown having in a first embodiment three cells with each cell having a semiconductor element with a reverse breakdown PN junction mounted on a heat sink. The device includes a lead frame having a first pair of leads formed with a platform raised out of the plane of the remainder of the lead frame to provide suitable clearance relative to the semiconducting elements and each platform has a finger extending downwardly into engagement with a top electrode of a respective semiconducting element and is soldered thereto. A second lead lies in the plane of the lead frame and is soldered to a first heat sink plate mounting two semiconducting elements and another finger extending from one of the platforms is soldered to a second heat sink plate mounting the third semiconducting element. The heat sinks, semiconducting elements and portions of the leads are encapsulated in thermally conductive, electrically insulative epoxy.
    Type: Grant
    Filed: March 11, 1993
    Date of Patent: August 2, 1994
    Assignee: Texas Instruments Incorporated
    Inventors: Pravin N. Popat, Diethard Unterweger, Gennady Baskin, Ronald J. Candelet, Gary L. Tonnies
  • Telecommunication equipment protector
    Patent number: 5327318
    Abstract: A surge protection device to protect telecommunication equipment coupled to telephone lines is shown having in a first embodiment three cells with each cell having a semiconductor element with a reverse breakdown PN junction mounted on a heat sink. The device includes a lead frame having a first pair of leads formed with a platform raised out of the plane of the remainder of the lead frame to provide suitable clearance relative to the semiconducting elements and each platform has a finger extending downwardly into engagement with a top electrode of a respective semiconducting element and is soldered thereto. A second lead lies in the plane of the lead frame and is soldered to a first heat sink plate mounting two semiconducting elements and another finger extending from one of the platforms is soldered to a second heat sink plate mounting the third semiconducting element. The heat sinks, semiconducting elements and portions of the leads are encapsulated in thermally conductive, electrically insulative epoxy.
    Type: Grant
    Filed: December 7, 1992
    Date of Patent: July 5, 1994
    Assignee: Texas Instruments Incorporated
    Inventors: Pravin N. Popat, Diethard Unterweger, Gennady Baskin, Ronald J. Candelet, Gary L. Tonnies