Patents by Inventor Gary Lenn Mayes

Gary Lenn Mayes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • APPARATUS FOR INCREASING HEAT DISSIPATION CAPACITY OF A DIN RAIL MOUNTED ENCLOSURE
    Publication number: 20220007546
    Abstract: A mounting enclosure assembly is configured to mount electronic components onto a DIN rail. The mounting enclosure assembly includes a mounting bracket including a body having at least one elongate slot configured to receive an edge of the electronic component therein. The mounting enclosure assembly further includes a heat sink secured to the mounting bracket. The heat sink includes a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail. The mounting enclosure assembly further includes a thermal bonding material disposed within the slot to secure the electronic component to the body of the mounting bracket within the slot. Other embodiments of the mounting enclosure assembly are further disclosed.
    Type: Application
    Filed: September 20, 2021
    Publication date: January 6, 2022
    Inventors: Jeffrey Scott Williams, Gary Lenn Mayes, Michael James Farrell
  • Apparatus for increasing heat dissipation capacity of a DIN rail mounted enclosure
    Patent number: 11178791
    Abstract: A mounting enclosure assembly is configured to mount electronic components onto a DIN rail. The mounting enclosure assembly includes a mounting bracket including a body having at least one elongate slot configured to receive an edge of the electronic component therein. The mounting enclosure assembly further includes a heat sink secured to the mounting bracket. The heat sink includes a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail. The mounting enclosure assembly further includes a thermal bonding material disposed within the slot to secure the electronic component to the body of the mounting bracket within the slot. Other embodiments of the mounting enclosure assembly are further disclosed.
    Type: Grant
    Filed: December 30, 2013
    Date of Patent: November 16, 2021
    Assignee: SCHNEIDER ELECTRIC USA, INC.
    Inventors: Jeffrey Scott Williams, Gary Lenn Mayes, Michael James Farrell
  • METHOD AND APPARATUS FOR INCREASING HEAT DISSIPATION CAPACITY OF A DIN RAIL MOUNTED ENCLOSURE
    Publication number: 20160330869
    Abstract: A mounting enclosure assembly is configured to mount electronic components onto a DIN rail. The mounting enclosure assembly includes a mounting bracket including a body having at least one elongate slot configured to receive an edge of the electronic component therein. The mounting enclosure assembly further includes a heat sink secured to the mounting bracket. The heat sink includes a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail. The mounting enclosure assembly further includes a thermal bonding material disposed within the slot to secure the electronic component to the body of the mounting bracket within the slot. Other embodiments of the mounting enclosure assembly are further disclosed.
    Type: Application
    Filed: December 30, 2013
    Publication date: November 10, 2016
    Applicant: SCHNEIDER ELECTRIC USA, INC.
    Inventors: Jeffrey Scott Williams, Gary Lenn Mayes, Michael James Farrell