Patents by Inventor Gary Logan

Gary Logan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070087210
    Abstract: A thermal barrier coating with unique properties suitable for high temperature thermal insulation control on a substrate is provided. The coating is thermally sprayed, consisting of three layers: 1) a MCrAIY bond coat (basecoat), 2) an intermediate crack resistant ceramic coating, and 3) a top coat of yttria stabilized zirconia. The three layer coating is deposited, preferably, using an air plasma spray system with suitable macro cracks in the top coat, with an underlying crack resistant layer, to enable the ceramic top coat to have properties suitable for advanced gas turbine thermal barrier coatings.
    Type: Application
    Filed: January 15, 2004
    Publication date: April 19, 2007
    Inventors: Purusottam Sahoo, Shane Richard, Cyril Magda, Gary Logan
  • Patent number: 6937039
    Abstract: A signal probe includes a tip assembly having a first tip for contacting a first signal node, a second tip for contacting a second signal node, and a tip body for positioning the first tip a distance away from the second tip, the distance corresponding to the spacing between the first and second signal nodes. With the tip body, a technician no longer has to couple a wire between one of the signal nodes and a respective tip to probe the electronic device. Thus, the length of the path that a signal travels from the first signal node to the second signal node may be reduced to increase the accuracy of the signal's measurement.
    Type: Grant
    Filed: May 28, 2003
    Date of Patent: August 30, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Andrew Harvey Barr, Gary Logan
  • Publication number: 20040239348
    Abstract: A signal probe includes a tip assembly having a first tip for contacting a first signal node, a second tip for contacting a second signal node, and a tip body for positioning the first tip a distance away from the second tip, the distance corresponding to the spacing between the first and second signal nodes. With the tip body, a technician no longer has to couple a wire between one of the signal nodes and a respective tip to probe the electronic device. Thus, the length of the path that a signal travels from the first signal node to the second signal node may be reduced to increase the accuracy of the signal's measurement.
    Type: Application
    Filed: May 28, 2003
    Publication date: December 2, 2004
    Inventors: Andrew Harvey Barr, Gary Logan