Patents by Inventor Gary M. Barnes

Gary M. Barnes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9635764
    Abstract: An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: April 25, 2017
    Assignee: Intel Corporation
    Inventors: Shipeng Qiu, Shawna Liff, Kayleen L Helms, Joshua D Heppner, Adel Elsherbini, Johanna Swan, Gary M. Barnes
  • Publication number: 20170094799
    Abstract: An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 30, 2017
    Inventors: Shipeng Qiu, Shawna Liff, Kayleen L. Helms, Joshua D. Heppner, Adel Elsherbini, Johanna Swan, Gary M. Barnes
  • Patent number: 6954272
    Abstract: A transparent plate with fiducials for aligning and placing of dies on a panel with a high degree of accuracy is disclosed. The locations of the fiducials correspond to desired die locations. The transparent plate is arranged beneath the panel, with the fiducials aligned with cavities formed in the panel. The cavities have transparent bottoms. A die alignment mark on a die residing over the panel is used to establish the position of the die. Imaging a fiducial associated with a cavity is used to center the die with respect to the cavity. Accurate placement of the fiducials is accomplished by electron-beam lithography.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: October 11, 2005
    Assignee: Intel Corporation
    Inventors: Michelle T. Lam, Nathan C. McDaniel, Gary M. Barnes, Rene Cruz
  • Publication number: 20030133116
    Abstract: A transparent plate with fiducials for aligning and placing of dies on a panel with a high degree of accuracy is disclosed. The locations of the fiducials correspond to desired die locations. The transparent plate is arranged beneath the panel, with the fiducials aligned with cavities formed in the panel. The cavities have transparent bottoms. A die alignment mark on a die residing over the panel is used to establish the position of the die. Imaging a fiducial associated with a cavity is used to center the die with respect to the cavity. Accurate placement of the fiducials is accomplished by electron-beam lithography.
    Type: Application
    Filed: January 16, 2002
    Publication date: July 17, 2003
    Applicant: Intel Corporation
    Inventors: Michelle T. Lam, Nathan C. McDaniel, Gary M. Barnes, Rene Cruz
  • Patent number: 5388759
    Abstract: The signal device, secured to the door of a rural mailbox, shows that mail has been received. The device operates by opening a shutter to display the message, "MAIL," when the mail carrier opens the mailbox door. It operates by gravity and latches magnetically. The shutter opens as a venetian blind when the weighted screen falls forward. The signal device is reset by pushing the reset tab. The device returns to the closed position by gravity. In the closed position the message, "NO MAIL," printed on the shutter, is displayed. Moving parts are contained in a weather-proof box with a transparent window. The messages, "MAIL," or "NO MAIL" are visible through the transparent window.
    Type: Grant
    Filed: February 2, 1993
    Date of Patent: February 14, 1995
    Inventor: Gary M. Barnes