Patents by Inventor Gary M. Lawrence

Gary M. Lawrence has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8574483
    Abstract: A method of deforming a component includes the step of forming the component from thermosetting, elastomeric microcellular polyurethane. The method further includes the step of heating at least a first portion of the component to a first temperature. The method further includes the step of compressing the first portion of the component while maintaining the first portion at the first temperature and while maintaining the second portion of the component at an undeformable state. The method of deforming the component shapes the first portion of the component. Preferably the method shapes the first portion of the component into a thin and/or complexly shape. The method of deforming the component also increases the first portion of the component relative to the second portion of the component, i.e. to densifying the component such that the component has varying density.
    Type: Grant
    Filed: July 17, 2006
    Date of Patent: November 5, 2013
    Assignee: BASF Corporation
    Inventors: Daniel G. Dickson, Gary M. Lawrence
  • Publication number: 20080132591
    Abstract: A method of producing a thermoplastic polyurethane (TPU) compound including a polyurethane powder comprising microcellular polyurethane (MCU). The method minimizes discarding scrap MCU, reduces the cost of TPU articles by introducing a partial replacement for the TPU resin, and reduces injection-molding times to produce TPU articles. The TPU compound including polyurethane powder has superior melt temperature and compression set properties as compared to TPU compounds of similar Shore hardness that are free of the polyurethane powder. The invention also provides a TPU article including the TPU compound and a method of recycling a MCU foam.
    Type: Application
    Filed: December 1, 2006
    Publication date: June 5, 2008
    Inventors: Gary M. Lawrence, Stephane Morin, Rabeh Elleithy, Anand G. Huprikar, Terry M. Kowalski, Heiner Wiecher
  • Publication number: 20080012178
    Abstract: A method of deforming a component includes the step of forming the component from thermosetting, elastomeric microcellular polyurethane. The method further includes the step of heating at least a first portion of the component to a first temperature. The method further includes the step of compressing the first portion of the component while maintaining the first portion at the first temperature and while maintaining the second portion of the component at an undeformable state. The method of deforming the component shapes the first portion of the component. Preferably the method shapes the first portion of the component into a thin and/or complexly shape. The method of deforming the component also increases the first portion of the component relative to the second portion of the component, i.e. to densifying the component such that the component has varying density.
    Type: Application
    Filed: July 17, 2006
    Publication date: January 17, 2008
    Inventors: Daniel G. Dickson, Gary M. Lawrence