Abstract: A modular payload structure providing standardized thermal, electrical and mechanical interfaces. The modular arrangement of the present invention has fixed radiator panels that have standard thermal and mechanical interfaces, allowing communication modules to "plug in" directly to the payload structure. In the case of high thermo-energy dissipating modules, heat pipes on the modules connect to the thermal interfaces and move energy from the modules to the thermal interfaces of the radiator panel.

Abstract: Device and method for minimizing radiator area required for heat dissipation on a satellite. The device includes radiator panels with heat pipes embedded throughout. The embedded heat pipes have flanges that protrude from the plane of the surface of the radiator panel. Units, such as amplifiers and RF filters, are mounted on L shaped heat pipes. The unit heat pipes are mounted on the flanges of the embedded heat pipes. The unit heat pipes are thermally linked to the same area of the radiator panel, thereby minimizing radiator area necessary for heat dissipation.