Abstract: Presented herein are stud bump bonding techniques for electrically connecting an elongate conductor, such as a wire or pin, to a bonding pad. A plurality of stud bumps are bonded to a surface of a bonding pad and an elongate electrical conductor is positioned in proximity to the plurality of stud bumps. The elongate conductor is bonded to one or more of the stud bumps.

Abstract: Presented herein are stud bump bonding techniques for electrically connecting an elongate conductor, such as a wire or pin, to a bonding pad. A plurality of stud bumps are bonded to a surface of a bonding pad and an elongate electrical conductor is positioned in proximity to the plurality of stud bumps. The elongate conductor is bonded to one or more of the stud bumps.

Abstract: Medical device implants for stimulating the nervous system of a recipient are disclosed. Embodiments include a cochlear implant with electrodes for delivering charge to the cochlea of the recipient and stimulation circuitry for delivering the charge to the electrodes. The medical devices include a transfer line which carries power and/or communication signals, the transfer line being in contact with tissue of the recipient when the medical device implant is implanted. A leakage capture conductor and/or sensing electrode is located or locatable proximate the insulated conductor.