Abstract: The invention is directed to polyimide based materials having improved electrical and mechanical performance, and also to a process of making such materials. The compositions of the invention comprise: i. a polyimide base polymer in an amount of at least 60 weight percent; ii. a discontinuous phase of inorganic material present in an amount of at least 4 weight percent; iii. a non-ionic halogenated dispersing agent in an amount of at least 0.1 weight percent; and iv. up to 30 weight percent of other optional ingredients, such as, fillers, processing aids, colorants, or the like. The compositions of the invention generally exhibit excellent high frequency performance and can be manufactured by incorporating the dispersing agent and inorganic material into a polyamic acid solution and then converting the polyamic acid solution into a polyimide by conventional or non-conventional means.

Abstract: The invention is directed to polyimide based materials having improved electrical and mechanical performance, and also to a process of making such materials. The compositions of the invention comprise: i. a polyimide base polymer in an amount of at least 60 weight percent; ii. a discontinuous phase of inorganic material present in an amount of at least 4 weight percent; iii. a non-ionic halogenated dispersing agent in an amount of at least 0.1 weight percent; and iv. up to 30 weight percent of other optional ingredients, such as, fillers, processing aids, colorants, or the like. The compositions of the invention generally exhibit excellent high frequency performance and can be manufactured by incorporating the dispersing agent and inorganic material into a polyamic acid solution and then converting the polyamic acid solution into a polyimide by conventional or non-conventional means.

Abstract: The present invention is a polymeric composite comprising a polyimide component and a fluoropolymer component derived from a micro powder. The fluoropolymer micro powder has a melt point between 250 and 375° C. The fluoropolymer micro powder has an average particle size between 20 and 5000 nanometers (5.0 microns). The polyimide component and the fluoropolymer component are inter-mixed at a high dispersion level where the fluoropolymer component is present in a weight ratio from 10 to 60 percent. The polymeric composite of these two components is particularly useful in the form of a thin film used in high-speed digital circuitry or high signal integrity for low loss of a digital signal. The film can also be used as a wire wrap, or as a coverlay or base film substrate for flexible circuitry laminates.

Abstract: The present invention is a polymeric composite comprising a polyimide component and a fluoropolymer component derived from a micro powder. The fluoropolymer micro powder has a melt point between 250 and 375° C. The fluoropolymer micro powder has an average particle size between 20 and 5000 nanometers (5.0 microns). The polyimide component and the fluoropolymer component are inter-mixed at a high dispersion level where the fluoropolymer component is present in a weight ratio from 10 to 60 percent. The polymeric composite of these two components is particularly useful in the form of a thin film used in high-speed digital circuitry or high signal integrity for low loss of a digital signal. The film can also be used as a wire wrap, or as a coverlay or base film substrate for flexible circuitry laminates.

Abstract: A flexible, high dielectric constant polyimide film composed of either a single layer of an adhesive thermoplastic polyimide film or a multilayer polyimide film having adhesive thermoplastic polyimide film layers bonded to one or both sides of the film and having dispersed in at least one of the polyimide layers from 4 to 85 weight % of a ferroelectric ceramic filler, such as barium titanate or polyimide coated barium titanate, and having a dielectric constant of from 4 to 60. The high dielectric constant polyimide film can be used in electronic circuitry and electronic components such as multilayer printed circuits, flexible circuits, semiconductor packaging and buried film capacitors.

Abstract: A flexible, high dielectric constant polyimide film composed of either a single layer of an adhesive thermoplastic polyimide film or a multilayer polyimide film having adhesive thermoplastic polyimide film layers bonded to one or both sides of the film and having dispersed in at least one of the polyimide layers from 4 to 85 weight % of a ferroelectric ceramic filler, such as barium titante or polyimide coated barium titanate, and having a dielectric constant of from 4 to 60. The high dielectric constant polyimide film can be used in electronic circuitry and electronic components such as multilayer printed circuits, flexible circuits, semiconductor packaging and buried film capacitors.