Patents by Inventor Gary Monetti

Gary Monetti has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming a surface acoustic wave (SAW) filter device
    Patent number: 7213314
    Abstract: A SAW filter includes a piezoelectric substrate of Lithium Niobate or optionally Lithium Tantalate having a thickness of at least twice an acoustic wavelength. The piezoelectric substrate is bonded to a surrogate substrate of a silicon material. The surrogate substrate is characterized by a resisitivity of at least 100 ohm-cm and an expansion coefficient compatible with the piezoelectric substrate. A catalytic bonding film between the piezoelectric substrate and the surrogate substrate is formed from a first catalytic bonding film deposited onto a surface of the piezoelectric substrate and a second catalytic bonding film deposited onto a surface of the surrogate substrate. The piezoelectric substrate is bonded to the surrogate substrate through a compression force sufficient for providing a bonding at a normal temperature.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: May 8, 2007
    Assignee: Triquint, Inc.
    Inventors: Benjamin P. Abbott, Svetlana Malocha, Jack Chocola, Gary Monetti, Joshua M. Zepess
  • SAW Filter Device and Method Employing Normal Temperature Bonding for Producing Desirable Filter Production and Performance Characteristics
    Publication number: 20070028433
    Abstract: A SAW filter includes a piezoelectric substrate of Lithium Niobate or optionally Lithium Tantalate having a thickness of at least twice an acoustic wavelength. The piezoelectric substrate is bonded to a surrogate substrate of a silicon material. The surrogate substrate is characterized by a resisitivity of at least 100 ohm-cm and an expansion coefficient compatible with the piezoelectric substrate. A catalytic bonding film between the piezoelectric substrate and the surrogate substrate is formed from a first catalytic bonding film deposited onto a surface of the piezoelectric substrate and a second catalytic bonding film deposited onto a surface of the surrogate substrate. The piezoelectric substrate is bonded to the surrogate substrate through a compression force sufficient for providing a bonding at a normal temperature.
    Type: Application
    Filed: July 6, 2006
    Publication date: February 8, 2007
    Inventors: Benjamin Abbott, Svetlana Malocha, Jack Chocola, Gary Monetti, Joshua Zepess
  • Saw filter device and method employing normal temperature bonding for producing desirable filter production and performance characteristics
    Patent number: 7105980
    Abstract: A SAW filter includes a piezoelectric substrate of Lithium Niobate or optionally Lithium Tantalate having a thickness of at least twice an acoustic wavelength. The piezoelectric substrate is bonded to a surrogate substrate of a silicon material. The surrogate substrate is characterized by a resisitivity of at least 100 ohm-cm and an expansion coefficient compatible with the piezoelectric substrate. A catalytic bonding film between the piezoelectric substrate and the surrogate substrate is formed from a first catalytic bonding film deposited onto a surface of the piezoelectric substrate and a second catalytic bonding film deposited onto a surface of the surrogate substrate. The piezoelectric substrate is bonded to the surrogate substrate through a compression force sufficient for providing a bonding at a normal temperature.
    Type: Grant
    Filed: June 4, 2003
    Date of Patent: September 12, 2006
    Assignee: Sawtek, Inc.
    Inventors: Benjamin P. Abbott, Svetlana Malocha, Jack Chocola, Gary Monetti, Josh Zepress
  • Saw filter device and method employing normal temperature bonding for producing desirable filter production and performance characteristics
    Publication number: 20040036381
    Abstract: A SAW filter includes a piezoelectric substrate of Lithium Niobate or optionally Lithium Tantalate having a thickness of at least twice an acoustic wavelength. The piezoelectric substrate is bonded to a surrogate substrate of a silicon material. The surrogate substrate is characterized by a resisitivity of at least 100 ohm-cm and an expansion coefficient compatible with the piezoelectric substrate. A catalytic bonding film between the piezoelectric substrate and the surrogate substrate is formed from a first catalytic bonding film deposited onto a surface of the piezoelectric substrate and a second catalytic bonding film deposited onto a surface of the surrogate substrate. The piezoelectric substrate is bonded to the surrogate substrate through a compression force sufficient for providing a bonding at a normal temperature.
    Type: Application
    Filed: June 4, 2003
    Publication date: February 26, 2004
    Inventors: Benjamin P. Abbott, Svetlana Malocha, Jack Chocola, Gary Monetti, Josh Zepess