Patents by Inventor Gary Moskovitz

Gary Moskovitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optically enabled hybrid semiconductor package
    Patent number: 7200295
    Abstract: The present invention provides a self-contained optical hybrid IC (OHIC) package for optical side-coupling to an optical waveguide of a printed wiring board (PWB). The OHIC package comprises an integrated circuit (IC) package. It also comprises a self-contained optical subassembly (OSA) having an optical coupling facet and being adapted to be bonded to the integrated circuit (IC) package, wherein the OSA comprises an optoelectronic device and an optical channel, the optoelectronic device being optically coupled to the optical channel, the optical channel relaying light between the optoelectronic device and the optical coupling facet, wherein the OSA is mechanically and electrically bonded to the IC package to thereby provide an electrical coupling between the optoelectronic device and the IC package and enable the optical side-coupling to the optical waveguide via the optical coupling facet. The invention also provides a method for creating the OHIC package.
    Type: Grant
    Filed: December 7, 2004
    Date of Patent: April 3, 2007
    Assignee: Reflex Photonics, Inc.
    Inventors: David R. Rolston, Tomasz Maj, Richard Mainardi, Shao-Wei Fu, Gary Moskovitz
  • Optically enabled hybrid semiconductor package
    Publication number: 20060120660
    Abstract: The present invention provides a self-contained optical hybrid IC (OHIC) package for optical side-coupling to an optical waveguide of a printed wiring board (PWB). The OHIC package comprises an integrated circuit (IC) package. It also comprises a self-contained optical subassembly (OSA) having an optical coupling facet and being adapted to be bonded to the integrated circuit (IC) package, wherein the OSA comprises an optoelectronic device and an optical channel, the optoelectronic device being optically coupled to the optical channel, the optical channel relaying light between the optoelectronic device and the optical coupling facet, wherein the OSA is mechanically and electrically bonded to the IC package to thereby provide an electrical coupling between the optoelectronic device and the IC package and enable the optical side-coupling to the optical waveguide via the optical coupling facet. The invention also provides a method for creating the OHIC package.
    Type: Application
    Filed: December 7, 2004
    Publication date: June 8, 2006
    Inventors: David Rolston, Tomasz Maj, Richard Mainardi, Shao-Wei Fu, Gary Moskovitz