Patents by Inventor Gary Mulcahy
Gary Mulcahy has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11751363Abstract: A power module and method of forming the same. The power module includes an extruded tube with internal and external fins, first and second opposing surfaces defining ends thereof, and an internal slot for housing a power converter. The power module includes a bottom plate having a first depression to receive a first O-ring to provide a first liquid-tight fluid seal at the first opposing surface for an electrically insulting oil encapsulating the power converter. The power module includes a cable interface plate having a second depression to receive a second O-ring to provide a second liquid-type fluid seal at the second opposing surface for the electrically insulting oil encapsulating the power converter. The power module includes an end cap to mate with the cable interface plate and accept a conduit fitting to enable an electrical cable to be routed from within the end cap to an external connection point.Type: GrantFiled: December 13, 2021Date of Patent: September 5, 2023Assignee: Astrodyne TDIInventors: Gary Mulcahy, Matthew Joseph Fuhrmann, Tunc Icoz
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Publication number: 20220174838Abstract: A power module and method of forming the same. The power module includes an extruded tube with internal and external fins, first and second opposing surfaces defining ends thereof, and an internal slot for housing a power converter. The power module includes a bottom plate having a first depression to receive a first O-ring to provide a first liquid-tight fluid seal at the first opposing surface for an electrically insulting oil encapsulating the power converter. The power module includes a cable interface plate having a second depression to receive a second O-ring to provide a second liquid-type fluid seal at the second opposing surface for the electrically insulting oil encapsulating the power converter. The power module includes an end cap to mate with the cable interface plate and accept a conduit fitting to enable an electrical cable to be routed from within the end cap to an external connection point.Type: ApplicationFiled: December 13, 2021Publication date: June 2, 2022Applicant: Astrodyne TDIInventors: Gary Mulcahy, Matthew Joseph Fuhrmann, Tunc Icoz
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Patent number: 11202395Abstract: A power module and method of forming the same. The power module includes an extruded tube with internal and external fins, first and second opposing surfaces defining ends thereof, and an internal slot for housing a power converter. The power module includes a bottom plate having a first depression to receive a first O-ring to provide a first liquid-tight fluid seal at the first opposing surface for an electrically insulting oil encapsulating the power converter. The power module includes a cable interface plate having a second depression to receive a second O-ring to provide a second liquid-type fluid seal at the second opposing surface for the electrically insulting oil encapsulating the power converter. The power module includes an end cap to mate with the cable interface plate and accept a conduit fitting to enable an electrical cable to be routed from within the end cap to an external connection point.Type: GrantFiled: November 6, 2020Date of Patent: December 14, 2021Assignee: Astrodyne TDIInventors: Gary Mulcahy, Matthew Joseph Fuhrmann, Tunc Icoz
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Patent number: 9516794Abstract: A scalable liquid cooled power system using a number of modularized, hot-plug, hot-swap, and scalable liquid-cooled power conversion modules mounted on mating mounting assemblies. A modularized, scalable liquid coolant manifolds and liquid cooling management system provides coolant circulation through the power conversion modules. The system optionally includes a highly scalable system control and administration system, and optionally provides the facility for on-board liquid-to-air heat exchanger system, or off-board cooling using an external heat exchanger system.Type: GrantFiled: October 30, 2015Date of Patent: December 6, 2016Assignee: Transistor Devices, Inc.Inventors: Gary Mulcahy, Tunc Icoz
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Patent number: 9353446Abstract: In some embodiments, an ICCP system includes an AC-DC rectifier receiving AC power from an AC power source and providing a DC output having a constant voltage or a constant current, a cathode connection electrically coupling the AC-DC rectifier to a structure to be protected by the ICCP system, current-emitting anodes arranged in parallel and receiving the DC output from the AC-DC rectifier, and a controller communicating with the AC-DC rectifier to set a maximum value for the constant voltage or constant current of the DC output. In other embodiments, an ICCP system includes a converter assembly including an AC-DC rectifier and a rectifier chassis enclosing and environmentally sealing the AC-DC rectifier. The ICCP system also includes an environmentally-sealed controller communicating with the AC-DC rectifier and an environmentally-protected Input-Output connection assembly.Type: GrantFiled: April 29, 2014Date of Patent: May 31, 2016Assignee: Transistor Devices, Inc.Inventors: Gary Mulcahy, John Santini
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Publication number: 20160128239Abstract: A scalable liquid cooled power system using a number of modularized, hot-plug, hot-swap, and scalable liquid-cooled power conversion modules mounted on mating mounting assemblies. A modularized, scalable liquid coolant manifolds and liquid cooling management system provides coolant circulation through the power conversion modules. The system optionally includes a highly scalable system control and administration system, and optionally provides the facility for on-board liquid-to-air heat exchanger system, or off-board cooling using an external heat exchanger system.Type: ApplicationFiled: October 30, 2015Publication date: May 5, 2016Inventors: Gary Mulcahy, Tunc Icoz
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Patent number: 9295185Abstract: A functional heat exchanger structure provides a hermetic seal for the power electronics. The heat exchanger includes one or more features built into the design. The features include a closed loop liquid circuit, air, or extended surfaces built-in to the design to transfer heat from the heat generating devices, spring clips snapped in built-in slots to mount heat-generating devices, preformed threaded rails to mount the printed circuit board (PCB), electrical isolation between the heat sink/cold plate and the electrical components, a sealed enclosure to provide environmental protection for the electronic components, a mounting feature to mount the sealed enclosure onto an external surface, an opening to accept a snap-in style cover, a stackable design, and an easily manifoldable configuration.Type: GrantFiled: March 12, 2014Date of Patent: March 22, 2016Assignee: Transistor Devices, Inc.Inventors: Tunc Icoz, John Santini, Gary Mulcahy, James Feely
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Publication number: 20150229148Abstract: A blind-mate power charging station includes a receptacle, a base, and electrical circuitry. The receptacle includes a receptacle housing, an inner housing, and electrical contacts. The receptacle housing includes a pair of outer extensions, each outer extension tapering toward an outer extension tip. The inner housing is held within the receptacle housing and includes inner extensions forming parallel slots between pairs of inner extensions. Each electrical contact is held in one of the parallel slots by a pair of the inner extensions. The base receives the receptacle and mounts the receptacle to a stationary surface. The electrical circuitry couples the electrical contacts to an electricity source. The receptacle is shaped to receive a plug including a plug head and at least two prongs. Each prong engages one of the electrical contacts such that the receptacle provides electricity to the plug.Type: ApplicationFiled: February 10, 2015Publication date: August 13, 2015Inventors: Tunc Icoz, Jessica Dennis, Manuel Lavin, James Feely, Gary Mulcahy, John Santini, Ronald Hamaoui, Robert Scholl, Matthew Fuhrmann
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Patent number: 9077239Abstract: A circuit for connecting lower AC voltage-rated AC-DC power supplies with higher voltage power sources. A power line matching transformer connecting the source to the power supplies needs only to support the self-dissipation and output current mismatch between supplies. The circuit can also protect the line matching transformer from overheating in various fault scenarios.Type: GrantFiled: March 8, 2013Date of Patent: July 7, 2015Assignee: Transistor Devices, Inc.Inventors: John Santini, Thomas A. Hansen, Gary Mulcahy
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Publication number: 20140352149Abstract: A liquid-cooled heat exchanger for electronic assemblies and a method of making the heat exchanger. The exchanger has a solid metal body in the form of an elongated flat plate to which the electronic assembly can be mounted, or a number of such plates formed in an L- or U-shaped configuration to enclose two or more sides of the assembly. The elongated body is formed by extrusion, with parallel enclosed longitudinal passages formed along a length of the body during the extrusion process. Transverse passages are drilled to intersect the extruded longitudinal passages. The longitudinal passages and transverse passages are plugged on at least one of their outside ends, and optionally at points along their lengths, to create desired patterns of liquid flow through the heat exchanger.Type: ApplicationFiled: July 11, 2014Publication date: December 4, 2014Inventors: John Santini, Ronald Tallman, Gary Mulcahy
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Publication number: 20140325245Abstract: A system providing an optimized power delivery and management of USB power in a closed network, such as found on commercial aircraft. The system enables utilization of a limited number of AC-DC step down and isolation converters to support a multitude of USB power outlets. It provides a means of accounting for, and overcoming wire distribution losses, while also providing for voltages and power levels compatible with the USB Power Delivery Specification.Type: ApplicationFiled: April 29, 2014Publication date: October 30, 2014Applicant: Transistor Devices, Inc. d/b/a TDI PowerInventors: John Santini, Gary Mulcahy
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Publication number: 20140318984Abstract: In some embodiments, an ICCP system includes an AC-DC rectifier receiving AC power from an AC power source and providing a DC output having a constant voltage or a constant current, a cathode connection electrically coupling the AC-DC rectifier to a structure to be protected by the ICCP system, current-emitting anodes arranged in parallel and receiving the DC output from the AC-DC rectifier, and a controller communicating with the AC-DC rectifier to set a maximum value for the constant voltage or constant current of the DC output. In other embodiments, an ICCP system includes a converter assembly including an AC-DC rectifier and a rectifier chassis enclosing and environmentally sealing the AC-DC rectifier. The ICCP system also includes an environmentally-sealed controller communicating with the AC-DC rectifier and an environmentally-protected Input-Output connection assembly.Type: ApplicationFiled: April 29, 2014Publication date: October 30, 2014Applicant: Transistor Devices, Inc. d/b/a TDI PowerInventors: Gary Mulcahy, John Santini
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Publication number: 20140262150Abstract: A functional heat exchanger structure provides a hermetic seal for the power electronics. The heat exchanger includes one or more features built into the design. The features include a closed loop liquid circuit, air, or extended surfaces built-in to the design to transfer heat from the heat generating devices, spring clips snapped in built-in slots to mount heat-generating devices, preformed threaded rails to mount the printed circuit board (PCB), electrical isolation between the heat sink/cold plate and the electrical components, a sealed enclosure to provide environmental protection for the electronic components, a mounting feature to mount the sealed enclosure onto an external surface, an opening to accept a snap-in style cover, a stackable design, and an easily manifoldable configuration.Type: ApplicationFiled: March 12, 2014Publication date: September 18, 2014Applicant: Transistor Devices, Inc. d/b/a TDI PowerInventors: Tunc Icoz, John Santini, Gary Mulcahy, James Feely
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Publication number: 20140254218Abstract: A circuit for connecting lower AC voltage-rated AC-DC power supplies with higher voltage power sources. A power line matching transformer connecting the source to the power supplies needs only to support the self-dissipation and output current mismatch between supplies. The circuit can also protect the line matching transformer from overheating in various fault scenarios.Type: ApplicationFiled: March 8, 2013Publication date: September 11, 2014Applicant: TRANSISTOR DEVICES, INC. D/B/A TDI POWERInventors: John Santini, Thomas A. Hansen, Gary Mulcahy
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Publication number: 20130241284Abstract: A power management system for distributed power management from a power source to a plurality of power units, using a monitor bus to monitor total power usage on a branch to which the power unit is assigned, allowing power to be delivered if it won't result in a maximum current draw from the power source being exceeded, and denying access if it would. Each power unit adds a signal to the monitor bus proportional to the current it is drawing from the power source.Type: ApplicationFiled: March 7, 2013Publication date: September 19, 2013Applicant: Transistor Devices, Inc. . d/b/a TDI PowerInventors: John Santini, Lazar Rozenblat, Ronald DeLuca, Gary Mulcahy
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Patent number: 8320142Abstract: Embodiments of the present invention relate to a low-output voltage converter, delivering voltage power less than 1 VDC, utilizing distributed secondary circuits. In one embodiment of the present invention, there is provided a voltage converter comprises a primary circuit for receiving an input voltage, comprising a plurality of primary windings arranged in series, a plurality of secondary circuits, each comprising a secondary winding for aligning with a primary winding to form a transformer, and each of the secondary circuits arranged in parallel, and an output for providing an output voltage down to, or less than 1 VDC.Type: GrantFiled: March 1, 2010Date of Patent: November 27, 2012Assignee: Transistor Devices, Inc.Inventors: Gary Mulcahy, John Santini, Joseph Mancuso
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Publication number: 20120138281Abstract: A liquid-cooled heat exchanger for electronic assemblies and a method of making the heat exchanger. The exchanger has a solid metal body in the form of an elongated flat plate to which the electronic assembly can be mounted, or a number of such plates formed in an L- or U-shaped configuration to enclose two or more sides of the assembly. The elongated body is formed by extrusion, with parallel enclosed longitudinal passages formed along a length of the body during the extrusion process. Transverse passages are drilled to intersect the extruded longitudinal passages. The longitudinal passages and transverse passages are plugged on at least one of their outside ends, and optionally at points along their lengths, to create desired patterns of liquid flow through the heat exchanger.Type: ApplicationFiled: September 22, 2011Publication date: June 7, 2012Applicant: TRANSISTOR DEVICES, INC. D/B/A TDI POWERInventors: John Santini, Ronald Tallman, Gary Mulcahy
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Publication number: 20110211369Abstract: Embodiments of the present invention relate to a low-output voltage converter, delivering voltage power less than 1 VDC, utilizing distributed secondary circuits. In one embodiment of the present invention, there is provided a voltage converter comprises a primary circuit for receiving an input voltage, comprising a plurality of primary windings arranged in series, a plurality of secondary circuits, each comprising a secondary winding for aligning with a primary winding to form a transformer, and each of the secondary circuits arranged in parallel, and an output for providing an output voltage down to, or less than 1 VDC.Type: ApplicationFiled: March 1, 2010Publication date: September 1, 2011Applicant: Transistor Devices, Inc.Inventors: Gary Mulcahy, John Santini, Joseph Mancuso